Near ultraviolet (λ ≈ 400 nm) femtosecond laser annealing (400 nm-FLA) in a scanning mode was employed to crystallize amorphous silicon (a-Si) films at room temperature. The average grain size of polycrystalline silicon annealed was studied as a function of the incident laser fluence and beam overlap or the number of laser shots irradiated. In general, the grain size can be enlarged by either increasing the beam overlap at a fixed laser fluence or increasing the laser fluence for a fixed number of laser shots. An apparent threshold for the onset of rapid enlargement of grain size was observed for processing at ∼90% overlap and fluences above 25 mJ/cm2. A maximum grain size of ∼280 nm was attained at a laser fluence of 30 mJ/cm2 and overlap of 93.75%, beyond which the grain size attained was smaller, and eventually, ablation was observed at an overlap of 97.5% and higher. These trends and observed surface morphology of annealed samples suggest that the crystallization mechanism is like sequential lateral solidification, similar to 800 nm-FLA and excimer laser annealing. Raman spectroscopic studies show that the degree of crystallization achieved with 400 nm-FLA is even higher than that of 800 nm-FLA. Cross-sectional scanning electron microscopic images indicate that the 100 nm-thick a-Si film is not fully crystallized. This can be explained by the much shorter penetration depth of 400 nm light than that of 800 nm light in a-Si.
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