专

一种高温氯化物熔盐腐蚀环境下金属材料的保护方法

110200117682W

发明人

朱明, 易兴月, 黄鹏飞, 来兴平, 张慧慧, 严海通, 冉梦园

受让人

UNIV XIAN SCI & TECHNOLOGY (UYXS-C)

申请人

KNU-INDUSTRY COOPERATION FOUNDATION

申请号

173924

申请日

2007-12-13

公开(公告)号

110200117682W

公开(公告)日

2021-06-24

IPC分类号

B32B027/12B32B027/14B32B027/32

CPC分类号

优先权号

1020190025606

优先权日

2019-03-05

摘要

NOVELTY - Provided is a photosensitive resin composition for color filter, which has excellent heat-resistance and chemical resistance, and can generate suitable photopolymerization and form pattern suitable for color filter.

DETAILED DESCRIPTION - The composition comprises:

(i) 1-40 wt% of binder resin obtained by copolymerizing monomers of formulae 1 to 3(wherein the formula 3 is CH2=CR2COOH) with a molecular ratio of 1:2-4:2-8, and treating the copolymer with acid anhydride of formula 4;

(ii) 1-20 wt% of photopolymerizable acrylated monomer treated with the acid anhydride of formula 4;

(iii) 0.1-10 wt% of photopolymerization initiator;

(iv) 0.1-20 wt% of epoxide of formula 5 treated with the acid anhydride of formula 4;

(v) 0.1-40 wt% of pigment;

(vi) 20-90 wt% of solvent; and

(vii) 0.005-5 wt% of surfactant.

In the formulae, each of R1 and R2 represents an alkyl group or aryl group having C1-C10, an ethoxy group, phenyl group or benzyl group having C1-C8, X represents a halogen atom, each of R3 and R4 represents hydrogen atom, an alkyl group or aryl group having C1-C10, an ethoxy group, phenyl group or benzyl group having C1-C8, A represents formula 5a, each of R5 and R6 is an alkyl group having C1-C10, m and n are an integer satisfying formula 0at mostn/(m+n)at most4.

权利要求

1. A clock network for an integrated circuit comprising: a first set of lines configured to distribute clock signals to a first section of the integrated circuit; a second set of lines configured to distribute clock signals to a second section of the integrated circuit separately from the first section of the integrated circuit; a third set of lines configured to distribute clock signals to both the first and second sections of the integrated circuit, wherein the third set of lines connects with the second set of lines in the second section of the integrated circuit; at least one line disposed in the first section connected directly to an input/output (I/O) of the integrated circuit, wherein the at least one line is configured to distribute a clock signal received from the I/O to the first section; and at least one line disposed in the second section connected directly to an I/O of the integrated circuit, wherein the at least one line is configured to distribute a clock signal received from the I/O to the second section.

2. The clock network of claim 1 , wherein: the at least one line disposed in the first section is connected to the first and third sets of lines; and the at least one line disposed in the second section is connected to the second and third sets of lines.

3. The clock network of claim 2 , wherein the first and third sets of lines converge at the center of the first section, and wherein the second and third sets of lines converge at the center of the second section.

4. The clock network of claim 3 , wherein the integrated circuit includes a plurality of logic resources, wherein the at least one line in the first section connects to the plurality of logic resources in the first section, and wherein the at least one line in the second section connects to the plurality of logic resources in the second section.

5. The clock network of claim 1 , wherein the integrated circuit includes a plurality of logic resources, and wherein the third set of lines is configured to receive an input-clock signal from at least one logic resource.

6. The clock network of claim 5 , wherein the third set of lines is connected to a sneak path from the at least one logic resource.

7. The clock network of claim 5 , wherein the third set of lines is configured to receive an input-clock signal from a dedicated input-clock pin.

8. The clock network of claim 7 further comprising: at least one differential buffer connected to the dedicated input-clock pin; at least one phase-lock loop connected to the differential buffer; a phase-lock loop output multiplexing block connected to the phase-lock loop; and at least one multiplexer having: a first input connected directly to the dedicated input-clock pin, a second input connected directly to the output of the differential buffer, a third input connected to the output of the phase-lock loop output multiplexing block, and a fourth input connected to a sneak path from the at least one logic resource.

9. A clock network for a programmable logic device (PLD), wherein the PLD includes a first set of logic resources and at least a second set of logic resources, the clock network comprising: a first set of clock lines configured to distribute clock signals to the first set of logic resources separately from the second set of logic resources; a second set of clock lines configured to distribute clock signals to the second set of logic resources separately from the first set of logic resources; a third set of clock lines configured to distribute clock signals to both the first and second sets of logic resources, wherein the third set of clock lines connects with the first set of clock lines, and wherein the third set of clock lines connects with the of clock lines; at least one clock line connected directly to an input/output (I/O) of the PLD and configured to receive an input-clock signal and distribute the input-clock signal to the first set of logic resources; and at least one clock line connected directly to an I/O of the PLD and configured to receive an input-clock signal and distribute the input-clock signal to the second set of logic resources.

10. The clock network of claim 9 , wherein the third set of clock lines receives an input-clock signal from a sneak path of at least one logic resource.

11. The clock network of claim 10 , wherein the third set of clock lines receives an input-clock signal from a dedicated input-clock pin.

12. The clock network of claim 11 , wherein the third set of clock lines is connected to at least one multiplexer having at least one input connected to the dedicated input-clock pin and at least one input connected to the sneak path of logic resource.

13. The clock network of claim 9 further comprising: a first central line that connects to the first and third sets of clock lines and to each logic resource in the first set of logic resources; and a second central line that connects to the second and third sets of clock lines and to each logic resource in the second set of logic resources.

14. The clock network of claim 13 , where the first and second central lines receive input-clock signals from input pins of the PLD that are not dedicated as input-clock pins.

15. A method for distributing clock signals within an integrated circuit using a clock network comprising: distributing clock signals to a first section of the integrated circuit using a first set of lines of the clock network; distributing clock signals to both the first and second sections of the integrated circuit through a third set of lines of the clock network, wherein the third set of lines connects with the first set of lines in the first section of the integrated circuit, and wherein the third set of lines connects with the second set of lines in the second section of the integrated circuit; distributing a clock signal to the first section through at least one line disposed in the first section connected directly to an input-out (I/O) of the integrated circuit; and distributing a clock signal to the second section through at least one line disposed in the second section connected directly to the I/O of the integrated circuit.

16. The method of claim 15 further comprising: receiving input-clock signals from a logic resource on the integrated circuit.

17. The method of claim 15 further comprising: receiving input-clock signals from input pins on the integrated circuit that are not dedicated as input-clock pins.

说明书

[0001]TECHNICAL FIELD

[0002]An aspect of the present disclosure relates to an optical module.

[0003]BACKGROUND ART

[0004]Optical modules in which an interference optical system is formed on a silicon-on-insulator (SOI) substrate by a micro electro mechanical systems (MEMS) technology are known (for example, refer to Patent Literature 1). Such optical modules have attracted attention because they can provide users with a Fourier transform infrared spectroscopic analyzer (FTIR) in which highly accurate optical disposition is realized.

[0005]CITATION LIST

[0006]Patent Literature

[0007]Patent Literature 1: Japanese Unexamined Patent Publication No. 2012-524295

[0008]SUMMARY OF INVENTION

[0009]Technical Problem

[0010]However, the foregoing optical modules have the following problem in respect that the size of a movable mirror depends on a degree of completion of deep cutting with respect to an SOI substrate, for example. That is, since the degree of completion of deep cutting with respect to an SOI substrate is approximately 500 μm at the maximum, there is a limitation in increasing the size of a movable mirror for the sake of improvement of sensitivity of an FTIR. Here, a technology of mounting a separately formed movable mirror in a device layer (for example, a layer of an SOI substrate in which a driving region is formed) may be taken into consideration.

[0011]An object of an aspect of the present disclosure is to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0012]Solution to Problem

[0013]According to an aspect of the present disclosure, there is provided an optical module including a support layer, a device layer which is provided on the support layer, and a movable mirror which is mounted in the device layer. The device layer has a mounting region which is penetrated by the movable mirror, and a driving region which is connected to the mounting region. A space corresponding to at least the mounting region and the driving region is formed between the support layer and the device layer. A portion of the movable mirror is positioned in the space.

[0014]In this optical module, the movable mirror penetrates the mounting region of the device layer, and a portion of the movable mirror is positioned in the space formed between the support layer and the device layer. Accordingly, the movable mirror can be stably and firmly fixed to the mounting region of the device layer. Thus, according to this optical module, it is possible to realize reliable mounting of the movable mirror with respect to the device layer.

[0015]According to the aspect of the present disclosure, the optical module may further include an intermediate layer which is provided between the support layer and the device layer. A first opening may be formed in the intermediate layer. A recess portion or a second opening may be formed in the support layer. The space may include a region inside the first opening and a region inside the recess portion, or a region inside the first opening and a region inside the second opening. The portion of the movable mirror may be positioned in a region inside the recess portion or a region inside the second opening. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer.

[0016]According to the aspect of the present disclosure, in the optical module, the support layer may be a first silicon layer of an SOI substrate. The device layer may be a second silicon layer, of the SOI substrate. The intermediate layer may be an insulating layer of the SOI substrate. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer using the SOI substrate.

[0017]According to the aspect of the present disclosure, in the optical module, a recess portion or an opening may be formed in the support layer. The space may include a region inside the recess portion or a region inside the opening. The portion of the movable mirror may be positioned in a region inside the recess portion or a region inside the opening. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer.

[0018]According to the aspect of the present disclosure, in the optical module, a recess portion may be formed in the device layer. The space may include a region inside the recess portion. The portion of the movable mirror may be positioned in a region inside the recess portion. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer.

[0019]According to the aspect of the present disclosure, in the optical module, a first recess portion may be formed in the device layer. A second recess portion or an opening may be formed in the support layer. The space may include a region inside the first recess portion and a region inside the second recess portion, or a region inside the first recess portion and a region inside the opening. The portion of the movable mirror may be positioned in a region inside the second recess portion or a region inside the opening. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer.

[0020]According to the aspect of the present disclosure, in the optical module, a mirror surface of the movable mirror may be positioned on a side opposite to the support layer with respect to the device layer. Accordingly, it is possible to simplify the configuration of the optical module.

[0021]According to the aspect of the present disclosure, the optical module may further include a fixed mirror which is mounted in at least one of the support layer, the device layer, and the intermediate layer which is provided between the support layer and the device layer; and a beam splitter which is mounted in at least one of the support layer, the device layer, and the intermediate layer. The movable mirror, the fixed mirror, and the beam splitter may be disposed such that an interference optical system is constituted. Accordingly, it is possible to obtain an FTIR having improved sensitivity.

[0022]According to the aspect of the present disclosure, the optical module may further include a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside, and a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside. Accordingly, it is possible to obtain an FTIR including a light incident unit and a light emission unit.

[0023]Advantageous Effects of Invention

[0024]According to the aspect of the present disclosure, it is possible to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0025]BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a plan view of an optical module of an embodiment. FIG. 2 is a cross-sectional view taken along line IIA-IIA illustrated in FIG. 1 . FIG. 3 is a cross-sectional view taken along line IIIA-IIIA illustrated in FIG. 1 . FIG. 4 is a cross-sectional view taken along line IVA-IVA illustrated in FIG. 1 . FIG. 5 is a cross-sectional view taken along line VA-VA illustrated in FIG. 1 . FIG. 6 is a cross-sectional view of a modification example of a surrounding structure of a movable mirror. FIG. 7 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 8 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 9 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 10 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 11 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 12 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 13 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 14 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 15 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 16 is a plan view of an optical module of another embodiment. FIG. 17 is a cross-sectional view taken along line IIB-IIB illustrated in FIG. 16 . FIG. 18 is a cross-sectional view taken along line IIIB-IIIB illustrated in FIG. 16 . FIG. 19( a ) is an enlarged view of a portion in FIG. 17 , and FIG. 19( b ) is a cross-sectional view taken along line IVbB-IVbB illustrated in FIG. 17 . FIG. 20( a ) is a cross-sectional view illustrating a process of mounting a movable mirror, and FIG. 20( b ) is a cross-sectional view taken along line VbB-VbB illustrated in FIG. 20( a ) . FIG. 21( a ) is a cross-sectional view illustrating the process of mounting a movable mirror, and FIG. 21( b ) is a cross-sectional view taken along line VIbB-VIbB illustrated in FIG. 21( a ) . FIG. 22 is a cross-sectional view taken along line VIIB-VIIB illustrated in FIG. 16 . FIG. 23 is a cross-sectional view taken along line VIIIB-VIIIB illustrated in FIG. 16 . FIG. 24 is a cross-sectional view illustrating a modification example of a first opening. FIG. 25 is a cross-sectional view illustrating a modification example of the movable mirror. FIG. 26 is a cross-sectional view taken along line XIB-XIB illustrated in FIG. 25 . FIG. 27 is a plan view of an optical module of still another embodiment. FIG. 28 is a cross-sectional view taken along line IIC-IIC illustrated in FIG. 27 . FIG. 29 is a cross-sectional view taken along line IIIC-IIIC illustrated in FIG. 27 . FIG. 30( a ) is a perspective view of a surrounding structure of a movable mirror illustrated in FIG. 27 , and FIG. 30( b ) is a cross-sectional view taken along line IVbC-IVbC illustrated in FIG. 30( a ) . FIG. 31 is a cross-sectional view taken along line VC-VC illustrated in FIG. 27 . FIG. 32 is a cross-sectional view taken along line VIC-VIC illustrated in FIG. 27 . FIG. 33 is a cross-sectional view of a modification example of the surrounding structure of the movable mirror. FIG. 34 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 35 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 36 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 37 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 38 is a cross-sectional view of another modification example of the surrounding structure of the movable mirror. FIG. 39 is a partially schematic plan view of an optical module according to a modification example. FIG. 40 is a cross-sectional view taken along line IXVC-IXVC illustrated in FIG. 39 . FIG. 41 is a cross-sectional view taken along line XVC-XVC illustrated in FIG. 39 . FIG. 42 is a front view illustrating a modification example of the movable mirror. FIG. 43 is a cross-sectional view of the modification example illustrated in FIG. 42 . FIG. 44 is a front view illustrating another modification example of the movable mirror. FIG. 45 is a front view illustrating another modification example of the movable mirror. FIG. 46 is a front view illustrating another modification example of the movable mirror. FIG. 47 is a front view illustrating another modification example of the movable mirror. FIG. 48 is a front view illustrating another modification example of the movable mirror. FIG. 49 is a front view illustrating another modification example of the movable mirror. FIG. 50 is a plan view illustrating a modification example of an opening. FIG. 51 is a plan view illustrating another modification example of the opening. FIG. 52 is a plan view illustrating another modification example of the opening. FIG. 53 is a cross-sectional view illustrating another modification example of the movable mirror. FIG. 54 is a plan view illustrating another modification example of the opening.

[0026]DESCRIPTION OF EMBODIMENTS

[0027]First Embodiment

[0028]Hereinafter, an embodiment of an aspect of the present disclosure will be described in detail with reference to the drawings. The same reference signs are applied to parts which are the same or corresponding in each of the drawings, and duplicated parts will be omitted.

[0029][Configuration of Optical Module]

[0030]As illustrated in FIG. 1 , an optical module 1 A includes a support layer 2 A, a device layer 3 A which is provided on the support layer 2 A, and an intermediate layer 4 A which is provided between the support layer 2 A and the device layer 3 A. The support layer 2 A, the device layer 3 A, and the intermediate layer 4 A are constituted of an SOI substrate. Specifically, the support layer 2 A is a first silicon layer of the SOI substrate. The device layer 3 A is a second silicon layer of the SOI substrate. The intermediate layer 4 A is an insulating layer of the SOI substrate. The support layer 2 A, the device layer 3 A, and the intermediate layer 4 A exhibit a rectangular shape of which one side is approximately 10 mm, for example, when viewed in a ZA-axis direction (direction parallel to a ZA-axis) that is a laminating direction thereof. The thickness of each of the support layer 2 A and the device layer 3 A is approximately several hundreds of μm, for example. The thickness of the intermediate layer 4 A is approximately several μm, for example. FIG. 1 illustrates the device layer 3 A and the intermediate layer 4 A in a state where one corner portion of the device layer 3 A and one corner portion of the intermediate layer 4 A are cut out.

[0031]The device layer 3 A has a mounting region 31 A and a driving region 32 A which is connected to the mounting region 31 A. The driving region 32 A includes a pair of actuator regions 33 A and a pair of elastic support regions 34 A. The mounting region 31 A and the driving region 32 A (that is, the mounting region 31 A, the pair of actuator regions 33 A, and the pair of elastic support regions 34 A) are integrally formed in a portion of the device layer 3 A by a MEMS technology (patterning and etching).

[0032]The actuator regions 33 A of the pair are disposed on both sides of the mounting region 31 A in an XA-axis direction (direction parallel to an XA-axis orthogonal to the ZA-axis). That is, the mounting region 31 A is sandwiched between the actuator regions 33 A of the pair in the XA-axis direction. Each of the actuator regions 33 A is fixed to the support layer 2 A with the intermediate layer 4 A interposed therebetween. A first comb-teeth portion 33 a A is provided on a side surface of each of the actuator regions 33 A on the mounting region 31 A side. Each of the first comb-teeth portions 33 a A is in a state of being floated with respect to the support layer 2 A by removing the intermediate layer 4 A immediately below thereof. A first electrode 35 A is provided in each of the actuator regions 33 A.

[0033]The elastic support regions 34 A of the pair are disposed on both sides of the mounting region 31 A in a YA-axis direction (direction parallel to a YA-axis orthogonal to the ZA-axis and the XA-axis). That is, the mounting region 31 A is sandwiched between the elastic support regions 34 A of the pair in the YA-axis direction. Both end portions 34 a A of each of the elastic support regions 34 A are fixed to the support layer 2 A with the intermediate layer 4 A interposed therebetween. An elastic deformation portion 34 b A (part between both the end portions 34 a A) of each of the elastic support regions 34 A has a structure in which a plurality of leaf springs are connected. The elastic deformation portion 34 b A of each of the elastic support regions 34 A is in a state of being floated with respect to the support layer 2 A by removing the intermediate layer 4 A immediately below thereof is. A second electrode 36 A is provided in each of both the end portions 34 a A in each of the elastic support regions 34 A.

[0034]The elastic deformation portion 34 b A of each of the elastic support regions 34 A is connected to the mounting region 31 A. The mounting region 31 A is in a state of being floated with respect to the support layer 2 A by removing the intermediate layer 4 A immediately below thereof. That is, the mounting region 31 A is supported by the pair of elastic support regions 34 A. Second comb-teeth portions 31 a A are provided on side surfaces of the mounting region 31 A on the actuator region 33 A side. Each of the second comb-teeth portions 31 a A is in a state of being floated with respect to the support layer 2 A by removing the intermediate layer 4 A immediately below thereof. In the first comb-teeth portions 33 a A and the second comb-teeth portions 31 a A facing each other, each comb tooth of the first comb-teeth portions 33 a A is positioned between comb teeth of the second comb-teeth portions 31 a A.

[0035]The elastic support regions 34 A of the pair sandwich the mounting region 31 A from both sides when viewed in a direction AA parallel to the XA-axis. When the mounting region 31 A moves in the direction AA, the pair of elastic support regions 34 A causes an elastic force to act on the mounting region 31 A such that the mounting region 31 A returns to the initial position. Therefore, when a voltage is applied to a part between the first electrode 35 A and the second electrode 36 A such that an electrostatic attraction acts between the first comb-teeth portions 33 a A and the second comb-teeth portions 31 a A facing each other, the mounting region 31 A moves in the direction AA to a position where the electrostatic attraction and the elastic force of the pair of elastic support regions 34 A are balanced. In this manner, the driving region 32 A functions as an electrostatic actuator.

[0036]The optical module 1 A further includes a movable mirror 5 A, a fixed mirror 6 A, a beam splitter 7 A, a light incident unit 8 A, and a light emission unit 9 A. The movable mirror 5 A, the fixed mirror 6 A, and the beam splitter 7 A are disposed on the device layer 3 A such that an interference optical system 10 A (Michelson interference optical system) is constituted.

[0037]The movable mirror 5 A is mounted in the mounting region 31 A of the device layer 3 A on one side of the beam splitter 7 A in the XA-axis direction. A mirror surface 51 a A of a mirror portion 51 A included in the movable mirror 5 A is positioned on a side opposite to the support layer 2 A with respect to the device layer 3 A. For example, the mirror surface 51 a A is a surface perpendicular to the XA-axis direction (that is, a surface perpendicular to the direction AA) and is directed to the beam splitter 7 A side.

[0038]The fixed mirror 6 A is mounted in a mounting region 37 A of the device layer 3 A on one side of the beam splitter 7 A in the YA-axis direction. A mirror surface 61 a A of a mirror portion 61 A included in the fixed mirror 6 A is positioned on a side opposite to the support layer 2 A with respect to the device layer 3 A. For example, the mirror surface 61 a A is a surface perpendicular to the YA-axis direction and is directed to the beam splitter 7 A side.

[0039]The light incident unit 8 A is mounted in the device layer 3 A on the other side of the beam splitter 7 A in the YA-axis direction. For example, the light incident unit 8 A is constituted of optical fibers, a collimating lens, and the like. The light incident unit 8 A is disposed such that measurement light is incident on the interference optical system 10 A from outside.

[0040]The light emission unit 9 A is mounted in the device layer 3 A on the other side of the beam splitter 7 A in the XA-axis direction. For example, the light emission unit 9 A is constituted of optical fibers, a collimating lens, and the like. The light emission unit 9 A is disposed such that measurement light (interference light) is emitted from the interference optical system 10 A to the outside.

[0041]The beam splitter 7 A is a cube-type beam splitter having an optical functional surface 7 a A. The optical functional surface 7 a A is positioned on a side opposite to the support layer 2 A with respect to the device layer 3 A. The beam splitter 7 A is positionally aligned when one corner portion of the beam splitter 7 A on a bottom surface side is brought into contact with one corner of a rectangular opening 3 a A formed in the device layer 3 A. The beam splitter 7 A is mounted in the support layer 2 A by being fixed to the support layer 2 A through bonding or the like in a positionally aligned state.

[0042]In the optical module 1 A having a configuration described above, when measurement light L 0 A is incident on the interference optical system 10 A from outside via the light incident unit 8 A, a portion of the measurement light L 0 A is reflected by the optical functional surface 7 a A of the beam splitter 7 A and travels toward the movable mirror 5 A, and the remaining portion of the measurement light L 0 A is transmitted through the optical functional surface 7 a A of the beam splitter 7 A and travels toward the fixed mirror 6 A. A portion of the measurement light L 0 A is reflected by the mirror surface 51 a A of the movable mirror 5 A, travels toward the beam splitter 7 A along the same optical path, and is transmitted through the optical functional surface 7 a A of the beam splitter 7 A. The remaining portion of the measurement light L 0 A is reflected by the mirror surface 61 a A of the fixed mirror 6 A, travels toward the beam splitter 7 A along the same optical path, and is reflected by the optical functional surface 7 a A of the beam splitter 7 A. A portion of the measurement light L 0 A which has been transmitted through the optical functional surface 7 a A of the beam splitter 7 A, and the remaining portion of the measurement light L 0 A which has been reflected by the optical functional surface 7 a A of the beam splitter 7 A become measurement light L 1 A (interference light). The measurement light L 1 A is emitted from the interference optical system 10 A to the outside via the light emission unit 9 A. According to the optical module 1 A, since the movable mirror 5 A can reciprocate in the direction AA at a high speed, it is possible to provide a small-sized FTIR having high accuracy.

[0043][Movable Mirror and Surrounding Structure Thereof]

[0044]As illustrated in FIGS. 2 and 3 , the movable mirror 5 A has the mirror portion 51 A, an elastic portion 52 A, a connecting portion 53 A, a pair of leg portions 54 A, and a pair of interlock portions 55 A. The movable mirror 5 A having a configuration described below is integrally formed by a MEMS technology (patterning and etching).

[0045]The mirror portion 51 A is formed to have a plate shape (for example, a disk shape) having the mirror surface 51 a A as a main surface. The elastic portion 52 A is formed to have an annular shape (for example, a circular shape) being separated from the mirror portion 51 A and surrounding the mirror portion 51 A when viewed in the XA-axis direction (direction perpendicular to the mirror surface 51 a A). The connecting portion 53 A connects the mirror portion 51 A and the elastic portion 52 A to each other on one side in the YA-axis direction with respect to the center of the mirror portion 51 A when viewed in the XA-axis direction.

[0046]The leg portions 54 A of the pair are connected to an outer surface of the elastic portion 52 A on both sides in the YA-axis direction with respect to the center of the mirror portion 51 A when viewed in the XA-axis direction. That is, the mirror portion 51 A and the elastic portion 52 A are sandwiched between the leg portions 54 A of the pair in the YA-axis direction. Each of the leg portions 54 A extends to the mounting region 31 A side beyond the mirror portion 51 A and the elastic portion 52 A. The interlock portions 55 A of the pair are respectively provided in end portions of the leg portions 54 A on the mounting region 31 A side. The interlock portions 55 A are formed to be bent inward (toward each other) in a V-shape, for example, when viewed in the XA-axis direction.

[0047]The movable mirror 5 A having a configuration described above is mounted in the mounting region 31 A when the pair of interlock portions 55 A is disposed in an opening 31 b A formed in the mounting region 31 A. The opening 31 b A is open on both sides of the mounting region 31 A in the ZA-axis direction. A portion of each of the interlock portions 55 A protrudes from a surface of the mounting region 31 A on the intermediate layer 4 A side. That is, the movable mirror 5 A penetrates the mounting region 31 A.

[0048]Forces act outward (away from each other) on the pair of interlock portions 55 A disposed in the opening 31 b A of the mounting region 31 A. The movable mirror 5 A is fixed to the mounting region 31 A due to the forces. The forces are generated due to the annular elastic portion 52 A which is compressed when the movable mirror 5 A is mounted in the mounting region 31 A and has a tendency of being restored to the initial state.

[0049]As illustrated in FIG. 1 , the opening 31 b A is formed to have a trapezoidal shape widening toward the end on a side opposite to the beam splitter 7 A when viewed in the ZA-axis direction. When the pair of interlock portions 55 A exhibiting inwardly bent shapes engages with the opening 31 b A exhibiting such a shape, the movable mirror 5 A is positionally aligned (self-aligned) in each of the XA-axis direction, the YA-axis direction, and the ZA-axis direction in an automatic manner.

[0050]As illustrated in FIGS. 2 and 3 , an opening (first opening) 41 A is formed in the intermediate layer 4 A. The opening 41 A is open on both sides of the intermediate layer 4 A in the ZA-axis direction. An opening (second opening) 21 A is formed in the support layer 2 A. The opening 21 A is open on both sides of the support layer 2 A in the ZA-axis direction. In the optical module 1 A, a continuous space S 1 A is constituted of a region inside the opening 41 A of the intermediate layer 4 A and a region inside the opening 21 A of the support layer 2 A. That is, the space S 1 A includes a region inside the opening 41 A of the intermediate layer 4 A and a region inside the opening 21 A of the support layer 2 A.

[0051]The space S 1 A is formed between the support layer 2 A and the device layer 3 A and corresponds to at least the mounting region 31 A and the driving region 32 A. Specifically, a region inside the opening 41 A of the intermediate layer 4 A and a region inside the opening 21 A of the support layer 2 A include a range in which the mounting region 31 A moves when viewed in the ZA-axis direction. A region inside the opening 41 A of the intermediate layer 4 A forms a clearance for causing a part (that is, a part to be in a floated state with respect to the support layer 2 A, for example, the mounting region 31 A in its entirety, the elastic deformation portion 34 b A of each of the elastic support regions 34 A, the first comb-teeth portions 33 a A, and the second comb-teeth portions 31 a A) of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. That is, the space S 1 A corresponding to at least the mounting region 31 A and the driving region 32 A means a space formed between the support layer 2 A and the device layer 3 A such that the mounting region 31 A in its entirety and at least a portion of the driving region 32 A are separated from the support layer 2 A.

[0052]A portion of each of the interlock portions 55 A included in the movable mirror 5 A is positioned in the space MA. Specifically, a portion of each of the interlock portions 55 A is positioned in a region inside the opening 21 A of the support layer 2 A through a region inside the opening 41 A of the intermediate layer 4 A. A portion of each of the interlock portions 55 A protrudes into the space S 1 A from a surface of the device layer 3 A on the intermediate layer 4 A side by approximately 100 μm, for example. As described above, since a region inside the opening 41 A of the intermediate layer 4 A and a region inside the opening 21 A of the support layer 2 A include the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, a portion of each of the interlock portions 55 A of the movable mirror 5 A positioned in the space S 1 A does not come into contact with the intermediate layer 4 A and the support layer 2 A when the mounting region 31 A reciprocates in the direction AA.

[0053][Fixed Mirror and Surrounding Structure Thereof]

[0054]As illustrated in FIGS. 4 and 5 , the fixed mirror 6 A has the mirror portion 61 A, an elastic portion 62 A, a connecting portion 63 A, a pair of leg portions 64 A, and a pair of interlock portions 65 A. The fixed mirror 6 A having a configuration described below is integrally formed by a MEMS technology (patterning and etching).

[0055]The mirror portion 61 A is formed to have a plate shape (for example, a disk shape) having the mirror surface 61 a A as a main surface. The elastic portion 62 A is formed to have an annular shape (for example, a circular shape) being separated from the mirror portion 61 A and surrounding the mirror portion 61 A when viewed in the YA-axis direction (direction perpendicular to the mirror surface 61 a A). The connecting portion 63 A connects the mirror portion 61 A and the elastic portion 62 A to each other on one side in the XA-axis direction with respect to the center of the mirror portion 61 A when viewed in the YA-axis direction.

[0056]The leg portions 64 A of the pair are connected to an outer surface of the elastic portion 62 A on both sides in the XA-axis direction with respect to the center of the mirror portion 61 A when viewed in the YA-axis direction. That is, the mirror portion 61 A and the elastic portion 62 A are sandwiched between the leg portions 64 A of the pair in the XA-axis direction. Each of the leg portions 64 A extends to the mounting region 37 A side beyond the mirror portion 61 A and the elastic portion 62 A. The interlock portions 65 A of the pair are respectively provided in end portions of the leg portions 64 A on the mounting region 37 A side. The interlock portions 65 A are formed to be bent inward (toward each other) in a V-shape, for example, when viewed in the YA-axis direction.

[0057]The fixed mirror 6 A having a configuration described above is mounted in the mounting region 37 A when the pair of interlock portions 65 A are disposed in an opening 37 a A formed in the mounting region 37 A. The opening 37 a A is open on both sides of the mounting region 37 A in the ZA-axis direction. A portion of each of the interlock portions 65 A protrudes from a surface of the mounting region 37 A on the intermediate layer 4 A side. That is, the fixed mirror 6 A penetrates the mounting region 37 A.

[0058]Forces act outward (away from each other) on the pair of interlock portions 65 A disposed in the opening 37 a A of the mounting region 37 A. The fixed mirror 6 A is fixed to the mounting region 37 A due to the forces. The forces are generated due to the annular elastic portion 62 A which is compressed when the fixed mirror 6 A is mounted in the mounting region 37 A and has a tendency of being restored to the initial state.

[0059]As illustrated in FIG. 1 , the opening 37 a A is formed to have a trapezoidal shape widening toward the end on a side opposite to the beam splitter 7 A when viewed in the ZA-axis direction. When the pair of interlock portions 65 A exhibiting inwardly bent shapes engages with the opening 37 a A exhibiting such a shape, the fixed mirror 6 A is positionally aligned (self-aligned) in each of the XA-axis direction, the YA-axis direction, and the ZA-axis direction in an automatic manner.

[0060]As illustrated in FIGS. 4 and 5 , an opening 42 A is formed in the intermediate layer 4 A. The opening 42 A includes the opening 37 a A of the mounting region 37 A when viewed in the ZA-axis direction and is open on both sides of the intermediate layer 4 A in the ZA-axis direction. An opening 22 A is formed in the support layer 2 A. The opening 22 A includes the opening 37 a A of the mounting region 37 A when viewed in the ZA-axis direction and is open on both sides of the support layer 2 A in the ZA-axis direction. In the optical module 1 A, a continuous space S 2 A is constituted of a region inside the opening 42 A of the intermediate layer 4 A and a region inside the opening 22 A of the support layer 2 A. That is, the space S 2 A includes a region inside the opening 42 A of the intermediate layer 4 A and a region inside the opening 22 A of the support layer 2 A.

[0061]A portion of each of the interlock portions 65 A included in the fixed mirror 6 A is positioned in the space S 2 A. Specifically, a portion of each of the interlock portions 65 A is positioned in a region inside the opening 22 A of the support layer 2 A through a region inside the opening 42 A of the intermediate layer 4 A. A portion of each of the interlock portions 65 A protrudes into the space S 2 A from a surface of the device layer 3 A on the intermediate layer 4 A side by approximately 100 μm, for example.

[0062][Operations and Effects]

[0063]In the optical module 1 A, the movable mirror 5 A penetrates the mounting region 31 A of the device layer 3 A, and a portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in the space S 1 A famed between the support layer 2 A and the device layer 3 A. Accordingly, for example, since there is no limitation on the size and the like of each of the interlock portions 55 A, the movable mirror 5 A can be stably and firmly fixed to the mounting region 31 A of the device layer 3 A. Thus, according to the optical module 1 A, reliable mounting of the movable mirror 5 A with respect to the device layer 3 A is realized.

[0064]In addition, in the optical module 1 A, a portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the opening 21 A of the support layer 2 A through a region inside the opening 41 A of the intermediate layer 4 A. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 A with respect to the device layer 3 A.

[0065]In addition, in the optical module 1 A, the support layer 2 A is the first silicon layer of the SOI substrate, the device layer 3 A is the second silicon layer of the SOI substrate, and the intermediate layer 4 A is the insulating layer of the SOI substrate. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 A with respect to the device layer 3 A using the SOI substrate.

[0066]In addition, in the optical module 1 A, the mirror surface 51 a A of the movable mirror 5 A is positioned on a side opposite to the support layer 2 A with respect to the device layer 3 A. Accordingly, it is possible to simplify the configuration of the optical module 1 A.

[0067]In addition, in the optical module 1 A, the movable mirror 5 A, the fixed mirror 6 A, and the beam splitter 7 A are disposed such that the interference optical system 10 A is constituted. Accordingly, it is possible to obtain an FTIR having improved sensitivity.

[0068]In addition, in the optical module 1 A, the light incident unit 8 A is disposed such that measurement light is incident on the interference optical system 10 A from outside, and the light emission unit 9 A is disposed such that the measurement light is emitted from the interference optical system 10 A to the outside. Accordingly, it is possible to obtain an FTIR including the light incident unit 8 A and the light emission unit 9 A.

[0069][Modification Examples]

[0070]Hereinabove, an embodiment of the aspect of the present disclosure has been described. However, the aspect of the present disclosure is not limited to the foregoing embodiment. For example, the material and the shape of each configuration are not limited to the materials and the shapes described above, and various materials and shapes can be employed. As an example thereof, the shapes of the mirror portion 51 A and the mirror surface 51 a A are not limited to a circular shape, and other shapes such as a rectangular shape and the like may be adopted.

[0071]In addition, as long as the space S 1 A is formed between the support layer 2 A and the device layer 3 A and corresponds to at least the mounting region 31 A and the driving region 32 A, various forms can be employed as illustrated in FIGS. 6 and 7 .

[0072]In the configuration illustrated in FIG. 6 , in place of the opening 21 A, a recess portion 23 A open on the device layer 3 A side is formed in the support layer 2 A, and the space S 1 A is constituted of a region inside the opening 41 A of the intermediate layer 4 A and a region inside the recess portion 23 A of the support layer 2 A. In this case, a region inside the recess portion 23 A of the support layer 2 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the recess portion 23 A through a region inside the opening 41 A of the intermediate layer 4 A. With this configuration as well, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 A with respect to the device layer 3 A.

[0073]In the configuration illustrated in FIG. 7( a ) , a region inside the opening 21 A of the support layer 2 A includes a range in which each of the interlock portions 55 A of the movable mirror 5 A moves when viewed in the ZA-axis direction. In the configuration illustrated in FIG. 7( b ) , a region inside the recess portion 23 A of the support layer 2 A includes the range in which each of the interlock portions 55 A of the movable mirror 5 A moves when viewed in the ZA-axis direction. In these cases, a region inside the opening 41 A of the intermediate layer 4 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. In any configuration, a portion of each of the interlock portions 55 A of the movable mirror 5 A positioned in the space S 1 A does not come into contact with the intermediate layer 4 A and the support layer 2 A when the mounting region 31 A reciprocates in the direction AA.

[0074]In addition, the support layer 2 A and the device layer 3 A may be joined to each other without having the intermediate layer 4 A interposed therebetween. In this case, the support layer 2 A is formed of silicon, glass, ceramic, or the like, for example, and the device layer 3 A is formed of silicon or the like, for example. The support layer 2 A and the device layer 3 A are joined to each other through direct joining, surface activation joining, plasma joining, anodic joining, metal joining, resin joining, or the like, for example. In this case as well, as long as the space S 1 A is formed between the support layer 2 A and the device layer 3 A and corresponds to at least the mounting region 31 A and the driving region 32 A, various forms can be employed as illustrated in FIGS. 8, 9, 10, and 11 . In any configuration, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 A with respect to the device layer 3 A.

[0075]In the configuration illustrated in FIG. 8( a ) , the space S 1 A is constituted of a region inside the opening 21 A of the support layer 2 A. In this case, a region inside the opening 21 A of the support layer 2 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the opening 21 A of the support layer 2 A.

[0076]In the configuration illustrated in FIG. 8( b ) , the space S 1 A is constituted of a region inside the recess portion 23 A of the support layer 2 A. In this case, a region inside the recess portion 23 A of the support layer 2 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the recess portion 23 A of the support layer 2 A.

[0077]In the configuration illustrated in FIG. 9( a ) , a recess portion (first recess portion) 38 A open on the support layer 2 A side is formed in the device layer 3 A, and the space S 1 A is constituted of a region inside the recess portion 38 A of the device layer 3 A and a region inside the opening 21 A of the support layer 2 A. In this case, a region inside the recess portion 38 A of the device layer 3 A and a region inside the opening 21 A of the support layer 2 A include the range in which the mounting region 31 A moves when viewed in the ZA-axis direction. A region inside the recess portion 38 A of the device layer 3 A forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the opening 21 A of the support layer 2 A through a region inside the recess portion 38 A of the device layer 3 A.

[0078]In the configuration illustrated in FIG. 9( b ) , the recess portion 38 A is formed in the device layer 3 A, and the space S 1 A is constituted of a region inside the recess portion 38 A of the device layer 3 A and a region inside the recess portion (second recess portion) 23 A of the support layer 2 A. In this case, a region inside the recess portion 38 A of the device layer 3 A and a region inside the recess portion 23 A of the support layer 2 A include the range in which the mounting region 31 A moves when viewed in the ZA-axis direction. A region inside the recess portion 38 A of the device layer 3 A forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the recess portion 23 A of the support layer 2 A through a region inside the recess portion 38 A of the device layer 3 A.

[0079]In the configuration illustrated in FIG. 10( a ) , the recess portion 38 A is formed in the device layer 3 A, and the space S 1 A is constituted of a region inside the recess portion 38 A of the device layer 3 A and a region inside the opening 21 A of the support layer 2 A. In this case, a region inside the recess portion 38 A of the device layer 3 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A region inside the opening 21 A of the support layer 2 A includes the range in which each of the interlock portions 55 A of the movable mirror 5 A moves when viewed in the ZA-axis direction. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the opening 21 A of the support layer 2 A through a region inside the recess portion 38 A of the device layer 3 A.

[0080]In the configuration illustrated in FIG. 10( b ) , the recess portion 38 A is formed in the device layer 3 A, and the space S 1 A is constituted of a region inside the recess portion 38 A of the device layer 3 A and a region inside the recess portion (second recess portion) 23 A of the support layer 2 A. In this case, a region inside the recess portion 38 A of the device layer 3 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A region inside the recess portion 23 A of the support layer 2 A includes the range in which each of the interlock portions 55 A of the movable mirror 5 A moves when viewed in the ZA-axis direction. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the recess portion 23 A of the support layer 2 A through a region inside the recess portion 38 A of the device layer 3 A.

[0081]In the configuration illustrated in FIG. 11 , the recess portion 38 A is formed in the device layer 3 A, and the space S 1 A is constituted of a region inside the recess portion 38 A of the device layer 3 A. In this case, a region inside the recess portion 38 A of the device layer 3 A includes the range in which the mounting region 31 A moves when viewed in the ZA-axis direction, and forms a clearance for causing a part of the mounting region 31 A and the driving region 32 A, which needs to be separated from the support layer 2 A, to be separated from the support layer 2 A. A portion of each of the interlock portions 55 A of the movable mirror 5 A is positioned in a region inside the recess portion 38 A of the device layer 3 A.

[0082]In addition, as illustrated in FIGS. 12( a ) and 12( b ) , a portion of each of the leg portions 54 A and a portion of each of the interlock portions 55 A of the movable mirror 5 A may be positioned in the space S 1 A, and the mirror surface 51 a A of the movable mirror 5 A may be positioned on a side opposite to the device layer 3 A with respect to the support layer 2 A. In this case, the mirror surface 61 a A of the fixed mirror 6 A and the optical functional surface 7 a A of the beam splitter 7 A are also positioned on a side opposite to the device layer 3 A with respect to the support layer 2 A. In the configuration illustrated in FIG. 12( b ) , a spacer 39 A protruding to a side opposite to the support layer 2 A is integrally provided in the device layer 3 A. The spacer 39 A protrudes beyond a part of each of the interlock portions 55 A of the movable mirror 5 A protruding from the device layer 3 A to a side opposite to the support layer 2 A, thereby protecting the part.

[0083]In addition, as illustrated in FIG. 13 , the movable mirror 5 A may penetrate the mounting region 31 A in a state where the mirror surface 51 a A intersects the mounting region 31 A. In the movable mirror 5 A illustrated in FIG. 13 , the pair of leg portions 54 A is not provided, and the interlock portions 55 A of the pair are connected to the outer surface of the elastic portion 52 A on both sides in the YA-axis direction with respect to the center of the mirror portion 51 A when viewed in the XA-axis direction. That is, the mirror portion 51 A and the elastic portion 52 A are sandwiched between the interlock portions 55 A of the pair in the YA-axis direction. In this case, a part facing the mirror surface 51 a A, of a part defining the opening 31 b A in the mounting region 31 A, is cut out to allow the measurement light L 0 A to pass therethrough. In the movable mirror 5 A illustrated in FIG. 13 , the mirror surface 51 a A intersects the mounting region 31 A. Accordingly, a centroid position of the movable mirror 5 A can be brought closer to the mounting region 31 A. Therefore, it is possible to more stably move the mounting region 31 A in which the movable mirror 5 A is mounted.

[0084]In addition, as illustrated in FIGS. 14 and 15 , the connecting portion 53 A may be provided on the mounting region 31 A side of the center of the mirror surface 51 a A. According to this configuration, for example, compared to a case where the connecting portion 53 A is provided on a side opposite to the mounting region 31 A of the center of the mirror surface 51 a A, the centroid position of the movable mirror 5 A can be brought closer to the mounting region 31 A. Therefore, it is possible to more stably move the mounting region 31 A in which the movable mirror 5 A is mounted. In addition, as illustrated in FIG. 14 , each of the interlock portions 55 A may have a folded portion 55 a A which is disposed inside an opening 31 c A provided separately from the opening 31 b A. According to this configuration, the movable mirror 5 A can be more reliably fixed to the mounting region 31 A. In addition, as illustrated in FIG. 15 , handles 56 A for causing the elastic portion 52 A to be elastically deformed to change the distance between the interlock portions 55 A of the pair may be provided in the elastic portion 52 A. According to this configuration, the distance between the interlock portions 55 A of the pair can be changed by operating the handles 56 A. Therefore, when the pair of interlock portions 55 A is inserted into the opening 31 b A in a state where the distance between the interlock portions 55 A of the pair is changed, and when the handles 56 A are released from the operation thereafter, each of the interlock portions 55 A can be brought into contact with an inner surface of the opening 31 b A. Accordingly, the movable mirror 5 A is supported in the mounting region 31 A by a reaction force applied from the inner surface of the opening 31 b A to each of the interlock portions 55 A. In all of the examples, the movable mirror 5 A can be supported in the mounting region 31 A by a reaction force applied from the inner surface of the opening 31 b A to each of the interlock portions 55 A. However, in order to more reliably fix the movable mirror 5 A to the mounting region 31 A, a bonding agent may be disposed between each of the interlock portions 55 A and the mounting region 31 A.

[0085]In addition, in the foregoing embodiment, the fixed mirror 6 A is mounted in the device layer 3 A. However, the fixed mirror 6 A need only be mounted in at least one of the support layer 2 A, the device layer 3 A, and the intermediate layer 4 A. In addition, in the foregoing embodiment, the beam splitter 7 A is mounted in the support layer 2 A. However, the beam splitter 7 A need only be mounted in at least one of the support layer 2 A, the device layer 3 A, and the intermediate layer 4 A. In addition, the beam splitter 7 A is not limited to a cube-type beam splitter and may be a plate-type beam splitter.

[0086]In addition, the optical module 1 A may include a light emitting element for generating measurement light to be incident on the light incident unit 8 A, in addition to the light incident unit 8 A. Alternatively, the optical module 1 A may include a light emitting element for generating measurement light to be incident on the interference optical system 10 A, in place of the light incident unit 8 A. In addition, the optical module 1 A may include a light receiving element for detecting measurement light (interference light) emitted from the light emission unit 9 A, in addition to the light emission unit 9 A. Alternatively, the optical module 1 A may include a light receiving element for detecting measurement light (interference light) emitted from the interference optical system 10 A, in place of the light emission unit 9 A.

[0087]In addition, a first penetration electrode which is electrically connected to each of the actuator regions 33 A and a second penetration electrode which is electrically connected to each of both the end portions 34 a A of each of the elastic support regions 34 A may be provided in the support layer 2 A and the intermediate layer 4 A (in only the support layer 2 A when the intermediate layer 4 A is not present), and a voltage may be applied to a part between the first penetration electrode and the second penetration electrode. In addition, the actuator for moving the mounting region 31 A is not limited to an electrostatic actuator, a piezoelectric actuator, and an electromagnetic actuator, or the like may be adopted, for example. In addition, the optical module 1 A is not limited to a module for constituting an FTIR and may be a module for constituting other optical systems.

[0088]Second Embodiment

[0089]Regarding an MEMS device, optical modules including a base that has a main surface in which a recess portion is formed, and an optical element which is mounted on the base in the recess portion are known (for example, refer to the specification of United States Patent Application, Publication No. 2002/0186477). In such an optical module, an optical element is inserted into a recess portion, and the optical element is bonded to a base due to a reflow of a bond pad formed on a bottom surface of the recess portion.

[0090]In the optical module described above, from the viewpoint of ensuring tolerance to an impact applied during installation to a portable instrument or transportation, the optical element needs to be reliably mounted on the base. However, in the optical module described above, there is concern that tolerance to an impact may not be sufficient and the optical element may easily fall off from the recess portion when an impact acts thereon.

[0091]An object of another aspect of the present disclosure is to provide an optical module in which reliable mounting of an optical element can be realized.

[0092]According to another aspect of the present disclosure, there is provided an optical module including a base, and an optical element which is mounted on the base. The base has a first surface and a second surface which face each other, and a first opening which is open on the first surface and the second surface and a second opening which is open on the second surface are provided in the base. The optical element has an optical portion which has an optical surface and a support portion which supports the optical portion on the base. The support portion includes a protrusion portion which protrudes from the second surface via the first opening and a folded portion which extends from the protrusion portion toward the second surface and enters the second opening from the second surface side.

[0093]In this optical module, the first opening which is open on the first surface and the second surface and the second opening which is open on the second surface are provided in the base. In addition, the support portion supporting the optical portion on the base includes the protrusion portion which protrudes from the second surface via the first opening and the folded portion which extends from the protrusion portion toward the second surface and enters the second opening from the second surface side. Accordingly, even when the optical element has a tendency of being deviated in a direction intersecting the first surface due to an impact, for example, since the folded portion comes into contact with an edge portion of the second opening on the second surface side, it is possible to curb falling off of the optical element. Thus, according to this optical module, it is possible to realize reliable mounting of the optical element.

[0094]In the optical module according to another aspect of the present disclosure, a pair of second openings may be provided such that the first opening is sandwiched therebetween. A pair of protrusion portions may be provided. The folded portion may be provided in each of the pair of protrusion portions and may enter each of the pair of second openings. Accordingly, it is possible to more reliably curb falling off of the optical element.

[0095]In the optical module according to another aspect of the present disclosure, the protrusion portion may come into contact with at least an edge portion of the first opening on the first surface side. Accordingly, it is possible to even more reliably curb falling off of the optical element.

[0096]In the optical module according to another aspect of the present disclosure, the folded portion may come into contact with an edge portion of the second opening on the second surface side. Accordingly, it is possible to even more reliably curb falling off of the optical element.

[0097]In the optical module according to another aspect of the present disclosure, the optical element may further have an elastic portion. A pair of protrusion portions may be provided. The pair of protrusion portions, in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion, may be inserted into the first opening in a state where an elastic force of the elastic portion is applied. The optical element may be supported in the base by a reaction force of the elastic force applied from an inner surface of the first opening to the pair of protrusion portions. Accordingly, the optical element can be mounted on the base utilizing an elastic force of the elastic portion. In this case, the optical element is mounted on the base utilizing an elastic force. Furthermore, since falling off of the optical element is curbed by the folded portion, it is possible to reduce a using amount of a bonding agent or to eliminate the need for a bonding agent. The following advantages can be achieved by reducing the using amount of a bonding agent. That is, occurrence of contamination or the like on the optical surface or occurrence of destruction or malfunction in a driving region of the optical module caused by a sticking-out bonding material can be curbed. In addition, it is possible to reduce the size of the optical module by reducing a region (space between constituent elements) for forming a bonding material.

[0098]In the optical module according to another aspect of the present disclosure, the pair of protrusion portions may be inserted into the first opening in a state where an elastic force of the elastic portion is applied in a direction away from each other. Accordingly, it is possible to favorably mount the optical element on the base utilizing an elastic force.

[0099]In the optical module according to another aspect of the present disclosure, the inner surface of the first opening may include a pair of inclined surfaces which is inclined such that a distance therebetween increases from one end toward the other end when viewed in a direction intersecting the first surface, and a facing surface which faces the pair of inclined surfaces in a direction intersecting a direction in which the pair of inclined surfaces faces each other. Accordingly, when the protrusion portion is inserted into the first opening and an elastic deformation of the elastic portion is partially released, it is possible to positionally align the optical element in a direction along the first surface by causing the protrusion portion to slide on the inclined surface and to abut the facing surface due to an elastic force.

[0100]In the optical module according to another aspect of the present disclosure, when viewed in a direction intersecting the first surface, an inclination angle of the pair of inclined surfaces with respect to a straight line passing through the other end of one inclined surface and the other end of the other inclined surface may be 45 degrees or smaller. Accordingly, a reaction force of an elastic force applied to the protrusion portion can be further dispersed in a direction intersecting the direction in which the pair of inclined surfaces faces each other than in the direction in which the pair of inclined surfaces faces each other. Therefore, it is possible to improve the tolerance to an impact in a direction intersecting the direction in which the pair of inclined surfaces faces each other.

[0101]In the optical module according to another aspect of the present disclosure, the base may have a support layer, and a device layer which is provided on the support layer and includes the first surface and the second surface. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the optical element.

[0102]In the optical module according to another aspect of the present disclosure, the base may have an intermediate layer which is provided between the support layer and the device layer. Accordingly, it is possible to more favorably realize a configuration for reliable mounting of the optical element.

[0103]The optical module according to another aspect of the present disclosure may further include a fixed mirror which is mounted in the support layer, the device layer, or the intermediate layer; and a beam splitter which is mounted in the support layer, the device layer, or the intermediate layer. The optical element may be a movable mirror which includes the optical surface serving as a mirror surface. The device layer may have a mounting region in which the optical element is mounted and a driving region which is connected to the mounting region. The movable mirror, the fixed mirror, and the beam splitter may be disposed such that an interference optical system is constituted. For example, when a Fourier transform infrared spectroscopic analyzer (FTIR) is constituted by forming an interference optical system on a silicon-on-insulator (SOI) substrate using an MEMS technology, the following problem arises in respect that the size of a movable mirror depends on a degree of completion of deep cutting with respect to an SOI substrate. That is, since the degree of completion of deep cutting with respect to an SOI substrate is approximately 500 μm at the maximum, there is a limitation in increasing the size of a movable mirror for the sake of improvement of sensitivity of an FTIR. In contrast, according to this optical module, a separately formed movable mirror is mounted in the device layer. Therefore, it is possible to obtain an FTIR having improved sensitivity.

[0104]In the optical module according to another aspect of the present disclosure, the support layer may be a first silicon layer of an SOI substrate. The device layer may be a second silicon layer of the SOI substrate. The intermediate layer may be an insulating layer of the SOI substrate. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer using the SOI substrate.

[0105]The optical module according to another aspect of the present disclosure may further include a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside, and a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside. Accordingly, it is possible to obtain an FTIR including a light incident unit and a light emission unit.

[0106]According to another aspect of the present disclosure, it is possible to provide an optical module in which reliable mounting of an optical element can be realized.

[0107]Hereinafter, an embodiment of another aspect of the present disclosure will be described in detail with reference to the drawings. The same reference signs are applied to parts which are the same or corresponding in each of the drawings, and duplicated parts will be omitted.

[0108][Configuration of Optical Module]

[0109]As illustrated in FIG. 16 , an optical module 1 B includes a base BB. The base BB includes a support layer 2 B, a device layer 3 B which is provided on the support layer 2 B, and an intermediate layer 4 B which is provided between the support layer 2 B and the device layer 3 B. The support layer 2 B, the device layer 3 B, and the intermediate layer 4 B are constituted of an SOI substrate. Specifically, the support layer 2 B is a first silicon layer of the SOI substrate. The device layer 3 B is a second silicon layer of the SOI substrate. The intermediate layer 4 B is an insulating layer of the SOI substrate. The support layer 2 B, the device layer 3 B, and the intermediate layer 4 B exhibit a rectangular shape of which one side is approximately 10 mm, for example, when viewed in a ZB-axis direction (direction parallel to a ZB-axis) that is a stacking direction thereof. The thickness of each of the support layer 2 B and the device layer 3 B is approximately several hundreds of μm, for example. The thickness of the intermediate layer 4 B is approximately several μm, for example. FIG. 16 illustrates the device layer 3 B and the intermediate layer 4 B in a state where one corner portion of the device layer 3 B and one corner portion of the intermediate layer 4 B are cut out.

[0110]The device layer 3 B has a mounting region 31 B and a driving region 32 B which is connected to the mounting region 31 B. The driving region 32 B includes a pair of actuator regions 33 B and a pair of elastic support regions 34 B. The mounting region 31 B and the driving region 32 B (that is, the mounting region 31 B, the pair of actuator regions 33 B, and the pair of elastic support regions 34 B) are integrally formed in a portion of the device layer 3 B by a MEMS technology (patterning and etching).

[0111]The actuator regions 33 B of the pair are disposed on both sides of the mounting region 31 B in an XB-axis direction (direction parallel to an XB-axis orthogonal to the ZB-axis). That is, the mounting region 31 B is sandwiched between the actuator regions 33 B of the pair in the XB-axis direction. Each of the actuator regions 33 B is fixed to the support layer 2 B with the intermediate layer 4 B interposed therebetween. A first comb-teeth portion 33 a B is provided on a side surface of each of the actuator regions 33 B on the mounting region 31 B side. Each of the first comb-teeth portions 33 a B is in a state of being floated with respect to the support layer 2 B after the intermediate layer 4 B immediately below thereof is removed. A first electrode 35 B is provided in each of the actuator regions 33 B.

[0112]The elastic support regions 34 B of the pair are disposed on both sides of the mounting region 31 B in a YB-axis direction (direction parallel to a YB-axis orthogonal to the ZB-axis and the XB-axis). That is, the mounting region 31 B is sandwiched between the pair of elastic support regions 34 B in the YB-axis direction. Both end portions 34 a B of each of the elastic support regions 34 B are fixed to the support layer 2 B with the intermediate layer 4 B interposed therebetween. An elastic deformation portion 34 b B (part between both the end portions 34 a B) of each of the elastic support regions 34 B has a structure in which a plurality of leaf springs are connected. The elastic deformation portion 34 b B of each of the elastic support regions 34 B is in a state of being floated with respect to the support layer 2 B by removing the intermediate layer 4 B immediately below thereof. A second electrode 36 B is provided in each of both the end portions 34 a B in each of the elastic support regions 34 B.

[0113]The elastic deformation portion 34 b B of each of the elastic support regions 34 B is connected to the mounting region 31 B. The mounting region 31 B is in a state of being floated with respect to the support layer 2 B by removing the intermediate layer 4 B immediately below thereof. That is, the mounting region 31 B is supported by the pair of elastic support regions 34 B. Second comb-teeth portions 31 a B are provided on side surfaces of the mounting region 31 B on the actuator region 33 B side. Each of the second comb-teeth portions 31 a B is in a state of being floated with respect to the support layer 2 B by removing the intermediate layer 4 B immediately below thereof. In the first comb-teeth portions 33 a B and the second comb-teeth portions 31 a B facing each other, each comb tooth of the first comb-teeth portions 33 a B is positioned between comb teeth of the second comb-teeth portions 31 a B.

[0114]The elastic support regions 34 B of the pair sandwich the mounting region 31 B from both sides with respect to a direction AB parallel to the XB-axis. When the mounting region 31 B moves in the direction AB, the pair of elastic support regions 34 B causes an elastic force to act on the mounting region 31 B such that the mounting region 31 B returns to the initial position. Therefore, when a voltage is applied to a part between the first electrode 35 B and the second electrode 36 B such that an electrostatic attraction acts between the first comb-teeth portions 33 a B and the second comb-teeth portions 31 a B facing each other, the mounting region 31 B moves in the direction AB to a position where the electrostatic attraction and the elastic force of the pair of elastic support regions 34 B are balanced. In this manner, the driving region 32 B functions as an electrostatic actuator.

[0115]The optical module 1 B further includes a movable mirror 5 B, a fixed mirror 6 B, a beam splitter 7 B, a light incident unit 8 B, and a light emission unit 9 B. The movable mirror 5 B, the fixed mirror 6 B, and the beam splitter 7 B are disposed on the device layer 3 B such that an interference optical system 10 B (Michelson interference optical system) is constituted.

[0116]The movable mirror 5 B is mounted in the mounting region 31 B of the device layer 3 B on one side of the beam splitter 7 B in the XB-axis direction. A mirror surface 51 a B of a mirror portion 51 B included in the movable mirror 5 B is positioned on a side opposite to the support layer 2 B with respect to the device layer 3 B. For example, the mirror surface 51 a B is a surface perpendicular to the XB-axis direction (that is, a surface perpendicular to the direction AB) and is directed to the beam splitter 7 B side.

[0117]The fixed mirror 6 B is mounted in a mounting region 37 B of the device layer 3 B on one side of the beam splitter 7 B in the YB-axis direction. A mirror surface 61 a B of a mirror portion 61 B included in the fixed mirror 6 B is positioned on a side opposite to the support layer 2 B with respect to the device layer 3 B. For example, the mirror surface 61 a B is a surface perpendicular to the YB-axis direction and is directed to the beam splitter 7 B side.

[0118]The light incident unit 8 B is mounted in the device layer 3 B on the other side of the beam splitter 7 B in the YB-axis direction. For example, the light incident unit 8 B is constituted of optical fibers, a collimating lens, and the like. The light incident unit 8 B is disposed such that measurement light is incident on the interference optical system 10 B from outside.

[0119]The light emission unit 9 B is mounted in the device layer 3 B on the other side of the beam splitter 7 B in the XB-axis direction. For example, the light emission unit 9 B is constituted of optical fibers, a collimating lens, and the like. The light emission unit 9 B is disposed such that measurement light (interference light) is emitted from the interference optical system 10 B to the outside.

[0120]The beam splitter 7 B is a cube-type beam splitter having an optical functional surface 7 a B. The optical functional surface 7 a B is positioned on a side opposite to the support layer 2 B with respect to the device layer 3 B. The beam splitter 7 B is positionally aligned when one corner portion of the beam splitter 7 B on a bottom surface side is brought into contact with one corner of a rectangular opening 3 a B formed in the device layer 3 B. The beam splitter 7 B is mounted in the support layer 2 B by being fixed to the support layer 2 B through bonding or the like in a positionally aligned state.

[0121]In the optical module 1 B having a configuration described above, when measurement light L 0 B is incident on the interference optical system 10 B from outside via the light incident unit 8 B, a portion of the measurement light L 0 B is reflected by the optical functional surface 7 a B of the beam splitter 7 B and travels toward the movable mirror 5 B, and the remaining portion of the measurement light L 0 B is transmitted through the optical functional surface 7 a B of the beam splitter 7 B and travels toward the fixed mirror 6 B. A portion of the measurement light L 0 B is reflected by the mirror surface 51 a B of the movable mirror 5 B, travels toward the beam splitter 7 B along the same optical path, and is transmitted through the optical functional surface 7 a B of the beam splitter 7 B. The remaining portion of the measurement light L 0 B is reflected by the mirror surface 61 a B of the fixed mirror 6 B, travels toward the beam splitter 7 B along the same optical path, and is reflected by the optical functional surface 7 a B of the beam splitter 7 B. A portion of the measurement light L 0 B which has been transmitted through the optical functional surface 7 a B of the beam splitter 7 B, and the remaining portion of the measurement light L 0 B which has been reflected by the optical functional surface 7 a B of the beam splitter 7 B become measurement light L 1 B (interference light). The measurement light L 1 B is emitted from the interference optical system 10 B to the outside via the light emission unit 9 B. According to the optical module 1 B, since the movable mirror 5 B can reciprocate in the direction AB at a high speed, it is possible to provide a small-sized FTIR having high accuracy.

[0122][Movable Mirror and Surrounding Structure Thereof]

[0123]As illustrated in FIGS. 17, 18, and 19 , the base BB includes a first surface BaB and a second surface BbB facing each other. The first surface BaB is a surface of the device layer 3 B on a side opposite to the support layer 2 B, and the second surface BbB is a surface of the device layer 3 B on the support layer 2 B side. The movable mirror 5 B is mounted on the base BB in a state where the mirror surface 51 a B is positioned on a plane intersecting (for example, orthogonal to) the first surface BaB and the mirror surface 51 a B is positioned on the first surface BaB side of the base BB.

[0124]The movable mirror (optical element) 5 B has the mirror portion (optical portion) 51 B, an elastic portion 52 B, a support portion 53 B, and a connecting portion 54 B. The movable mirror 5 B is integrally formed by a MEMS technology (patterning and etching). Therefore, the thickness (size in the XB-axis direction orthogonal to the mirror surface 51 a B) of the movable mirror 5 B is uniform in each portion. For example, the thickness thereof is within a range of approximately 10 μm to 20 μm. In addition, the mirror portion 51 B, the elastic portion 52 B, the support portion 53 B, and the connecting portion 54 B are provided to be positioned on the same plane when viewed in the YB-axis direction (direction along both the mirror surface 51 a B and the first surface BaB).

[0125]The mirror portion 51 B is formed to have a plate shape (for example, a disk shape) having the mirror surface (optical surface) 51 a B as a main surface. The diameter of the mirror surface 51 a B is approximately 1 mm, for example. The elastic portion 52 B is formed to have an arc shape (for example, a semicircular arc shape) being separated from the mirror portion 51 B and surrounding the mirror portion 51 B when viewed in the XB-axis direction.

[0126]The support portion 53 B has a pair of leg portions 55 AB and 55 BB, a pair of interlock portions (protrusion portions) 56 B, and a pair of folded portions 57 B. The leg portions 55 AB and 55 BB of the pair are provided such that the mirror portion 51 B is sandwiched therebetween in the YB-axis direction and are respectively connected to both end portions of the elastic portion 52 B.

[0127]Each of the leg portion 55 AB and the leg portion 55 BB has a first part 58 a B of which one end is connected to the elastic portion 52 B and a second part 58 b B which is connected to the other end of the first part 58 a B. The first part 58 a B of the leg portion 55 AB extends in the ZB-axis direction (direction orthogonal to the first surface BaB. The first part 58 a B of the leg portion 55 BB extends in an arc shape along an outer edge of the mirror portion 51 B when viewed in the XB-axis direction. The second parts 58 b B of the leg portion 55 AB and the leg portion 55 BB extend in a manner inclined toward each other while being away from the elastic portion 52 B (in the negative ZB-axis direction).

[0128]The interlock portions 56 B of the pair are respectively provided in end portions of the second parts 58 b B on a side opposite to the elastic portion 52 B. The pair of interlock portions 56 B is formed to be bent inward (toward each other) in a V-shape, for example, when viewed in the XB-axis direction. Each of the interlock portions 56 B includes an inclined surface 56 a B and an inclined surface 56 b B. The inclined surface 56 a B and the inclined surface 56 b B are surfaces (outer surfaces) of the pair of interlock portions 56 B on sides opposite to surfaces facing each other.

[0129]The inclined surfaces 56 a B are inclined toward each other in the negative ZB-axis direction between the interlock portions 56 B of the pair. The inclined surfaces 56 b B are inclined away from each other in the negative ZB-axis direction. When viewed in the XB-axis direction, an inclination angle αB of the inclined surface 56 a B with respect to the ZB-axis is equivalent to or slightly larger than an inclination angle βB of the inclined surface 56 b B with respect to the ZB-axis direction. For example, the inclination angle αB is approximately 45 degrees, and the inclination angle βB is approximately 35 degrees.

[0130]The pair of interlock portions 56 B is connected to the elastic portion 52 B via the pair of leg portions 55 AB and 55 BB, respectively. Accordingly, for example, when a force is applied to the leg portions 55 AB and 55 BB of the pair such that they are sandwiched from both sides in the YB-axis direction, the elastic portion 52 B can be elastically deformed to be compressed in the YB-axis direction, and the distance between the interlock portions 56 B of the pair can be shortened. That is, the distance between the interlock portions 56 B of the pair in the YB-axis direction can be changed in accordance with elastic deformation of the elastic portion 52 B. In addition, an elastic force of the elastic portion 52 B can be applied to the pair of interlock portions 56 B.

[0131]The folded portions 57 B of the pair are respectively provided in end portions of the interlock portions 56 B on a side opposite to the elastic portion 52 B. The pair of folded portions 57 B extends outward (away from each other) and toward a side in the positive ZB-axis direction when viewed in the XB-axis direction. Each of the folded portions 57 B includes an inclined surface 57 a B. The inclined surface 57 a B is a surface of the folded portion 57 B facing the interlock portion 56 B. The inclined surfaces 57 a B are inclined away from each other in the positive ZB-axis direction between the folded portions 57 B of the pair. When viewed in the XB-axis direction, an inclination angle γB of the inclined surface 57 a B with respect to the ZB-axis direction is slightly larger than the inclination angle αB. The inclination angle γB is approximately 60 degrees, for example.

[0132]The connecting portion 54 B connects the mirror portion 51 B and the leg portion 55 BB to each other. When viewed in the XB-axis direction, the connecting portion 54 B is connected to the mirror portion 51 B on a side opposite to the elastic portion 52 B with respect to the center of the mirror portion 51 B in a predetermined direction. This predetermined direction is a direction intersecting both the YB-axis direction and the ZB-axis direction. The connecting portion 54 B is connected to the leg portion 55 BB in a connection part between the first part 58 a B and the second part 58 b B. The center of the mirror portion 51 B is positioned on one side (leg portion 55 BB side) in the YB-axis direction with respect to a center line CL 1 B. The center line CL 1 B is an imaginary straight line passing through the center of a first opening 31 b B (which will be described below) and extending in the ZB-axis direction.

[0133]Here, the first opening 31 b B and a pair of second openings 31 c B are formed in the mounting region 31 B of the base BB. The first opening 31 b B and each of the second openings 31 c B penetrate the device layer 3 B in the ZB-axis direction and are open on both the first surface BaB and the second surface BbB. The second openings 31 c B of the pair are provided such that the first opening 31 b B is sandwiched therebetween in the YB-axis direction. The first opening 31 b B and the second openings 31 c B will be described below in detail.

[0134]The interlock portions 56 B of the pair are inserted into the first opening 31 b B in a state where an elastic force of the elastic portion 52 B is applied in a direction away from each other. Each of the interlock portions 56 B protrudes from the second surface BbB via the first opening 31 b B. Each of the interlock portions 56 B comes into contact with an edge portion 31 d B of the first opening 31 b B on the first surface BaB side on the inclined surface 56 a B. Each of the folded portions 57 B extends from each of the interlock portions 56 B toward the second surface BbB and enters the second opening 31 c B from the second surface BbB side. Each of the folded portions 57 B comes into contact with an edge portion 31 e B of the second opening 31 c B on the second surface BbB side on the inclined surface 57 a B. In this manner, since the interlock portions 56 B come into contact with the edge portions 31 d B of the first opening 31 b B on the first surface BaB side and the folded portions 57 B come into contact with the edge portions 31 e B of the second openings 31 c B on the second surface BbB side, the movable mirror 5 B is prevented from being detached in the ZB-axis direction.

[0135]Here, an opening 41 B is formed in the intermediate layer 4 B. The opening 41 B is open on both sides of the intermediate layer 4 B in the ZB-axis direction. An opening 21 B is formed in the support layer 2 B. The opening 21 B is open on both sides of the support layer 2 B in the ZB-axis direction. In the optical module 1 B, a continuous space S 1 B is constituted of a region inside the opening 41 B of the intermediate layer 4 B and a region inside the opening 21 B of the support layer 2 B. That is, the space S 1 B includes a region inside the opening 41 B of the intermediate layer 4 B and a region inside the opening 21 B of the support layer 2 B.

[0136]The space S 1 B is formed between the support layer 2 B and the device layer 3 B and corresponds to at least the mounting region 31 B and the driving region 32 B. Specifically, a region inside the opening 41 B of the intermediate layer 4 B and a region inside the opening 21 B of the support layer 2 B include a range in which the mounting region 31 B moves when viewed in the ZB-axis direction. A region inside the opening 41 B of the intermediate layer 4 B forms a clearance for causing a part (that is, a part to be in a detached state with respect to the support layer 2 B, for example, the mounting region 31 B in its entirety, the elastic deformation portion 34 b B of each of the elastic support regions 34 B, the first comb-teeth portions 33 a B, and the second comb-teeth portions 31 a B) of the mounting region 31 B and the driving region 32 B, which needs to be separated from the support layer 2 B, to be separated from the support layer 2 B.

[0137]A portion of each of the interlock portions 56 B included in the movable mirror 5 B is positioned in the space S 1 B. Specifically, a portion of each of the interlock portions 56 B is positioned in a region inside the opening 21 B of the support layer 2 B through a region inside the opening 41 B of the intermediate layer 4 B. A portion of each of the interlock portions 56 B protrudes into the space S 1 B from the second surface BbB by approximately 100 μm, for example. As described above, since a region inside the opening 41 B of the intermediate layer 4 B and a region inside the opening 21 B of the support layer 2 B include the range in which the mounting region 31 B moves when viewed in the ZB-axis direction, a portion of each of the interlock portions 56 B of the movable mirror 5 B positioned in the space S 1 B does not come into contact with the intermediate layer 4 B and the support layer 2 B when the mounting region 31 B reciprocates in the direction AB.

[0138]Here, as illustrated in FIG. 19( b ) , an inner surface of the first opening 31 b B includes inclined surfaces SAB of a pair facing each other in the YB-axis direction and inclined surfaces SBB of a pair facing each other in the YB-axis direction. Each of the inclined surfaces SAB includes one end SAaB and the other end SAbB, and each of the inclined surfaces SBB includes one end SBaB and the other end SBbB. When viewed in the ZB-axis direction, the inclined surfaces SAB of the pair are inclined such that the distance therebetween increases from the one end SAaB toward the other end SAbB (for example, with respect to the XB-axis direction), and the inclined surfaces SBB of the pair are inclined to a side opposite to the inclined surfaces SAB of the pair such that the distance therebetween increases from the one end SBaB toward the other end SBbB (for example, with respect to the XB-axis direction). The inclined surface SAB and the inclined surface SBB face each other in the XB-axis direction (direction orthogonal to the YB-axis direction in which the inclined surfaces SAB of the pair face each other).

[0139]On each of both sides in the YB-axis direction, the other end SAbB on the inclined surface SAB and the other end SBbB on the inclined surface SBB are connected to each other via a connection surface SCB extending in the XB-axis direction. On each of both sides in the YB-axis direction, the inclined surface SAB, the inclined surface SBB, and the connection surface SCB define one corner portion. On each of both sides in the XB-axis direction, the one end SAaB of the inclined surface SAB and the one end SBaB of the inclined surface SBB are connected to each other via a connection surface SDB extending in the YB-axis direction. The connection surface SDB has a V-shape widened outward (away from each other) in an intermediate portion when viewed in the ZB-axis direction. The first opening 31 b B has a line symmetrical shape with respect to a center line CL 2 B passing through the center of the first opening 31 b B and being parallel to the YB-axis direction when viewed in the ZB-axis direction. In this case, the first opening 31 b B has a decagonal shape when viewed in the ZB-axis direction.

[0140]The inner surface of each of the second openings 31 c B includes inclined surfaces SEB of a pair facing each other in the XB-axis direction. The inclined surfaces SEB of the pair are inclined away from each other while being away from the first opening 31 b B when viewed in the ZB-axis direction. In the YB-axis direction, one inclined surface SEB faces the inclined surface SAB and the other inclined surface SEB faces the inclined surface SBB. The pair of inclined surfaces SEB has line symmetrical shapes with respect to the inclined surface SAB and the inclined surface SBB in the YB-axis direction when viewed in the ZB-axis direction. Each of the second openings 31 c B has a line symmetrical shape with respect to the center line CL 2 B when viewed in the ZB-axis direction. In this case, the second opening 31 c B has a hexagonal shape when viewed in the ZB-axis direction.

[0141]The maximum value for the size (that is, the gap between the other ends SAbB of the inclined surfaces SAB of the pair) of the first opening 31 b B in YB-axis direction is a value allowing only a portion of elastic deformation of the elastic portion 52 B to be released (that is, the elastic portion 52 B does not reach the natural length) when the pair of interlock portions 56 B is disposed inside the first opening 31 b B. Therefore, when the pair of interlock portions 56 B is disposed inside the first opening 31 b B, the pair of interlock portions 56 B presses the inner surface of the first opening 31 b B due to an elastic force of the elastic portion 52 B, and a reaction force from the inner surface of the first opening 31 b B is applied to the pair of interlock portions 56 B. The movable mirror 5 B is supported in the base BB by the reaction force. More specifically, due to an elastic force of the elastic portion 52 B, each of the interlock portions 56 B comes into internal contact with a corner portion defined by the inclined surface SAB and the inclined surface SBB of the first opening 31 b B, and each of the folded portions 57 B is in a state of being in contact with the inclined surface SEB. Accordingly, the movable mirror 5 B is positionally aligned in the XB-axis direction and the YB-axis direction.

[0142]Next, with reference to FIGS. 20 and 21 , an example of a process of mounting the movable mirror 5 B will be described. First, as illustrated in FIG. 20 , in a state where the distance between the interlock portions 56 B of the pair is decreased, the pair of interlock portions 56 B is inserted into the first opening 31 b B from the first surface BaB side. At this time, the pair of interlock portions 56 B is not in contact with the inner surface of the first opening 31 b B.

[0143]Subsequently, as illustrated in FIG. 21 , the distance between the interlock portions 56 B of the pair is increased. Accordingly, each of the interlock portions 56 B moves toward the corner portion defined by the inclined surface SAB and the inclined surface SBB of the first opening 31 b B. At this time, depending on the posture of the movable mirror 5 B, there are cases where each of the interlock portions 56 B comes into contact with one (which will hereinafter be referred to as a contact surface) of the inclined surface SAB and the inclined surface SBB in advance. In this case, each of the interlock portions 56 B slides outward (to the second opening 31 c B side) on the contact surface in the YB-axis direction due to an elastic force of the elastic portion 52 B and abuts the other (that is, a facing surface facing the contact surface) of the inclined surface SAB and the inclined surface SBB while being in contact with the contact surface. Accordingly, each of the interlock portions 56 B comes into internal contact with a corner portion defined by the inclined surface SAB and the inclined surface SBB and is positionally aligned (self-aligned due to an elastic force) in the XB-axis direction and the YB-axis direction.

[0144]In addition, each of the interlock portions 56 B comes into contact with an edge portion 51 d B of the first opening 31 b B on the first surface BaB side on the inclined surface 56 a B. Each of the interlock portions 56 B slides toward a side in the positive ZB-axis direction on the edge portion 51 d B due to an elastic force of the elastic portion 52 B. Accordingly, each of the folded portions 57 B enters the second opening 31 c B from the second surface BbB side. Each of the folded portions 57 B moves to a position (position in FIG. 19 ) where the inclined surface 57 a B comes into contact with an edge portion 51 e B of the second opening 31 c B on the second surface BbB side. Accordingly, the pair of interlock portions 56 B is interlocked at the position, and the movable mirror 5 B is positionally aligned (self-aligned due to an elastic force) in the ZB-axis direction. That is, the movable mirror 5 B is self-aligned in a three-dimensional manner utilizing an elastic force of the elastic portion 52 B.

[0145][Fixed Mirror and Surrounding Structure Thereof]

[0146]The fixed mirror 6 B and the surrounding structure thereof are similar to the foregoing movable mirror 5 B and the surrounding structure thereof, except that the mounting region is not movable. That is, as illustrated in FIGS. 22 and 23 , the fixed mirror (optical element) 6 B has the mirror portion (optical portion) 61 B, an elastic portion 62 B, a support portion 63 B, and a connecting portion 64 B. The fixed mirror 6 B is mounted on the base BB in a state where the mirror surface 61 a B is positioned on a plane intersecting (for example, orthogonal to) the first surface BaB and the mirror surface 61 a B is positioned on the first surface BaB side of the base BB. The fixed mirror 6 B is integrally formed by a MEMS technology (patterning and etching). Therefore, the thickness (size in the YB-axis direction orthogonal to the mirror surface 61 a B) of the fixed mirror 6 B is uniform in each portion. For example, the thickness thereof is within a range of approximately 10 μm to 20 μm. In addition, the mirror portion 61 B, the elastic portion 62 B, the support portion 63 B, and the connecting portion 64 B are provided to be positioned on the same plane when viewed in the XB-axis direction (direction along both the mirror surface 61 a B and the first surface BaB).

[0147]The mirror portion 61 B is formed to have a plate shape (for example, a disk shape) having the mirror surface (optical surface) 61 a B as a main surface. The diameter of the mirror surface 61 a B is approximately 1 mm, for example. The elastic portion 62 B is formed to have an arc shape (for example, a semicircular arc shape) being separated from the mirror portion 61 B and surrounding the mirror portion 61 B when viewed in the YB-axis direction.

[0148]The support portion 63 B has a pair of leg portions 65 AB and 65 BB, a pair of interlock portions (protrusion portions) 66 B, and a pair of folded portions 67 B. The leg portions 65 AB and 65 BB of the pair are provided such that the mirror portion 61 B is sandwiched therebetween in the XB-axis direction and are respectively connected to both end portions of the elastic portion 62 B.

[0149]Each of the leg portion 65 AB and the leg portion 65 BB has a first part 68 a B of which one end is connected to the elastic portion 62 B and a second part 68 b B which is connected to the other end of the first part 68 a B. The first part 68 a B of the leg portion 65 AB extends in the ZB-axis direction (direction orthogonal to the first surface BaB). The first part 68 a B of the leg portion 65 BB extends in a circular arc shape along an outer edge of the mirror portion 61 B when viewed in the YB-axis direction. The second parts 68 b B of the leg portion 65 AB and the leg portion 65 BB extend in a manner inclined toward each other while being away from the elastic portion 62 B (in the negative ZB-axis direction).

[0150]The interlock portions 66 B of the pair are respectively provided in end portions of the second parts 68 b B on a side opposite to the elastic portion 62 B. The pair of interlock portions 66 B is formed to be bent inward (toward each other) in a V-shape, for example, when viewed in the YB-axis direction. Each of the interlock portions 66 B includes an inclined surface 66 a B and an inclined surface 66 b B. The inclined surface 66 a B and the inclined surface 66 b B are surfaces (outer surfaces) of the pair of interlock portions 66 B on sides opposite to surfaces facing each other.

[0151]The inclined surfaces 66 a B are inclined toward each other in the negative ZB-axis direction between the interlock portions 66 B of the pair. The inclined surfaces 66 b B are inclined away from each other in the negative ZB-axis direction. When viewed in the YB-axis direction, inclination angles of the inclined surfaces 66 a B and 66 b B with respect to the ZB-axis direction are similar to those of the inclined surfaces 56 a B and 56 b B in the movable mirror 5 B.

[0152]The interlock portions 66 B of the pair are connected to the elastic portion 62 B via the leg portions 65 AB and 65 BB of the pair, respectively. Accordingly, for example, when a force is applied to the leg portions 65 AB and 65 BB of the pair such that they are sandwiched from both sides in the XB-axis direction, the elastic portion 62 B can be elastically deformed to be compressed in the XB-axis direction, and the distance between the interlock portions 66 B of the pair can be shortened. That is, the distance between the interlock portions 66 B of the pair in the XB-axis direction can be changed in accordance with elastic deformation of the elastic portion 62 B. In addition, an elastic force of the elastic portion 62 B can be applied to the pair of interlock portions 66 B.

[0153]The of folded portions 67 B of the pair are respectively provided in end portions of the interlock portions 66 B on a side opposite to the elastic portion 62 B. The folded portions 67 B extend outward (away from each other) and toward a side in the positive ZB-axis direction when viewed in the YB-axis direction. Each of the folded portions 67 B includes an inclined surface 67 a B. The inclined surface 67 a B is a surface of the folded portion 67 B facing the interlock portion 66 B. The inclined surfaces 67 a B are inclined away from each other in the positive ZB-axis direction between the folded portions 67 B of the pair. When viewed in the YB-axis direction, the inclination angle of the inclined surface 67 a B with respect to the ZB-axis direction is similar to that of the inclined surface 57 a B in the movable mirror 5 B.

[0154]The connecting portion 64 B connects the mirror portion 61 B and the leg portion 65 BB to each other. When viewed in the YB-axis direction, the connecting portion 64 B is connected to the minor portion 61 B on a side opposite to the elastic portion 62 B with respect to the center of the mirror portion 61 B in a predetermined direction. This predetermined direction is a direction intersecting both the XB-axis direction and the ZB-axis direction. The connecting portion 64 B is connected to the leg portion 65 BB in a connection part between the first part 68 a B and the second part 68 b B. The center of the mirror portion 61 B is positioned on one side (leg portion 65 BB side) in the XB-axis direction with respect to a center line CL 3 B. The center line CL 3 B is an imaginary straight line passing through the center of a first opening 37 a B (which will be described below) and extending in the ZB-axis direction.

[0155]Here, the first opening 37 a B and a pair of second openings 37 b B are formed in the mounting region 37 B of the base BB. The first opening 37 a B and each of the second openings 37 b B penetrate the device layer 3 B in the ZB-axis direction and are open on both the first surface BaB and the second surface BbB. The second openings 37 b B of the pair are provided such that the first opening 37 a B is sandwiched therebetween in the XB-axis direction.

[0156]The pair of interlock portions 66 B is inserted into the first opening 37 a B in a state where an elastic force of the elastic portion 62 B is applied in a direction away from each other. Each of the interlock portions 66 B protrudes from the second surface BbB via the first opening 37 a B. Each of the interlock portions 66 B comes into contact with an edge portion of the first opening 37 a B on the first surface BaB side on the inclined surface 66 a B. The folded portions 67 B of the pair respectively extend from the interlock portions 66 B toward the second surface BbB and enter the second openings 37 b B from the second surface BbB side. Each of the folded portions 67 B comes into contact with an edge portion of the second opening 37 b B on the second surface BbB side on the inclined surface 67 a B. In this manner, since the interlock portions 66 B come into contact with the edge portions of the first opening 37 a B on the first surface BaB side and the folded portions 67 B come into contact with the edge portions of the second openings 37 b B on the second surface BbB side, the fixed mirror 6 B is prevented from being detached in the ZB-axis direction.

[0157]Here, an opening 42 B is formed in the intermediate layer 4 B. The opening 42 B includes the first opening 37 a B of the mounting region 37 B when viewed in the ZB-axis direction and is open on both sides of the intermediate layer 4 B in the ZB-axis direction. An opening 22 B is formed in the support layer 2 B. The opening 22 B includes the first opening 37 a B of the mounting region 37 B when viewed in the ZB-axis direction and is open on both sides of the support layer 2 B in the ZB-axis direction. In the optical module 1 B, a continuous space S 2 B is constituted of a region inside the opening 42 B of the intermediate layer 4 B and a region inside the opening 22 B of the support layer 2 B. That is, the space S 2 B includes a region inside the opening 42 B of the intermediate layer 4 B and a region inside the opening 22 B of the support layer 2 B.

[0158]A portion of each of the interlock portions 66 B included in the fixed mirror 6 B is positioned in the space S 2 B. Specifically, a portion of each of the interlock portions 66 B is positioned in a region inside the opening 22 B of the support layer 2 B through a region inside the opening 42 B of the intermediate layer 4 B. A portion of each of the interlock portions 66 B protrudes into the space S 2 B from a surface of the device layer 3 B on the intermediate layer 4 B side by approximately 100 μm, for example.

[0159]Here, each of the inner surfaces of the first opening 37 a B and the second openings 37 b B has a configuration similar to those of the inner surfaces of the first opening 31 b B and the second openings 31 c B in the mounting region 31 B. Therefore, when the pair of interlock portions 66 B is disposed in the first opening 37 a B, the pair of interlock portions 66 B presses the inner surface of the first opening 37 a B due to an elastic force of the elastic portion 62 B, and a reaction force from the inner surface of the first opening 37 a B is applied to the pair of interlock portions 66 B. The fixed mirror 6 B is supported in the base BB by the reaction force. Similar to the case of the movable mirror 5 B, the fixed mirror 6 B is also self-aligned in a three-dimensional manner utilizing the inner surface of the first opening 37 a B and an elastic force.

[0160][Operations and Effects]

[0161]In the optical module 1 B, the first opening 31 b B which is open on the first surface BaB and the second surface BbB and the second opening 31 c B which is open on the second surface BbB are provided in the base BB. In addition, the support portion 53 B supporting the optical portion on the base BB includes the interlock portion 56 B which protrudes from the second surface BbB via the first opening 31 b B and the folded portion 57 B which extends from the interlock portion 56 B toward the second surface BbB and enters the second opening 31 c B from the second surface BbB side. Accordingly, even when the movable mirror 5 B has a tendency of being deviated in a direction intersecting the first surface BaB due to an impact, for example, since the folded portion 57 B comes into contact with the edge portion 31 e B of the second opening 31 c B on the second surface BbB side, it is possible to curb falling off of the movable mirror 5 B. Thus, according to the optical module 1 B, it is possible to realize reliable mounting of the movable mirror 5 B.

[0162]In addition, in the optical module 1 B, the second openings 31 c B of the pair are provided such that the first opening 31 b B is sandwiched therebetween, and the folded portions 57 B are provided in the pair of interlock portions 56 B and enter the pair of second openings 31 c B, respectively. Accordingly, it is possible to more reliably curb falling off of the movable mirror 5 B.

[0163]In addition, in the optical module 1 B, the interlock portions 56 B come into contact with the edge portions 31 d B of the first opening 31 b B on the first surface BaB side. Accordingly, it is possible to even more reliably curb falling off of the movable mirror 5 B.

[0164]In addition, in the optical module 1 B, the folded portions 57 B come into contact with the edge portions 31 e B of the second openings 31 c B on the second surface BbB side. Accordingly, it is possible to even more reliably curb falling off of the movable mirror 5 B. Particularly, when the interlock portions 56 B come into contact with the edge portions 31 d B of the first opening 31 b B on the first surface BaB side and the folded portions 57 B come into contact with the edge portions 31 e B of the second openings 31 c B on the second surface BbB side, the base BB is sandwiched between two points close to each other and is supported by the interlock portions 56 B and the folded portions 57 B. Therefore, it is possible to further improve the tolerance to an impact in the XB-axis direction and the ZB-axis direction.

[0165]In addition, in the optical module 1 B, the interlock portions 56 B of the pair, in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion 52 B, are inserted into the first opening 31 b B in a state where an elastic force of the elastic portion 52 B is applied. Then, the movable mirror 5 B is supported in the base BB by a reaction force of the elastic force applied from the inner surface of the first opening 31 b B to the pair of interlock portions 56 B. Accordingly, the movable mirror 5 B can be mounted on the base BB utilizing an elastic force of the elastic portion 52 B. Moreover, the movable mirror 5 B is mounted on the base BB utilizing an elastic force. Furthermore, since falling off of the movable mirror 5 B is curbed by the folded portions 57 B, it is possible to reduce a using amount of a bonding agent or to eliminate the need for a bonding agent. The following advantages can be achieved by reducing the using amount of a bonding agent. That is, occurrence of contamination or the like on the mirror surface 51 a B or occurrence of destruction or malfunction in the driving region 32 B of the optical module 1 B caused by a sticking-out bonding material can be curbed. In addition, it is possible to reduce the size of the optical module 1 B by reducing a region (space between constituent elements) for forming a bonding material.

[0166]In addition, in the optical module 1 B, the interlock portions 56 B of the pair are inserted into the first opening 31 b B in a state where an elastic force of the elastic portion 52 B is applied in a direction away from each other. Accordingly, it is possible to favorably mount the movable mirror 5 B on the base BB utilizing an elastic force.

[0167]In addition, in the optical module 1 B, when viewed in the ZB-axis direction, the inner surface of the first opening 31 b B includes the inclined surfaces SAB of the pair which are inclined such that the distance therebetween increases from the one end SAaB toward the other end SAbB, and the inclined surfaces SBB of the pair which face the inclined surfaces SAB of the pair in the XB-axis direction orthogonal to the YB-axis direction in which the inclined surfaces SAB of the pair face each other. Accordingly, when the interlock portions 56 B are inserted into the first opening 31 b B and an elastic deformation of the elastic portion 52 B is released, it is possible to positionally align the movable mirror 5 B in a direction along the first surface BaB by causing the interlock portions 56 B to slide on the inclined surfaces SAB and to abut the inclined surfaces SBB due to an elastic force.

[0168]In addition, in the optical module 1 B, the base BB has the support layer 2 B and the device layer 3 B which is provided on the support layer 2 B and includes the first surface BaB and the second surface BbB. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 B.

[0169]In addition, in the optical module 1 B, the base BB has the intermediate layer 4 B which is provided between the support layer 2 B and the device layer 3 B. Accordingly, it is possible to more favorably realize a configuration for reliable mounting of the movable mirror 5 B.

[0170]In addition, in the optical module 1 B, the movable mirror 5 B, the fixed mirror 6 B, and the beam splitter 7 B are disposed such that the interference optical system 10 B is constituted. Accordingly, it is possible to obtain an FTIR having improved sensitivity.

[0171]In addition, in the optical module 1 B, the support layer 2 B is the first silicon layer of the SOI substrate, the device layer 3 B is the second silicon layer of the SOI substrate, and the intermediate layer 4 B is the insulating layer of the SOI substrate. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 B with respect to the device layer 3 B using the SOI substrate.

[0172]In addition, in the optical module 1 B, the light incident unit 8 B is disposed such that measurement light is incident on the interference optical system 10 B from outside, and the light emission unit 9 B is disposed such that the measurement light is emitted from the interference optical system 10 B to the outside. Accordingly, it is possible to obtain an FTIR including the light incident unit 8 B and the light emission unit 9 B.

[0173]In addition, in the optical module 1 B, the movable mirror 5 B penetrates the mounting region 31 B of the device layer 3 B, and a portion of each of the interlock portions 56 B of the movable mirror 5 B is positioned in a space S 1 B formed between the support layer 2 B and the device layer 3 B. Accordingly, for example, since there is no limitation on the size and the like of each of the interlock portions 56 B and the folded portions 57 B, the movable mirror 5 B can be stably and firmly fixed to the mounting region 31 B of the device layer 3 B. That is, since the optical module 1 B employs a configuration having the space S 1 B, it is possible to employ a shape including the folded portions 57 B, as the shape of the movable mirror 5 B. Then, regarding the shape of the fragile movable mirror 5 B, a shape deliberately including the folded portions 57 B is employed, so that the optical module 1 B in which tolerance to an external force or an environmental change is enhanced and which can tolerate installation in a portable instrument or the like is realized.

[0174][Modification Examples]

[0175]Hereinabove, an embodiment of another aspect of the present disclosure has been described. However, another aspect of the present disclosure is not limited to the foregoing embodiment. For example, the material and the shape of each configuration are not limited to the materials and the shapes described above, and various materials and shapes can be employed.

[0176]In addition, the first opening 31 b B may be constituted as in a first modification example illustrated in FIG. 24 . In the first modification example, the other end SAbB of the inclined surface SAB and the other end SBbB of the inclined surface SBB are directly connected to each other on each of both sides in the YB-axis direction. When viewed in the ZB-axis direction, an inclination angle δB of the pair of inclined surfaces SAB with respect to a straight line (here, the center line CL 2 B) passing through the other end SAbB of one inclined surface SAB and the other end SAbB of the other inclined surface SAB is 45 degrees or smaller. The inclination angle δB is approximately 35 degrees, for example. Even in the first modification example, similar to the foregoing embodiment, the first opening 31 b B has a line symmetrical shape with respect to the center line CL 2 B when viewed in the ZB-axis direction. Even in such a first modification example, similar to the foregoing embodiment, it is possible to realize reliable mounting of the movable mirror 5 B. Moreover, a reaction force of an elastic force applied to the interlock portions 56 B can be further dispersed in the XB-axis direction than in the YB-axis direction. Accordingly, it is possible to improve the tolerance to an impact in the XB-axis direction, which is important to improve the reliability of an FTIR.

[0177]In addition, in the foregoing embodiment, the first opening 31 b B includes the pair of inclined surfaces SAB and the pair of inclined surfaces SBB. However, the first opening 31 b B may include the pair of inclined surfaces SAB and a reference surface which extends along a reference line (in FIG. 19 , the center line CL 2 B) connecting the other ends SAbB of the inclined surfaces SAB of the pair to each other. In this case, when the interlock portions 56 B are inserted into the first opening 31 b B and an elastic deformation of the elastic portion 52 B is partially released, it is possible to positionally align the movable mirror 5 B in a direction along the first surface BaB by causing the interlock portions 56 B to slide on the inclined surfaces SAB and to abut the reference surface due to an elastic force.

[0178]In addition, in the foregoing embodiment, the mirror surface 51 a B is positioned on the first surface BaB side of the base BB. However, the movable mirror 5 B may be mounted on the base BB in a state where a portion or the entirety of the mirror surface 51 a B protrudes to the second surface BbB side of the base BB. In this case, in a part of the mounting region 31 B defining the first opening 31 b B, a part facing the mirror surface 51 a B is cut out to allow the measurement light L 0 B to pass therethrough. In addition, the elastic portion 52 B may be formed to have an annular shape (for example, a circular shape) being separated from the mirror portion 51 B and surrounding the mirror portion 51 B when viewed in the XB-axis direction. In addition, in the foregoing embodiment, the interlock portions 56 B come into contact with the edge portions 31 d B of the first opening 31 b B on the first surface BaB side on the inclined surface 56 a B. However, in addition to this, the interlock portions 56 B may come into contact with the edge portions of the first opening 31 b B on the second surface BbB side on the inclined surface 56 b B.

[0179]In addition, in the foregoing embodiment, each of the second openings 31 c B does not have to be open on the first surface BaB and may be a recess portion which is open on the second surface BbB, for example. In addition, the first opening 31 b B and the second openings 31 c B may communicate with each other. For example, a recess portion open on the second surface BbB may be provided between the first opening 31 b B and the second opening 31 c B, such that the first opening 31 b B and the second opening 31 c B communicate with each other via the recess portion. In addition, the folded portions 57 B need only enter the second openings 31 c B and may be separated from the edge portions 31 e B of the second openings 31 c B on the second surface BbB side.

[0180]In addition, a movable mirror 5 AB may be constituted as in the modification example illustrated in FIGS. 25 and 26 . In the movable mirror 5 AB, the leg portion 55 AB and the leg portion 55 BB of the support portions 53 B extend in the ZB-axis direction in a manner parallel to each other. The interlock portions 56 B of the pair are formed to be bent outward (away from each other) in a V-shape when viewed in the XB-axis direction. The inclined surface 56 a B and the inclined surface 56 b B of each of the interlock portions 56 B are surfaces (inner surfaces) of the interlock portions 56 B of the pair facing each other. The inclined surfaces 56 a B are inclined away from each other in the negative ZB-axis direction between the interlock portions 56 B of the pair. The inclined surfaces 56 b B are inclined toward each other in the negative ZB-axis direction. The folded portions 57 B of the pair extend inward (toward each other) and toward a side in the positive ZB-axis direction when viewed in the XB-axis direction. The inclined surfaces 57 a B are inclined toward each other in the positive ZB-axis direction between the folded portions 57 B of the pair. The connecting portion 54 B connects the mirror portion 51 B and the elastic portion 52 B to each other along the center line CL 1 B. The center of the mirror portion 51 B is positioned along the center line CL 1 B.

[0181]The movable mirror 5 AB further has handles 59 B. The handles 59 B have displacement portions of a pair 59 a B which are respectively connected to both the end portions of the elastic portion 52 B. The displacement portions 59 a B of the pair are provided to face each other in the YB-axis direction and extend in the positive ZB-axis direction from the end portions of the elastic portion 52 B. An intermediate portion of each of the displacement portions 59 a B is bent inward in a V-shape when viewed in the XB-axis direction. The displacement portions 59 a B of the pair are positioned on sides in the positive ZB-axis direction with respect to the mirror portion 51 B, the elastic portion 52 B, and the support portion 53 B in a state where the movable mirror 5 AB is mounted in the mounting region 37 B. In this modification example, one second opening 31 c B is foamed in the mounting region 31 B, and first openings 31 b B of a pair are formed such that the second opening 31 c B is sandwiched therebetween in the YB-axis direction. The interlock portions 56 B of the pair are respectively inserted into the pair of first openings 31 b B in a state where an elastic force of the elastic portion 52 B is applied in a direction toward each other.

[0182]When the movable mirror 5 AB is mounted on the base BB, the interlock portions 56 B of the pair are respectively inserted into the pair of first openings 31 b B in a state where the distance between the interlock portions 56 B of the pair is increased by applying a force to the pair of displacement portions 59 a B. For example, after one interlock portion 56 B is inserted into the first opening 31 b B in advance and is brought into contact with the edge portion of the first opening 31 b B, a force is applied to the pair of displacement portions 59 a B, and then the other interlock portion 56 B is inserted into the first opening 31 b B in a state where the other interlock portion 56 B is displaced to be away from the one interlock portion 56 B. Subsequently, the pair of interlock portions 56 B is brought into contact with the inner surfaces of the first openings 31 b B and the movable mirror 5 AB is fixed to the base BB by releasing a force being applied to the pair of displacement portions 59 a B. This modification example is similar to the foregoing embodiment in respect that self-alignment is performed in a three-dimensional manner utilizing an elastic force of the elastic portion 52 B, and each of the pair of folded portions 57 B enters the second opening 31 c B from the second surface BbB side and comes into contact with the edge portion of the second opening 31 c B on the second surface BbB side. Even in such a modification example, similar to the foregoing embodiment, it is possible to realize reliable mounting of the movable mirror 5 AB. In the foregoing modification example, one second opening 31 c B is formed. However, second openings 31 c B of a pair may be formed to be sandwiched between the first openings 31 b B of the pair.

[0183]In addition, in the foregoing embodiment, the fixed mirror 6 B is mounted in the device layer 3 B. However, the fixed minor 6 B may be mounted in the support layer 2 B or the intermediate layer 4 B. In addition, in the foregoing embodiment, the beam splitter 7 B is mounted in the support layer 2 B. However, the beam splitter 7 B may be mounted in the device layer 3 B or the intermediate layer 4 B. In addition, the beam splitter 7 B is not limited to a cube-type beam splitter and may be a plate-type beam splitter.

[0184]In addition, the optical module 1 B may include a light emitting element for generating measurement light to be incident on the light incident unit 8 B, in addition to the light incident unit 8 B. Alternatively, the optical module 1 B may include a light emitting element for generating measurement light to be incident on the interference optical system 10 B, in place of the light incident unit 8 B. In addition, the optical module 1 B may include a light receiving element for detecting measurement light (interference light) emitted from the light emission unit 9 B, in addition to the light emission unit 9 B. Alternatively, the optical module 1 B may include a light receiving element for detecting measurement light (interference light) emitted from the interference optical system 10 B, in place of the light emission unit 9 B.

[0185]In addition, a first penetration electrode which is electrically connected to each of the actuator regions 33 B and a second penetration electrode which is electrically connected to each of both the end portions 34 a B of each of the elastic support regions 34 B may be provided in the support layer 2 B and the intermediate layer 4 B (in only the support layer 2 B when the intermediate layer 4 B is not present), and a voltage may be applied to a part between the first penetration electrode and the second penetration electrode. In addition, the actuator for moving the mounting region 31 B is not limited to an electrostatic actuator, and a piezoelectric actuator, an electromagnetic actuator, or the like may be adopted, for example. In addition, the optical module 1 B is not limited to a module for constituting an FTIR and may be a module for constituting other optical systems.

[0186]Moreover, in the foregoing embodiment, a movable mirror and a fixed mirror have been described as examples of optical elements to be mounted on the base BB. In this example, the optical surface is a mirror surface. However, the optical element which becomes a mounting target is not limited to a mirror. For example, an arbitrary element such as a grating, an optical filter, or the like can be adopted. The following are appendixes of the foregoing second embodiment.

[0187][Appendix 1]

[0188]An optical module including:

[0189]a base; and

[0190]an optical element which is mounted on the base, in which

[0191]the base has a first surface and a second surface which face each other, and a first opening which is open on the first surface and the second surface and a second opening which is open on the second surface are provided in the base,

[0192]the optical element has an optical portion which has an optical surface and a support portion which supports the optical portion on the base, and

[0193]the support portion includes a protrusion portion which protrudes from the second surface via the first opening and a folded portion which extends from the protrusion portion toward the second surface and enters the second opening from the second surface side.

[0194][Appendix 2]

[0195]The optical module according to appendix 1, in which

[0196]a pair of second openings is provided such that the first opening is sandwiched therebetween,

[0197]a pair of protrusion portions is provided, and

[0198]the folded portion is provided in each of the pair of protrusion portions and enters each of the pair of second openings.

[0199][Appendix 3]

[0200]The optical module according to appendix 1 or 2, in which

[0201]the protrusion portion comes into contact with at least an edge portion of the first opening on the first surface side.

[0202][Appendix 4]

[0203]The optical module according to any one of appendixes 1 to 3, in which

[0204]the folded portion comes into contact with an edge portion of the second opening on the second surface side.

[0205][Appendix 5]

[0206]The optical module according to any one of appendixes 1 to 4, in which

[0207]the optical element further has an elastic portion,

[0208]a pair of protrusion portions is provided,

[0209]the pair of protrusion portions, in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion, are inserted into the first opening in a state where an elastic force of the elastic portion is applied, and

[0210]the optical element is supported in the base by a reaction force of the elastic force applied from an inner surface of the first opening to the pair of protrusion portions.

[0211][Appendix 6]

[0212]The optical module according to appendix 5, in which

[0213]the pair of protrusion portions is inserted into the first opening in a state where an elastic force of the elastic portion is applied in a direction away from each other.

[0214][Appendix 7]

[0215]The optical module according to appendix 5 or 6, in which

[0216]the inner surface of the first opening includes a pair of inclined surfaces which is inclined such that a distance therebetween increases from one end toward the other end when viewed in a direction intersecting the first surface, and a facing surface which faces the pair of inclined surfaces in a direction intersecting a direction in which the pair of inclined surfaces faces each other.

[0217][Appendix 8]

[0218]The optical module according to appendix 7, in which

[0219]when viewed in a direction intersecting the first surface, an inclination angle of the pair of inclined surfaces with respect to a straight line passing through the other end of one inclined surface and the other end of the other inclined surface is 45 degrees or smaller.

[0220][Appendix 9]

[0221]The optical module according to any one of appendixes 1 to 8, in which

[0222]the base has a support layer, and a device layer which is provided on the support layer and includes the first surface and the second surface.

[0223][Appendix 10]

[0224]The optical module according to appendix 9, in which

[0225]the base has an intermediate layer which is provided between the support layer and the device layer.

[0226][Appendix 11]

[0227]The optical module according to appendix 10, further including:

[0228]a fixed mirror which is mounted in the support layer, the device layer, or the intermediate layer; and

[0229]a beam splitter which is mounted in the support layer, the device layer, or the intermediate layer, in which

[0230]the optical element is a movable mirror which includes the optical surface serving as a mirror surface,

[0231]the device layer has a mounting region in which the optical element is mounted and a driving region which is connected to the mounting region, and

[0232]the movable mirror, the fixed mirror, and the beam splitter are disposed such that an interference optical system is constituted.

[0233][Appendix 12]

[0234]The optical module according to appendix 11, in which

[0235]the support layer is a first silicon layer of an SOI substrate,

[0236]the device layer is a second silicon layer of the SOI substrate, and

[0237]the intermediate layer is an insulating layer of the SOI substrate.

[0238][Appendix 13]

[0239]The optical module according to appendix 11 or 12, further including:

[0240]a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside; and

[0241]a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside.

[0242]Third Embodiment

[0243]Optical modules in which an interference optical system is formed on a silicon-on-insulator (SOI) substrate by a micro electro mechanical systems (MEMS) technology are known (for example, refer to Japanese Unexamined Patent Publication No. 2012-524295). Such optical modules have attracted attention because they can provide users with a Fourier transform infrared spectroscopic analyzer (FTIR) in which highly accurate optical disposition is realized.

[0244]Specification of United States Patent Application, Publication No. 2002/0186477 discloses a process of manufacturing an optical system. In this process, first, a template substrate and an optical bench are prepared. An alignment slot is formed in the template substrate through etching. A bond pad is disposed on a main surface of the optical bench. Subsequently, the template substrate is attached to the main surface of the optical bench such that the alignment slot is disposed on the bond pad. Subsequently, an optical element is inserted into the alignment slot while being positionally aligned along a side wall of the alignment slot and is positioned on the bond pad. Then, the optical element is bonded to the optical bench due to a reflow of the bond pad.

[0245]The foregoing optical modules have the following problem in respect that the size of a movable mirror depends on a degree of completion of deep cutting with respect to an SOI substrate, for example. That is, since the degree of completion of deep cutting with respect to an SOI substrate is approximately 500 μm at the maximum, there is a limitation in increasing the size of a movable mirror for the sake of improvement of sensitivity of an FTIR. Here, a technology of mounting a separately formed movable mirror in a device layer (for example, a layer of an SOI substrate in which a driving region is formed) may be taken into consideration.

[0246]In contrast, in a case where the process disclosed in the specification of United States Patent Application, Publication No. 2002/0186477 is used when the MEMS device disclosed in Japanese Unexamined Patent Publication No. 2012-524295 is prepared, mounting is performed by providing an alignment slot in a movable mounting region which is connected to an actuator and inserting an optical element such as a movable mirror into the alignment slot. However, in such a mounting method, it is difficult to improve the accuracy of mounting an optical element.

[0247]An object of still another aspect of the present disclosure is to provide an optical module in which accuracy of mounting an optical element can be improved and mounting strength can be ensured.

[0248]According to still another aspect of the present disclosure, there is provided an optical module including an optical element, and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface, an elastic portion which is provided around the optical portion, and a pair of support portions to which an elastic force is applied and in which a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portion includes an interlock portion which is inserted into the opening in a state where an elastic force of the elastic portion is applied, and a contact portion which comes into contact with the mounting region in a state where the interlock portion is inserted into the opening. The optical element is supported in the mounting region by a reaction force of the elastic force applied from an inner surface of the opening to the interlock portion in a state where the optical surface intersects the main surface and is bonded to the mounting region in the contact portion.

[0249]In this optical module, the optical element has the elastic portion, and the pair of support portions in which the distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. Meanwhile, the opening communicating with the main surface is formed in the mounting region of the base on which the optical element is mounted. Therefore, as an example, when the support portions are inserted into the opening in a state where the elastic portion is elastically deformed such that the distance between the support portions is decreased, and when an elastic deformation of the elastic portion is partially released, the distance between the support portions increases inside the opening, so that the support portions can be brought into contact with the inner surface of the opening. Accordingly, due to a reaction force of an elastic force applied from the inner surface of the opening to the support portions, a position of the optical element with respect to the mounting region is accurately defined on the inner surface of the opening. Moreover, the optical element is bonded to the mounting region in bonding portions of the support portions in a state of being supported due to a reaction force of an elastic force. As a result, according to this optical module, it is possible to improve the accuracy of mounting the optical element and to ensure the mounting strength.

[0250]In the optical module according to still another aspect of the present disclosure, the support portion may include a protrusion portion which is bifurcated from the interlock portion and protrudes to the base side. The contact portion may include a distal end portion of the protrusion portion. In this case, the optical element can be bonded in a state where a distal end of the protrusion portion serving as the contact portion abuts the main surface of the base. Particularly, since the main surface can be used for bonding the optical element, it is possible to facilitate processing such as disposing (patterning) of a bonding agent, welding, or the like.

[0251]In the optical module according to still another aspect of the present disclosure, the contact portion may include a side surface of the interlock portion facing the inner surface of the opening. In this case, the optical element can be bonded in a state where the side surface of the interlock portion serving as the contact portion is brought into contact with the inner surface of the opening. Particularly, in this case, since bonding is performed between surfaces, it is possible to increase a bonding area and to reliably improve the mounting strength.

[0252]In the optical module according to still another aspect of the present disclosure, the base may have a support layer and a device layer which is provided on the support layer and includes the main surface and the mounting region. The opening may penetrate the device layer in a direction intersecting the main surface. The support portion may include the interlock portion which is bent to come into contact with a pair of edge portions of the opening in a direction intersecting the main surface. In this case, the interlock portion is interlocked with the mounting region at a position where the interlock portion comes into contact with the pair of edge portions of the opening. Therefore, it is possible to more reliably mount the optical element on the base and to positionally align the optical element in a direction intersecting the main surface of the base.

[0253]In the optical module according to still another aspect of the present disclosure, the inner surface of the opening may include a pair of inclined surfaces which is inclined such that a distance therebetween increases from one end toward the other end when viewed in a direction intersecting the main surface, and a reference surface which extends along a reference line connecting the other end of one inclined surface and the other end of the other inclined surface to each other. In this case, when the support portions are inserted into the opening and an elastic deformation of the elastic portion is partially released, the support portions can slide on the inclined surfaces and can abut the reference surface due to an elastic force. Therefore, it is possible to positionally align the optical element in a direction along the main surface in an automatic manner.

[0254]The optical module according to still another aspect of the present disclosure may further include a fixed mirror which is mounted in at least one of the support layer, the device layer, and an intermediate layer which is provided between the support layer and the device layer; and a beam splitter which is mounted in at least one of the support layer, the device layer, and the intermediate layer. The optical element may be a movable mirror which includes the optical surface serving as a mirror surface. The device layer may have a driving region which is connected to the mounting region. The movable mirror, the fixed mirror, and the beam splitter may be disposed such that an interference optical system is constituted. In this case, it is possible to obtain an FTIR having improved sensitivity.

[0255]In the optical module according to still another aspect of the present disclosure, the base may have the intermediate layer which is provided between the support layer and the device layer. The support layer may be a first silicon layer of an SOI substrate. The device layer may be a second silicon layer of the SOI substrate. The intermediate layer may be an insulating layer of the SOI substrate. In this case, it is possible to favorably realize a configuration for reliable mounting of the movable mirror with respect to the device layer using the SOI substrate.

[0256]The optical module according to still another aspect of the present disclosure may further include a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside, and a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside. In this case, it is possible to obtain an FTIR including a light incident unit and a light emission unit.

[0257]According to still another aspect of the present disclosure, it is possible to provide an optical module in which accuracy of mounting an optical element can be improved and mounting strength can be ensured.

[0258]Hereinafter, an embodiment of still another aspect of the present disclosure will be described in detail with reference to the drawings. The same reference signs are applied to parts which are the same or corresponding in each of the drawings, and duplicated parts will be omitted.

[0259][Configuration of Optical Module]

[0260]As illustrated in FIG. 27 , an optical module 1 C includes a base BC. The base BC includes a main surface BsC. The base BC includes a support layer 2 C, a device layer 3 C which is provided on the support layer 2 C, and an intermediate layer 4 C which is provided between the support layer 2 C and the device layer 3 C. Here, the main surface BsC is a surface of the device layer 3 C on a side opposite to the support layer 2 C. The support layer 2 C, the device layer 3 C, and the intermediate layer 4 C are constituted of an SOI substrate. Specifically, the support layer 2 C is a first silicon layer of the SOI substrate. The device layer 3 C is a second silicon layer of the SOI substrate. The intermediate layer 4 C is an insulating layer of the SOI substrate. The support layer 2 C, the device layer 3 C, and the intermediate layer 4 C exhibit a rectangular shape of which one side is approximately 10 mm, for example, when viewed in a ZC-axis direction (direction parallel to a ZC-axis) that is a stacking direction thereof. The thickness of each of the support layer 2 C and the device layer 3 C is approximately several hundreds of μm, for example. The thickness of the intermediate layer 4 C is approximately several μm, for example. FIG. 27 illustrates the device layer 3 C and the intermediate layer 4 C in a state where one corner portion of the device layer 3 C and one corner portion of the intermediate layer 4 C are cut out.

[0261]The device layer 3 C has a mounting region 31 C and a driving region 32 C which is connected to the mounting region 31 C. The driving region 32 C includes a pair of actuator regions 33 C and a pair of elastic support regions 34 C. The mounting region 31 C and the driving region 32 C (that is, the mounting region 31 C, the pair of actuator regions 33 C, and the pair of elastic support regions 34 C) are integrally formed in a portion of the device layer 3 C by a MEMS technology (patterning and etching).

[0262]The actuator regions 33 C of the pair are disposed on both sides of the mounting region 31 C in an XC-axis direction (direction parallel to an XC-axis orthogonal the ZC-axis). That is, the mounting region 31 C is sandwiched between the actuator regions 33 C of the pair in the XC-axis direction. Each of the actuator regions 33 C is fixed to the support layer 2 C with the intermediate layer 4 C interposed therebetween. A first comb-teeth portion 33 a C is provided on a side surface of each of the actuator regions 33 C on the mounting region 31 C side. Each of the first comb-teeth portions 33 a C is in a state of being floated with respect to the support layer 2 C by removing the intermediate layer 4 C immediately below thereof. A first electrode 35 C is provided in each of the actuator regions 33 C.

[0263]The elastic support regions 34 C of the pair are disposed on both sides of the mounting region 31 C in a YC-axis direction (direction parallel to a YC-axis orthogonal to the ZC-axis and the XC-axis). That is, the mounting region 31 C is sandwiched between the elastic support regions 34 C of the pair in the YC-axis direction. Both end portions 34 a C of each of the elastic support regions 34 C are fixed to the support layer 2 C with the intermediate layer 4 C interposed therebetween. An elastic deformation portion 34 b C (part between both the end portions 34 a C) of each of the elastic support regions 34 C has a structure in which a plurality of leaf springs are connected. The elastic deformation portion 34 b C of each of the elastic support regions 34 C is in a state of being floated with respect to the support layer 2 C by removing the intermediate layer 4 C immediately below thereof. A second electrode 36 C is provided in each of both the end portions 34 a C in each of the elastic support regions 34 C.

[0264]The elastic deformation portion 34 b C of each of the elastic support regions 34 C is connected to the mounting region 31 C. The mounting region 31 C is in a state of being floated with respect to the support layer 2 C by removing the intermediate layer 4 C immediately below thereof. That is, the mounting region 31 C is supported by the pair of elastic support regions 34 C. Second comb-teeth portions 31 a C are provided on side surfaces of the mounting region 31 C on the actuator region 33 C side. Each of the second comb-teeth portions 31 a C is in a state of being floated with respect to the support layer 2 C after the intermediate layer 4 C immediately below thereof. In the first comb-teeth portions 33 a C and the second comb-teeth portions 31 a C facing each other, each comb tooth of the first comb-teeth portions 33 a C is positioned between comb teeth of the second comb-teeth portions 31 a C.

[0265]The elastic support regions 34 C of the pair sandwich the mounting region 31 C from both sides when viewed in a direction AC parallel to the XC-axis. When the mounting region 31 C moves in the direction AC, the pair of elastic support regions 34 C causes an elastic force to act on the mounting region 31 C such that the mounting region 31 C returns to the initial position. Therefore, when a voltage is applied to a part between the first electrode 35 C and the second electrode 36 C such that an electrostatic attraction acts between the first comb-teeth portions 33 a C and the second comb-teeth portions 31 a C facing each other, the mounting region 31 C moves in the direction AC to a position where the electrostatic attraction and the elastic force of the pair of elastic support regions 34 C are balanced. In this manner, the driving region 32 C functions as an electrostatic actuator.

[0266]The optical module 1 C further includes a movable mirror 5 C, a fixed mirror 6 C, a beam splitter 7 C, a light incident unit 8 C, and a light emission unit 9 C. The movable mirror 5 C, the fixed mirror 6 C, and the beam splitter 7 C are disposed on the device layer 3 C such that an interference optical system 10 C (Michelson interference optical system) is constituted.

[0267]The movable mirror 5 C is mounted in the mounting region 31 C of the device layer 3 C on one side of the beam splitter 7 C in the XC-axis direction. A mirror surface 51 a C of a mirror portion 51 C included in the movable minor 5 C is positioned on a side opposite to the support layer 2 C with respect to the device layer 3 C. For example, the mirror surface 51 a C is a surface perpendicular to the XC-axis direction (that is, a surface perpendicular to the direction AC) and is directed to the beam splitter 7 C side.

[0268]The fixed mirror 6 C is mounted in a mounting region 37 C of the device layer 3 C on one side of the beam splitter 7 C in the YC-axis direction. A mirror surface 61 a C of a mirror portion 61 C included in the fixed mirror 6 C is positioned on a side opposite to the support layer 2 C with respect to the device layer 3 C. For example, the mirror surface 61 a C is a surface perpendicular to the YC-axis direction and is directed to the beam splitter 7 C side.

[0269]The light incident unit 8 C is mounted in the device layer 3 C on the other side of the beam splitter 7 C in the YC-axis direction. For example, the light incident unit 8 C is constituted of optical fibers, a collimating lens, and the like. The light incident unit 8 C is disposed such that measurement light is incident on the interference optical system 10 C from outside.

[0270]The light emission unit 9 C is mounted in the device layer 3 C on the other side of the beam splitter 7 C in the XC-axis direction. For example, the light emission unit 9 C is constituted of optical fibers, a collimating lens, and the like. The light emission unit 9 C is disposed such that measurement light (interference light) is emitted from the interference optical system 10 C to the outside.

[0271]The beam splitter 7 C is a cube-type beam splitter having an optical functional surface 7 a C. The optical functional surface 7 a C is positioned on a side opposite to the support layer 2 C with respect to the device layer 3 C. The beam splitter 7 C is positionally aligned when one corner portion of the beam splitter 7 C on a bottom surface side is brought into contact with one corner of a rectangular opening 3 a C formed in the device layer 3 C. The beam splitter 7 C is mounted in the support layer 2 C by being fixed to the support layer 2 C through bonding or the like in a positionally aligned state.

[0272]In the optical module 1 C having a configuration described above, when measurement light L 0 C is incident on the interference optical system 10 C from outside via the light incident unit 8 C, a portion of the measurement light L 0 C is reflected by the optical functional surface 7 a C of the beam splitter 7 C and travels toward the movable mirror 5 C, and the remaining portion of the measurement light L 0 C is transmitted through the optical functional surface 7 a C of the beam splitter 7 C and travels toward the fixed mirror 6 C. A portion of the measurement light L 0 C is reflected by the mirror surface 51 a C of the movable mirror 5 C, travels toward the beam splitter 7 C along the same optical path, and is transmitted through the optical functional surface 7 a C of the beam splitter 7 C. The remaining portion of the measurement light L 0 C is reflected by the mirror surface 61 a C of the fixed mirror 6 C, travels toward the beam splitter 7 C along the same optical path, and is reflected by the optical functional surface 7 a C of the beam splitter 7 C. A portion of the measurement light L 0 C which has been transmitted through the optical functional surface 7 a C of the beam splitter 7 C, and the remaining portion of the measurement light L 0 C which has been reflected by the optical functional surface 7 a C of the beam splitter 7 C become measurement light L 1 C (interference light). The measurement light L 1 C is emitted from the interference optical system 10 C to the outside via the light emission unit 9 C. According to the optical module 1 C, since the movable mirror 5 C can reciprocate in the direction AC at a high speed, it is possible to provide a small-sized FTIR having high accuracy.

[0273][Movable Mirror and Surrounding Structure Thereof]

[0274]As illustrated in FIGS. 28, 29, and 30 , the movable mirror (optical element) 5 C has the mirror portion (optical portion) 51 C which has the minor surface (optical surface) 51 a C, an annular elastic portion 52 C, a connecting portion 53 C which connects the mirror portion 51 C and the elastic portion 52 C to each other, a pair of support portions 56 C, and a pair of connecting portions 57 C which connects the support portions 56 C and the elastic portion 52 C to each other. The mirror portion 51 C is formed to have a disk shape. The mirror surface 51 a C is a circular plate surface of the mirror portion 51 C. The movable mirror 5 C is mounted on the base BC in a state where the mirror surface 51 a C intersects (for example, is orthogonal to) the main surface BsC.

[0275]The elastic portion 52 C is formed to have a circular shape being separated from the mirror portion 51 C and surrounding the mirror portion 51 C when viewed in a direction (XC-axis direction) intersecting the mirror surface 51 a C. That is, the elastic portion 52 C is provided around the mirror portion 51 C and forms an annular region CAC having a circular shape. The connecting portion 53 C connects the mirror portion 51 C and the elastic portion 52 C to each other at the center of the mirror portion 51 C in a direction along the main surface BsC (YC-axis direction). Here, a single connecting portion 53 C is provided. The connecting portion 53 C is provided at a position on a side opposite to the main surface BsC of the base BC along a center line DLC passing through the center of the mirror portion 51 C in the YC-axis direction and with respect to the center of the mirror portion 51 C in the ZC-axis direction. The center line DLC is an imaginary straight line extending in the ZC-axis direction.

[0276]The elastic portion 52 C is formed to have a circular plate shape by a semicircular leaf spring 52 a C and a semicircular leaf spring 52 b C which continues to the leaf spring 52 a C. The leaf spring 52 a C and the leaf spring 52 b C are symmetrically constituted with respect to the center line DLC. The spring constant of the leaf spring 52 a C and the spring constant of the leaf spring 52 b C are equal to each other. Here, the elastic portion 52 C in its entirety is line symmetrical and has an equal spring constant with respect to the center line DLC.

[0277]The support portions 56 C have a rod shape with a rectangular cross section and are provided such that the mirror portion 51 C and the elastic portion 52 C are sandwiched therebetween in the YC-axis direction. The support portions 56 C are connected to the elastic portion 52 C through the connecting portions 57 C. The connecting portions 57 C are disposed along a center line CLC passing through the center of the mirror portion 51 C in the ZC-axis direction. The center line CLC is an imaginary straight line intersecting (orthogonal to) the center line DLC at the center of the mirror portion 51 C and extending in the YC-axis direction. Therefore, when a force is applied to the support portions 56 C such that the support portions 56 C are sandwiched from both sides in the YC-axis direction at positions corresponding to the connecting portions 57 C, for example, the elastic portion 52 C can be elastically deformed to be compressed in the YC-axis direction. That is, the distance between the support portions 56 C in the YC-axis direction can be changed in accordance with elastic deformation of the elastic portion 52 C. In addition, an elastic force of the elastic portion 52 C can be applied to the support portions 56 C.

[0278]The support portion 56 C includes a leg portion 54 C. The leg portion 54 C linearly extends to one side (here, the main surface BsC side) of the mirror surface 51 a C over the mirror surface 51 a C from the connecting portion 57 C in the ZC-axis direction. A distal end of the leg portion 54 C serves as a contact portion 58 C which comes into contact with the main surface BsC (that is, the mounting region 31 C). For example, an end surface of the contact portion 58 C may be flat. However, here, it has a curved surface shape (hemispherical surface shape).

[0279]The support portion 56 C further includes an interlock portion 55 C. The interlock portion 55 C extends while being bifurcated from a middle part of the leg portion 54 C on the distal end side. Therefore, the support portion 56 C includes a protrusion portion (leg portion 54 C) which is bifurcated from the interlock portion 55 C and protrudes to the base BC side, and the contact portion 58 C includes a distal end portion of the protrusion portion. The interlock portions 55 C are bent in a V-shape projected toward each other between the support portions 56 C of the pair. The interlock portion 55 C includes an inclined surface 55 a C and an inclined surface 55 b C. The inclined surface 55 a C and the inclined surface 55 b C are surfaces (outer surfaces) of the interlock portions 55 C of the pair on sides opposite to surfaces facing each other.

[0280]The inclined surfaces 55 a C are inclined toward each other in a direction (negative ZC-axis direction) away from the connecting portions 57 C between the interlock portions 55 C of the pair. The inclined surfaces 55 b C are inclined away from each other in the negative ZC-axis direction. When viewed in the XC-axis direction, the absolute value for an inclination angle αC of the inclined surface 55 a C with respect to the ZC-axis is smaller than 90°. Similarly, the absolute value for an inclination angle βC of the inclined surface 55 b C is smaller than 90°. Here, as an example, the absolute value for the inclination angle αC and the absolute value for the inclination angle βC are equal to each other.

[0281]Here, an opening 31 b C is formed in the mounting region 31 C. Here, the opening 31 b C extends in the ZC-axis direction and penetrates the device layer 3 C. Therefore, the opening 31 b C communicates with (reaches) the main surface BsC and a surface of the device layer 3 C on a side opposite to the main surface BsC. The opening 31 b C exhibits a pillar shape in which a shape when viewed in the ZC-axis direction is a trapezoidal shape (refer to FIG. 30 ). The opening 31 b C will be described below in detail.

[0282]The support portions 56 C are inserted into this opening 31 b C in a state where an elastic force of the elastic portion 52 C is applied. In other words, the support portions 56 C (that is, the movable mirror 5 C) penetrate the mounting region 31 C via the opening 31 b C. More specifically, a portion of the interlock portion 55 C of the support portion 56 C is positioned inside the opening 31 b C. In this state, the interlock portions 55 C come into contact with a pair of edge portions (an edge portion on the main surface BsC side and an edge portion on a side opposite to the main surface BsC) of the opening 31 b C in the ZC-axis direction.

[0283]Here, the inclined surfaces 55 a C come into contact with the edge portions of the opening 31 b C on the main surface BsC side, and the inclined surfaces 55 b C come into contact with the edge portions of the opening 31 b C on a side opposite to the main surface BsC. Accordingly, the interlock portions 55 C are interlocked with the mounting region 31 C such that the mounting region 31 C is sandwiched therebetween in the ZC-axis direction. As a result, detachment of the movable mirror 5 C from the base BC in the ZC-axis direction is curbed.

[0284]At this time, the contact portions 58 C come into contact with the main surface BsC (that is, the mounting region 31 C). That is, the contact portions 58 C come into contact with the mounting region 31 C (here, the main surface BsC) in a state where the interlock portions 55 C are interlocked such that the mounting region 31 C is sandwiched therebetween. Then, the contact portions 58 C are bonded to the mounting region 31 C. Here, as an example, the contact portions 58 C come into contact with the main surface BsC with a resin bonding layer interposed therebetween, for example, and are bonded thereto. However, for example, the contact portions 58 C may be bonded through melting of a metal layer, bonding using a glass bonding agent or irradiation of laser light, or the like.

[0285]Here, an opening 41 C is formed in the intermediate layer 4 C. The opening 41 C is open on both sides of the intermediate layer 4 C in the ZC-axis direction. An opening 21 C is formed in the support layer 2 C. The opening 21 C is open on both sides of the support layer 2 C in the ZC-axis direction. In the optical module 1 C, a continuous space S 1 C is constituted of a region inside the opening 41 C of the intermediate layer 4 C and a region inside the opening 21 C of the support layer 2 C. That is, the space S 1 C includes a region inside the opening 41 C of the intermediate layer 4 C and a region inside the opening 21 C of the support layer 2 C.

[0286]The space S 1 C is formed between the support layer 2 C and the device layer 3 C and corresponds to at least the mounting region 31 C and the driving region 32 C. Specifically, a region inside the opening 41 C of the intermediate layer 4 C and a region inside the opening 21 C of the support layer 2 C include a range in which the mounting region 31 C moves when viewed in the ZC-axis direction. A region inside the opening 41 C of the intermediate layer 4 C forms a clearance for causing a part (that is, a part to be in a detached state with respect to the support layer 2 C, for example, the mounting region 31 C in its entirety, the elastic deformation portion 34 b C of each of the elastic support regions 34 C, the first comb-teeth portions 33 a C, and the second comb-teeth portions 31 a C) of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C.

[0287]A portion of each of the interlock portions 55 C included in the movable mirror 5 C is positioned in the space S 1 C. Specifically, a portion of each of the interlock portions 55 C is positioned in a region inside the opening 21 C of the support layer 2 C through a region inside the opening 41 C of the intermediate layer 4 C. A portion of each of the interlock portions 55 C protrudes into the space S 1 C from a surface of the device layer 3 C on the intermediate layer 4 C side by approximately 100 μm, for example. As described above, since a region inside the opening 41 C of the intermediate layer 4 C and a region inside the opening 21 C of the support layer 2 C include the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, a portion of each of the interlock portions 55 C of the movable mirror 5 C positioned in the space S 1 C does not come into contact with the intermediate layer 4 C and the support layer 2 C when the mounting region 31 C reciprocates in the direction AC.

[0288]Here, as illustrated in FIG. 30 , an inner surface of the opening 31 b C includes a pair of inclined surfaces SLC and a reference surface SRC. The inclined surface SLC includes one end SLaC and the other end SLbC. The one end SLaC and the other end SLbC are both end portions of the inclined surface SLC when viewed in the ZC-axis direction. The inclined surfaces SLC of the pair are inclined such that the distance therebetween increases from the one end SLaC toward the other end SLbC (for example, with respect to the XC-axis). When viewed in the ZC-axis direction, the reference surface SRC extends along a reference line BLC connecting the other end SLbC of one inclined surface SLC and the other end SLbC of the other inclined surface SLC to each other. Here, the reference surface SRC simply connects the other ends SLbC to each other. As described above, the shape of the opening 31 b C when viewed in the ZC-axis direction is a trapezoidal shape. Therefore, here, the inclined surfaces SLC correspond to legs of the trapezoidal shape, and the reference surface SRC corresponds to a bottom base of the trapezoidal shape.

[0289]Here, the opening 31 b C is a single space. The minimum value for the size (that is, the gap between the one ends SLaC of the inclined surfaces SLC) of the opening 31 b C in the YC-axis direction is a value allowing the pair of interlock portions 55 C to be collectively disposed inside the opening 31 b C when the elastic portion 52 C is elastically deformed to be compressed in the YC-axis direction. Meanwhile, the maximum value for the size (that is, the gap between the other ends SLbC of the inclined surfaces SLC) of the opening 31 b C in the YC-axis direction is a value allowing only a portion of elastic deformation of the elastic portion 52 C to be released (that is, the elastic portion 52 C does not reach the natural length) when the pair of interlock portions 55 C is disposed in the opening 31 b C.

[0290]Therefore, when the pair of interlock portions 55 C is disposed inside the opening 31 b C, the interlock portions 55 C press the inner surface of the opening 31 b C due to an elastic force of the elastic portion 52 C, and a reaction force from the inner surface of the opening 31 b C is applied to the interlock portions 55 C (support portions 56 C). Accordingly, in a state where the mirror surface 51 a C intersects (for example, is orthogonal to) the main surface BsC, the movable mirror 5 C is supported in the mounting region 31 C by a reaction force of an elastic force applied from the inner surface of the opening 31 b C to the support portions 56 C. In this state, as described above, the contact portions 58 C come into contact with the main surface BsC (mounting region 31 C) and are bonded thereto. Therefore, in a state where the mirror surface 51 a C intersects the main surface BsC, the movable mirror 5 C is supported in the mounting region 31 C by a reaction force of an elastic force applied from the inner surface of the opening 31 b C to the interlock portions 55 C and is bonded to the mounting region 31 C at the contact portions 58 C.

[0291]Particularly, the interlock portions 55 C are brought into contact with the inclined surfaces SLC of the opening 31 b C. Therefore, the interlock portions 55 C slide on the inclined surfaces SLC toward the reference surface SRC due to a component of a reaction force from the inclined surfaces SLC in the XC-axis direction and abut the reference surface SRC while being in contact with the inclined surfaces SLC. Accordingly, the interlock portions 55 C come into internal contact with the corner portions defined by the inclined surfaces SLC and the reference surface SRC and are positionally aligned (self-aligned due to an elastic force) in both the XC-axis direction and the YC-axis direction. Here, since the interlock portions 55 C have a quadrangular cross-sectional shape, the inclined surfaces SLC come into point contact with the interlock portions 55 C and the reference surface SRC comes into line contact with the interlock portions 55 C when viewed in the ZC-axis direction. That is, here, the inner surface of the opening 31 b C comes into contact with the pair of interlock portions 55 C at two points and along two lines when viewed in the ZC-axis direction.

[0292]Meanwhile, as illustrated in FIG. 28 , when viewed in the XC-axis direction, a reaction force of an elastic force is also applied to the interlock portions 55 C from the inner surface of the opening 31 b C at the edge portions of the opening 31 b C. When the movable mirror 5 C is mounted, there are cases where a reaction force is applied to either the inclined surfaces 55 a C or the inclined surfaces 55 b C of the interlock portions 55 C. In these cases, either the inclined surfaces 55 a C or the inclined surfaces 55 b C slide on the edge portions due to a component of a reaction force along the inclined surfaces 55 a C or the inclined surfaces 55 b C and move in the ZC-axis direction to reach positions (that is, positions where the mounting region 31 C is sandwiched therebetween in the ZC-axis direction) where both the inclined surfaces 55 a C and the inclined surfaces 55 b C come into contact with the edge portions. Accordingly, the interlock portions 55 C are interlocked at the positions, and the movable mirror 5 C is positionally aligned (self-aligned due to an elastic force) in the ZC-axis direction. That is, the movable mirror 5 C is self-aligned in a three-dimensional manner utilizing an elastic force of the elastic portion 52 C. Here, the inclined surfaces 55 b C and the contact portions 58 C face each other in the ZC-axis direction. Therefore, the inclined surfaces 55 a C may be configured to be self-aligned without coming into contact with the edge portions of the opening 31 b C, such that the edge portions of the opening 31 b C are sandwiched therebetween by the contact portions 58 C and the inclined surfaces 55 b C.

[0293]The movable mirror 5 C described above is integrally foamed by a MEMS technology (patterning and etching), for example. Therefore, the thickness (size in a direction intersecting the mirror surface 51 a C) of the movable mirror 5 C is uniform in each portion. For example, the thickness thereof is approximately 320 μm. In addition, the diameter of the mirror surface 51 a C is approximately 1 mm, for example. Moreover, the gap between a surface (inner surface) of the elastic portion 52 C on the mirror portion 51 C side and a surface (outer surface) of the mirror portion 51 C on the elastic portion 52 C side is approximately 200 μm, for example. The thickness of the elastic portion 52 C (thickness of the leaf spring) is within a range of approximately 10 μm to 20 μm, for example.

[0294][Fixed Mirror and Surrounding Structure Thereof]

[0295]The fixed mirror 6 C and the surrounding structure thereof are similar to the foregoing movable mirror 5 C and the surrounding structure thereof, except that the mounting region is not movable. That is, as illustrated in FIGS. 31 and 32 , the fixed mirror (optical element) 6 C has the mirror portion (optical portion) 61 C which has the mirror surface (optical surface) 61 a C, an annular elastic portion 62 C, a connecting portion 63 C which connects the mirror portion 61 C and the elastic portion 62 C to each other, a pair of support portions 66 C, and a pair of connecting portions 67 C which connects the support portions 66 C and the elastic portion 62 C to each other. The mirror portion 61 C is formed to have a disk shape. The mirror surface 61 a C is a circular plate surface of the mirror portion 61 C. The fixed mirror 6 C is mounted on the base BC in a state where the mirror surface 61 a C intersects (for example, is orthogonal to) the main surface BsC of the base BC.

[0296]The elastic portion 62 C is formed to have a circular shape being separated from the mirror portion 61 C and surrounding the mirror portion 61 C when viewed in a direction (YC-axis direction) intersecting the mirror surface 61 a C. Therefore, the elastic portion 62 C is provided around the mirror portion 61 C and forms the annular region CAC having a circular shape. The connecting portion 63 C connects the mirror portion 61 C and the elastic portion 62 C to each other at the center of the mirror portion 61 C in a direction along the main surface BsC (XC-axis direction). Here, a single connecting portion 63 C is provided. The connecting portion 63 C is provided at a position on a side opposite to the main surface BsC of the base BC along the center line DLC passing through the center of the mirror portion 61 C in the XC-axis direction and with respect to the center of the mirror portion 61 C in the ZC-axis direction. The center line DLC is an imaginary straight line extending in the ZC-axis direction.

[0297]The elastic portion 62 C is formed to have a circular plate shape by a semicircular leaf spring 62 a C and a semicircular leaf spring 62 b C which continues to the leaf spring 62 a C. The leaf spring 62 a C and the leaf spring 62 b C are symmetrically constituted with respect to the center line DLC. The spring constant of the leaf spring 62 a C and the spring constant of the leaf spring 62 b C are equal to each other. Here, the elastic portion 62 C in its entirety is line symmetrical and has an equal spring constant with respect to the center line DLC.

[0298]The support portions 66 C have a rod shape with a rectangular cross section and are provided such that the mirror portion 61 C and the elastic portion 62 C are sandwiched therebetween in the XC-axis direction. The support portions 66 C are connected to the elastic portion 62 C through the connecting portions 67 C. The connecting portions 67 C are disposed along the center line CLC passing through the center of the mirror portion 61 C in the ZC-axis direction. The center line CLC is an imaginary straight line intersecting (orthogonal to) the center line DLC at the center of the mirror portion 61 C and extending in the XC-axis direction. Therefore, when a force is applied to the support portions 66 C such that the support portions 66 C are sandwiched from both sides in the XC-axis direction at positions corresponding to the connecting portions 67 C, for example, the elastic portion 62 C can be elastically deformed to be compressed in the XC-axis direction. That is, the distance between the support portions 66 C in the XC-axis direction can be changed in accordance with elastic deformation of the elastic portion 62 C. In addition, an elastic force of the elastic portion 62 C can be applied to the support portions 66 C.

[0299]The support portion 66 C includes a leg portion 64 C. The leg portion 64 C linearly extends to one side (here, the main surface BsC side) of the mirror surface 61 a C over the mirror surface 61 a C from the connecting portion 67 C in the ZC-axis direction. A distal end of the leg portion 64 C serves as a contact portion 68 C which comes into contact with the main surface BsC (that is, the mounting region 37 C). For example, an end surface of the contact portion 68 C may be flat. However, here, it has a curved surface shape (hemispherical surface shape).

[0300]The support portion 66 C further includes an interlock portion 65 C. The interlock portion 65 C extends while being bifurcated from a middle part of the leg portion 64 C on the distal end side. Therefore, the support portion 66 C includes a protrusion portion (leg portion 64 C) which is bifurcated from the interlock portion 65 C and protrudes to the base BC side, and the contact portion 68 C includes a distal end portion of the protrusion portion. The interlock portions 65 C are bent in a V-shape projected toward each other between the support portions 66 C of the pair. The interlock portion 65 C includes an inclined surface 65 a C and an inclined surface 65 b C. The inclined surface 65 a C and the inclined surface 65 b C are included. The inclined surface 65 a C and the inclined surface 65 b C are surfaces (outer surfaces) of the interlock portions 65 C of a pair on sides opposite to surfaces facing each other.

[0301]The inclined surfaces 65 a C are inclined toward each other in a direction (negative ZC-axis direction) away from the connecting portions 67 C between the interlock portions 65 C of the pair. The inclined surfaces 65 b C are inclined away from each other in the negative ZC-axis direction. When viewed in the YC-axis direction, the inclination angles of the inclined surfaces 65 a C and 65 b C with respect to the ZC-axis are similar to those of the inclined surfaces 55 a C and 55 b C in the movable mirror 5 C.

[0302]Here, an opening 37 a C is formed in the mounting region 37 C. Here, the opening 37 a C penetrates the device layer 3 C in the ZC-axis direction. Therefore, the opening 37 a C communicates with (reaches) the main surface BsC and a surface of the device layer 3 C on a side opposite to the main surface BsC. Similar to the opening 31 b C in the mounting region 31 C, the opening 37 a C exhibits a pillar shape in which a shape when viewed in the ZC-axis direction is a trapezoidal shape.

[0303]The support portions 66 C are inserted into this opening 37 a C in a state where an elastic force of the elastic portion 62 C is applied. In other words, the support portions 66 C (that is, the fixed mirror 6 C) penetrate the mounting region 37 C via the opening 37 a C. More specifically, a portion of the interlock portion 65 C of the support portion 66 C is positioned inside the opening 37 a C. In this state, the interlock portions 65 C come into contact with a pair of edge portions (an edge portion on the main surface BsC side and an edge portion on a side opposite to the main surface BsC) of the opening 37 a C in the ZC-axis direction. Here, the inclined surfaces 65 a C come into contact with the edge portions of the opening 37 a C on the main surface BsC side, and the inclined surfaces 65 b C come into contact with the edge portions of the opening 37 a C on a side opposite to the main surface BsC. Accordingly, the interlock portions 65 C are interlocked with the mounting region 37 C such that the mounting region 37 C is sandwiched therebetween in the ZC-axis direction. As a result, detachment of the fixed mirror 6 C from the base BC in the ZC-axis direction is curbed.

[0304]At this time, the contact portions 68 C come into contact with the main surface BsC (that is, the mounting region 37 C). That is, the contact portions 68 C come into contact with the mounting region 37 C (here, the main surface BsC) in a state where the interlock portions 65 C are interlocked such that the mounting region 37 C is sandwiched therebetween. Then, the contact portions 68 C are bonded to the mounting region 37 C. Here, as an example, the contact portions 68 C come into contact with the main surface BsC with a resin bonding layer interposed therebetween, for example, and are bonded thereto. However, for example, the contact portions 68 C may be bonded through melting of a metal layer, bonding using a glass bonding agent or irradiation of laser light, or the like.

[0305]Here, an opening 42 C is formed in the intermediate layer 4 C. The opening 42 C includes the opening 37 a C of the mounting region 37 C when viewed in the ZC-axis direction and is open on both sides of the intermediate layer 4 C in the ZC-axis direction. An opening 22 C is formed in the support layer 2 C. The opening 22 C includes the opening 37 a C of the mounting region 37 C when viewed in the ZC-axis direction and is open on both sides of the support layer 2 C in the ZC-axis direction. In the optical module 1 C, a continuous space S 2 C is constituted of a region inside the opening 42 C of the intermediate layer 4 C and a region inside the opening 22 C of the support layer 2 C. That is, the space S 2 C includes a region inside the opening 42 C of the intermediate layer 4 C and a region inside the opening 22 C of the support layer 2 C.

[0306]A portion of each of the interlock portions 65 C included in the fixed mirror 6 C is positioned in the space S 2 C. Specifically, a portion of each of the interlock portions 65 C is positioned in a region inside the opening 22 C of the support layer 2 C through a region inside the opening 42 C of the intermediate layer 4 C. A portion of each of the interlock portions 65 C protrudes into the space S 2 C from a surface of the device layer 3 C on the intermediate layer 4 C side by approximately 100 μm, for example.

[0307]Here, an inner surface of the opening 37 a C has a configuration similar to the inner surface of the opening 31 b C in the mounting region 31 C. Therefore, when the pair of interlock portions 65 C is disposed inside the opening 37 a C, the interlock portions 65 C press the inner surface of the opening 37 a C due to an elastic force of the elastic portion 62 C, and a reaction force from the inner surface of the opening 37 a C is applied to the interlock portions 65 C (support portions 66 C). Accordingly, in a state where the mirror surface 61 a C intersects (for example, is orthogonal to) the main surface BsC, the fixed mirror 6 C is supported in the mounting region 37 C by a reaction force of an elastic force applied from the inner surface of the opening 37 a C to the support portions 66 C. In this state, as described above, the contact portions 68 C come into contact with the main surface BsC (mounting region 37 C) and are bonded thereto. Therefore, in a state where the mirror surface 61 a C intersects the main surface BsC, the fixed mirror 6 C is supported in the mounting region 37 C by a reaction force of an elastic force applied from the inner surface of the opening 37 a C to the interlock portions 65 C and is bonded to the mounting region 37 C at the contact portions 68 C. Similar to the case of the movable mirror 5 C, the fixed mirror 6 C is also self-aligned in a three-dimensional manner utilizing the inner surface of the opening 37 a C and an elastic force.

[0308]Similar to the movable mirror 5 C, the fixed mirror 6 C described above is also integrally formed by a MEMS technology (patterning and etching), for example. The size of each portion of the fixed mirror 6 C is similar to the size of each portion of the movable mirror 5 C described above, for example.

[0309][Operations and Effects]

[0310]In the optical module 1 C, the movable mirror 5 C has the elastic portion 52 C, and the support portions 56 C of the pair in which the distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion 52 C. Meanwhile, the opening 31 b C communicating with the main surface BsC is formed in the mounting region 31 C of the base BC on which the movable mirror 5 C is mounted. Therefore, as an example, when the support portions 56 C are inserted into the opening 31 b C in a state where the elastic portion 52 C is elastically deformed such that the distance between the support portions 56 C is decreased, and when an elastic deformation of the elastic portion 52 C is partially released, the distance between the support portions 56 C increases inside the opening 31 b C, so that the support portions 56 C can be brought into contact with the inner surface of the opening 31 b C.

[0311]Accordingly, due to a reaction force of an elastic force applied from the inner surface of the opening 31 b C to the support portions 56 C, a position of the movable mirror 5 C with respect to the mounting region 31 C is accurately defined on the inner surface of the opening 31 b C. Moreover, the movable mirror 5 C is bonded to the mounting region 31 C in the contact portions 58 C of the support portions 56 C in a state of being supported due to a reaction force of an elastic force. As a result, according to the optical module 1 C, it is possible to improve the accuracy of mounting the movable mirror 5 C and to ensure the mounting strength. Here, operations and effects are described with the movable mirror 5 C as an example. However, the fixed mirror 6 C also exhibits similar operations and effects (the same applies hereinafter).

[0312]In addition, in the optical module 1 C, the support portion 56 C includes a protrusion portion (leg portion 54 C) which is bifurcated from the interlock portion 55 C and protrudes to the base BC side, and the contact portion 58 C includes a distal end portion of the protrusion portion. Therefore, the movable mirror 5 C can be bonded in a state where the distal ends of the protrusion portions serving as the contact portions 58 C abut the main surface BsC of the base BC. Particularly, since the main surface BsC can be used for bonding the movable mirror 5 C, it is possible to facilitate processing such as disposing (patterning) of a bonding agent, welding, or the like.

[0313]In addition, in the movable mirror 5 C, the elastic portion 52 C is provided such that the annular region CAC is formed. Therefore, for example, compared to a case where the elastic portion 52 C is in a cantilever state (in this case, a closed region such as an annular shape or the like is not formed by the elastic portion 52 C), the strength of the elastic portion 52 C is improved. Therefore, for example, damage to the elastic portion 52 C can be curbed when manufacturing or handling the movable mirror 5 C.

[0314]In addition, in the optical module 1 C, the base BC has the support layer 2 C and the device layer 3 C which is provided on the support layer 2 C and includes the main surface BsC and the mounting region 31 C. In addition, the opening 31 b C penetrates the device layer 3 C in a direction (ZC-axis direction) intersecting the main surface BsC. Then, the support portions 56 C include the interlock portions 55 C which are bent to come into contact with the pair of edge portions of the opening 31 b C in the ZC-axis direction. Therefore, the interlock portions 55 C are interlocked with the mounting region 31 C at positions where they come into contact with the pair of edge portions of the opening 31 b C. Therefore, it is possible to reliably mount the movable mirror 5 C on the base BC and to positionally align the movable mirror 5 C in a direction intersecting the main surface BsC of the base BC.

[0315]In addition, in the optical module 1 C, when viewed in the ZC-axis direction, the inner surface of the opening 31 b C includes the inclined surfaces SLC of the pair which are inclined such that the distance therebetween increases from the one end SLaC toward the other end SLbC, and the reference surface SRC which extends along the reference line BLC connecting the other end SLbC of one inclined surface SLC and the other end SLbC of the other inclined surface SLC to each other. Therefore, when the support portions 56 C are inserted into the opening 31 b C and an elastic deformation of the elastic portion 52 C is partially released, the support portions 56 C can slide on the inclined surfaces SLC due to an elastic force and can abut the reference surface SRC. Therefore, the movable mirror 5 C can be positionally aligned in a direction along the main surface BsC.

[0316]In addition, in the optical module 1 C, the elastic portion 52 C forms the annular region CAC, which is formed in an annular shape such that the mirror portion 51 C is surrounded when viewed in the XC-axis direction. Therefore, since the elastic portion 52 C has no end portion, the strength of the elastic portion 52 C can be reliably improved.

[0317]Moreover, in the movable mirror 5 C, the elastic portion 52 C has a symmetrical shape with respect to the center line DLC of the mirror surface 51 a C, and the elastic portion 52 C has equal spring constants on both sides of the center line DLC. Therefore, for example, when the elastic portion 52 C is elastically deformed in the YC-axis direction, the posture of the movable mirror 5 C is unlikely to be unstable (for example, distortion is unlikely to occur). In addition, when an elastic deformation of the elastic portion 52 C is partially released, uneven inputting of a reaction force from the inner surface of the opening 31 b C to the pair of support portions 56 C is curbed.

[0318]Here, in the optical module 1 C, the movable mirror 5 C penetrates the mounting region 31 C of the device layer 3 C, and a portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in the space S 1 C formed between the support layer 2 C and the device layer 3 C. Accordingly, for example, since there is no limitation on the size and the like of each of the interlock portions 55 C, the movable mirror 5 C can be stably and firmly fixed to the mounting region 31 C of the device layer 3 C. Thus, according to the optical module 1 C, reliable mounting of the movable mirror 5 C with respect to the device layer 3 C is realized.

[0319]In addition, in the optical module 1 C, a portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the opening 21 C of the support layer 2 C through a region inside the opening 41 C of the intermediate layer 4 C. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 C with respect to the device layer 3 C.

[0320]In addition, in the optical module 1 C, the support layer 2 C is the first silicon layer of the SOI substrate, the device layer 3 C is the second silicon layer of the SOI substrate, and the intermediate layer 4 C is the insulating layer of the SOI substrate. Accordingly, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 C with respect to the device layer 3 C using the SOI substrate.

[0321]In addition, in the optical module 1 C, the mirror surface 51 a C of the movable mirror 5 C is positioned on a side opposite to the support layer 2 C with respect to the device layer 3 C. Accordingly, it is possible to simplify the configuration of the optical module 1 C.

[0322]In addition, in the optical module 1 C, the movable mirror SC, the fixed mirror 6 C, and the beam splitter 7 C are disposed such that the interference optical system 10 C is constituted. Accordingly, it is possible to obtain an FTIR having improved sensitivity.

[0323]In addition, in the optical module 1 C, the light incident unit 8 C is disposed such that measurement light is incident on the interference optical system 10 C from outside, and the light emission unit 9 C is disposed such that the measurement light is emitted from the interference optical system 10 C to the outside. Accordingly, it is possible to obtain an FTIR including the light incident unit 8 C and the light emission unit 9 C.

[0324][Modification Examples]

[0325]Hereinabove, an embodiment of still another aspect of the present disclosure has been described. However, still another aspect of the present disclosure is not limited to the foregoing embodiment. For example, the material and the shape of each configuration are not limited to the materials and the shapes described above, and various materials and shapes can be employed.

[0326]In addition, as long as the space S 1 C is formed between the support layer 2 C and the device layer 3 C and corresponds to at least the mounting region 31 C and the driving region 32 C, various forms can be employed as illustrated in FIGS. 33 and 34 .

[0327]In the configuration illustrated in FIG. 33 , in place of the opening 21 C, a recess portion 23 C open on the device layer 3 C side is formed in the support layer 2 C, and the space S 1 C is constituted of a region inside the opening 41 C of the intermediate layer 4 C and a region inside the recess portion 23 C of the support layer 2 C. In this case, a region inside the recess portion 23 C of the support layer 2 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the recess portion 23 C through a region inside the opening 41 C of the intermediate layer 4 C. With this configuration as well, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 C with respect to the device layer 3 C.

[0328]In the configuration illustrated in FIG. 34( a ) , a region inside the opening 21 C of the support layer 2 C includes a range in which each of the interlock portions 55 C of the movable mirror 5 C moves when viewed in the ZC-axis direction. In the configuration illustrated in

[0329]FIG. 34( b ) , a region inside the recess portion 23 C of the support layer 2 C includes the range in which each of the interlock portions 55 C of the movable mirror 5 C moves when viewed in the ZC-axis direction. In these cases, a region inside the opening 41 C of the intermediate layer 4 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. In any configuration, a portion of each of the interlock portions 55 C of the movable mirror 5 C positioned in the space S 1 C does not come into contact with the intermediate layer 4 C and the support layer 2 C when the mounting region 31 C reciprocates in the direction AC.

[0330]In addition, the support layer 2 C and the device layer 3 C may be joined to each other without having the intermediate layer 4 C interposed therebetween. In this case, the support layer 2 C is formed of silicon, borosilicate glass, quartz glass, or ceramic, for example, and the device layer 3 C is formed of silicon, for example. The support layer 2 C and the device layer 3 C are joined to each other through room-temperature joining utilizing surface activation, low-temperature plasma joining, direct joining in which high-temperature processing is performed, insulating resin bonding, metal joining, joining using glass frit, or the like, for example. In this case as well, as long as the space S 1 C is formed between the support layer 2 C and the device layer 3 C and corresponds to at least the mounting region 31 C and the driving region 32 C, various forms can be employed as illustrated in FIGS. 35, 36, 37 , and 38 . In any configuration, it is possible to favorably realize a configuration for reliable mounting of the movable mirror 5 C with respect to the device layer 3 C.

[0331]In the configuration illustrated in FIG. 35( a ) , the space S 1 C is constituted of a region inside the opening 21 C of the support layer 2 C. In this case, a region inside the opening 21 C of the support layer 2 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the opening 21 C of the support layer 2 C.

[0332]In the configuration illustrated in FIG. 35( b ) , the space S 1 C is constituted of a region inside the recess portion 23 C of the support layer 2 C. In this case, a region inside the recess portion 23 C of the support layer 2 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the recess portion 23 C of the support layer 2 C.

[0333]In the configuration illustrated in FIG. 36( a ) , a recess portion (first recess portion) 38 C open on the support layer 2 C side is formed in the device layer 3 C, and the space S 1 C is constituted of a region inside the recess portion 38 C of the device layer 3 C and a region inside the opening 21 C of the support layer 2 C. In this case, a region inside the recess portion 38 C of the device layer 3 C and a region inside the opening 21 C of the support layer 2 C include the range in which the mounting region 31 C moves when viewed in the ZC-axis direction. A region inside the recess portion 38 C of the device layer 3 C forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the opening 21 C of the support layer 2 C through a region inside the recess portion 38 C of the device layer 3 C.

[0334]In the configuration illustrated in FIG. 36( b ) , the recess portion 38 C is formed in the device layer 3 C, and the space S 1 C is constituted of a region inside the recess portion 38 C of the device layer 3 C and a region inside the recess portion (second recess portion) 23 C of the support layer 2 C. In this case, a region inside the recess portion 38 C of the device layer 3 C and a region inside the recess portion 23 C of the support layer 2 C include the range in which the mounting region 31 C moves when viewed in the ZC-axis direction. A region inside the recess portion 38 C of the device layer 3 C forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the recess portion 23 C of the support layer 2 C through a region inside the recess portion 38 C of the device layer 3 C.

[0335]In the configuration illustrated in FIG. 37( a ) , the recess portion 38 C is formed in the device layer 3 C, and the space S 1 C is constituted of a region inside the recess portion 38 C of the device layer 3 C and a region inside the opening 21 C of the support layer 2 C. In this case, a region inside the recess portion 38 C of the device layer 3 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A region inside the opening 21 C of the support layer 2 C includes the range in which each of the interlock portions 55 C of the movable mirror 5 C moves when viewed in the ZC-axis direction. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the opening 21 C of the support layer 2 C through a region inside the recess portion 38 C of the device layer 3 C.

[0336]In the configuration illustrated in FIG. 37( b ) , the recess portion 38 C is formed in the device layer 3 C, and the space S 1 C is constituted of a region inside the recess portion 38 C of the device layer 3 C and a region inside the recess portion (second recess portion) 23 C of the support layer 2 C. In this case, a region inside the recess portion 38 C of the device layer 3 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A region inside the recess portion 23 C of the support layer 2 C includes the range in which each of the interlock portions 55 C of the movable mirror 5 C moves when viewed in the ZC-axis direction. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the recess portion 23 C of the support layer 2 C through a region inside the recess portion 38 C of the device layer 3 C.

[0337]In the configuration illustrated in FIG. 38 , the recess portion 38 C is formed in the device layer 3 C, and the space S 1 C is constituted of a region inside the recess portion 38 C of the device layer 3 C. In this case, a region inside the recess portion 38 C of the device layer 3 C includes the range in which the mounting region 31 C moves when viewed in the ZC-axis direction, and forms a clearance for causing a part of the mounting region 31 C and the driving region 32 C, which needs to be separated from the support layer 2 C, to be separated from the support layer 2 C. A portion of each of the interlock portions 55 C of the movable mirror 5 C is positioned in a region inside the recess portion 38 C of the device layer 3 C.

[0338]Here, in the foregoing embodiment, the movable mirror 5 C has been described in respect to a case where the mirror surface 51 a C in its entirety protrudes to the main surface BsC or a surface of the base BC on a side opposite to the main surface BsC. However, the form of the movable mirror 5 C is not limited to this case. For example, a portion of the mirror surface 51 a C of the movable mirror 5 C may be disposed inside the base BC. Hereinafter, this example will be described.

[0339]As illustrated in FIGS. 39, 40, and 41 , here, compared to the movable mirror 5 C illustrated in FIG. 28 , a movable mirror 5 AC differs from the movable mirror 5 C in having support portions 56 AC, in place of the support portions 56 C. The support portion 56 AC has an intermediate portion 59 C disposed between the elastic portion 52 C and the interlock portion 55 C. The intermediate portions 59 C linearly extend in the ZC-axis direction in a manner parallel to each other such that the mirror portion 51 C is sandwiched therebetween in the YC-axis direction. The connecting portion 57 C is included in a central portion of the intermediate portion 59 C. The interlock portion 55 C is provided in a central portion of the intermediate portion 59 C. Therefore, the interlock portions 55 C are disposed such that the mirror portion 51 C is sandwiched therebetween in the YC-axis direction. The relationship between the shapes of the interlock portions 55 C and the mounting region 31 C is similar to that of the movable mirror SC.

[0340]Accordingly, in a state where the movable mirror 5 AC in its entirety penetrates the mounting region 31 C via the opening 31 b C, the support portions 56 AC support the movable mirror 5 AC. The mirror surface 51 a C intersects the mounting region 31 C. The movable mirror 5 AC is interlocked with the device layer 3 C in the interlock portions 55 C and is supported in the mounting region 31 C. Therefore, compared to a case where the movable mirror 5 C is supported by the support portions 56 C (leg portions 54 C) extending to one side of the center line CLC in a relatively long manner, discrepancy between support points and the centroid is small, and stable mounting can be realized.

[0341]Specifically, as an example, the support portions 56 AC support the movable mirror 5 AC such that the center line CLC of the mirror surface 51 a C in the ZC-axis direction is aligned with the center of the device layer 3 C in the thickness direction. Therefore, the support points and the centroid are substantially aligned with each other in the ZC-axis direction, and more stable mounting is realized. In this case, a portion (here, half or more) of the mirror surface 51 a C is positioned on the support layer 2 C side of the main surface BsC. In contrast, here, the opening 31 b C extends to reach the end portion of the mounting region 31 C on a side facing the mirror surface 51 a C and is open therein. Therefore, even in this case as well, interference of the measurement light L 0 C with the mounting region 31 C is avoided by controlling the optical path of the measurement light L 0 C toward the mirror surface 51 a C, and the mirror surface 51 a C in its entirety can be effectively utilized.

[0342]Here, the support portion 56 AC has the contact portion 58 C extending in a direction (YC-axis direction) away from the mirror portion 51 C, from the distal end of a part of the interlock portion 55 C including the inclined surface 55 a C. The contact portion 58 C exhibits an L-shape in which a distal end portion 58 a C is bent to the base side. Then, the contact portions 58 C come into contact with the main surface BsC (mounting region 31 C) in the distal end portions 58 a C and are bonded thereto. In this manner, in a state where the interlock portions 55 C are inserted into the opening 31 b C, the support portions 56 AC include the contact portions 58 C which come into contact with the mounting region 31 C. Accordingly, similar to the movable mirror 5 C, in a state where the mirror surface 51 a C intersects the main surface BsC, the movable mirror 5 AC is supported in the mounting region 31 C by a reaction force of an elastic force applied from the inner surface of the opening 31 b C to the interlock portions 55 C and is bonded to the mounting region 31 C in the contact portions 58 C.

[0343]In the foregoing embodiment, the fixed mirror 6 C is mounted in the device layer 3 C. However, the fixed mirror 6 C may be mounted in the support layer 2 C or the intermediate layer 4 C. In addition, in the foregoing embodiment, the beam splitter 7 C is mounted in the support layer 2 C. However, the beam splitter 7 C may be mounted in the device layer 3 C or the intermediate layer 4 C. That is, the fixed mirror 6 C and the beam splitter 7 C need only be mounted in any one of the support layer 2 C, the device layer 3 C, and the intermediate layer 4 C. In addition, the beam splitter 7 C is not limited to a cube-type beam splitter and may be a plate-type beam splitter.

[0344]In addition, the optical module 1 C may include a light emitting element for generating measurement light to be incident on the light incident unit 8 C, in addition to the light incident unit 8 C. Alternatively, the optical module 1 C may include a light emitting element for generating measurement light to be incident on the interference optical system 10 C, in place of the light incident unit 8 C. In addition, the optical module 1 C may include a light receiving element for detecting measurement light (interference light) emitted from the light emission unit 9 C, in addition to the light emission unit 9 C. Alternatively, the optical module 1 C may include a light receiving element for detecting measurement light (interference light) emitted from the interference optical system 10 C, in place of the light emission unit 9 C.

[0345]In addition, a first penetration electrode which is electrically connected to each of the actuator regions 33 C, and a second penetration electrode which is electrically connected to each of both the end portions 34 a C of each of the elastic support regions 34 C are provided in the support layer 2 C and the intermediate layer 4 C (in only the support layer 2 C when the intermediate layer 4 C is not present), and a voltage may be applied to a part between the first penetration electrode and the second penetration electrode. In addition, the actuator for moving the mounting region 31 C is not limited to an electrostatic actuator, and a piezoelectric actuator, an electromagnetic actuator, or the like may be adopted, for example. In addition, the optical module 1 C is not limited to a module for constituting an FTIR and may be a module for constituting other optical systems.

[0346]Subsequently, description of modification examples will be continued. Hereinafter, modification examples will be described using the movable mirror 5 C and the opening 31 b C. However, the fixed mirror 6 C and the opening 37 a C can also be modified in a similar manner. As illustrated in FIGS. 42 and 43 , here, the interlock portion 55 C is connected to a distal end of the leg portion 54 C on a side opposite to the connecting portion 57 C. Therefore, no protrusion portion is provided at the distal end of the leg portion 54 C, which does not serve as a contact portion. Here, the interlock portion 55 C includes the contact portion 58 C. This will be described more specifically.

[0347]As described above, when the interlock portions 55 C are inserted into the opening 31 b C, the interlock portions 55 C slide on the inclined surfaces SLC toward the reference surface SRC due to a component of a reaction force from the inclined surfaces SLC in the XC-axis direction and abut the reference surface SRC while being in contact with the inclined surfaces SLC. That is, the interlock portion 55 C includes a side surface facing the inner surface (reference surface SRC) of the opening 31 b C. Then, the side surface is bonded to the reference surface SRC. This bonding can also be performed in a manner similar to bonding on the main surface BsC described above. In this manner, here, the contact portions 58 C which come into contact with the mounting region 31 C in a state where the interlock portions 55 C are inserted into the opening 31 b C include side surfaces (are side surfaces) of the interlock portions 55 C facing the reference surface SRC of the opening 31 b C.

[0348]In this case, the movable mirror 5 C can be bonded in a state where the side surfaces of the interlock portions 55 C serving as the contact portions 5 8 C are brought into contact with the inner surface of the opening 31 b C. Particularly, in this case, since bonding is performed between surfaces, it is possible to increase a bonding area and to reliably improve the mounting strength.

[0349]In the example illustrated in FIG. 44 as well, the interlock portion 55 C is connected to the distal end of the leg portion 54 C. Meanwhile, here, the support portion 56 C includes a protrusion portion which is bifurcated from the interlock portion 55 C at a connection part between the leg portion 54 C and the interlock portion 55 C and protrudes to the base BC side. The protrusion portions protrude in directions opposite to each other (outward) between the support portions 56 C of the pair. Here, the contact portion 58 C is this protrusion portion. That is, here, the contact portion 58 C extends from the connection part between the leg portion 54 C and the interlock portion 55 C such that the angle with respect to the main surface BsC is decreased. Then, in a state where the interlock portions 55 C are inserted into the opening 31 b C, the distal end portions 58 a C of the contact portions 58 C become substantially parallel to (for example, are elastically deformed to be substantially parallel to) the main surface BsC and come into contact with the main surface BsC (mounting region 31 C), thereby being bonded thereto.

[0350]In the example illustrated in FIG. 45( a ) , the movable mirror 5 C has a pair of connecting portions 53 C. Here, the pair of connecting portions 53 C is disposed at positions different from those of the pair of connecting portions 57 C. The connecting portions 53 C of the pair are distributed and disposed on both sides of the center line CLC. Particularly, here, the connecting portions 53 C of the pair are disposed at symmetrical positions with respect to the center line CLC. Therefore, here, the elastic portion 52 C and the movable mirror 5 C in their entirety are symmetrically constituted with respect to a straight line connecting the connecting portions 53 C of the pair to each other.

[0351]In addition, in the example illustrated in FIG. 45( b ) , the movable mirror 5 C has three connecting portions 53 C. The three connecting portions 53 C are disposed at positions different from those of the connecting portions 57 C of the pair. Here, one connecting portion 53 C and two connecting portions 53 C of the three connecting portions 53 C are distributed and disposed on both sides of the center line CLC. Similarly, in the example illustrated in FIG. 45( e ) , the movable mirror 5 C has four connecting portions 53 C. The four connecting portions 53 C are disposed at positions different from those of the connecting portions 57 C of the pair. Here, the four connecting portions 53 C are distributed such that two are disposed on each side of the center line CLC.

[0352]Meanwhile, as illustrated in FIG. 46( a ) , the movable mirror 5 C can have a plurality of elastic portions 52 C. Here, the movable mirror 5 C has a pair of elastic portions 52 C. The elastic portions 52 C of the pair are individually formed to have a circular plate shape and are concentrically disposed with respect to each other. In other words, here, one elastic portion 52 C is provided such that the mirror portion 51 C is surrounded, and the other elastic portion 52 C is provided such that the one elastic portion 52 C and the mirror portion 51 C are surrounded. Each of the elastic portions 52 C forms the annular region CAC.

[0353]On the other hand, the elastic portion 52 C is not limited to a circular plate shape and may have an elliptical plate shape as illustrated in FIG. 46( b ) . That is, when viewed in a direction (XC-axis direction) intersecting the mirror surface 51 a C, the elastic portion 52 C may have an elliptical shape. Here, a pair of connecting portions 53 C is disposed at positions corresponding to the long axis of the ellipse of the elastic portion 52 C. In addition, a pair of connecting portions 57 C is disposed at positions corresponding to the short axis of the ellipse of the elastic portion 52 C.

[0354]Description of modification examples of the elastic portion 52 C will be continued. In the example illustrated in FIG. 47( a ) , the movable mirror 5 C has a pair of elastic portions 52 C which has a rectangular plate shape, and a pair of plate-like connection portions 52 s C which connects the elastic portions 52 C to each other. The elastic portions 52 C are disposed on both sides of the mirror portion 51 C such that the mirror portion 51 C is sandwiched therebetween in the YC-axis direction. The elastic portions 52 C extend in the ZC-axis direction in a manner substantially parallel to the support portions 56 C. The connection portions 52 s C are provided on both end portions of the elastic portions 52 C in the longitudinal direction and connect the elastic portions 52 C to each other. Accordingly, here, the annular region CAC having a rectangularly annular shape is formed by the elastic portions 52 C and the connection portions 52 s C. Here, a single connecting portion 53 C connects the elastic portions 52 C and the mirror portion 51 C to each other via the connection portions 52 s C.

[0355]In addition, in the example illustrated in FIG. 47( b ) as well, the movable mirror 5 C has a pair of elastic portions 52 C. Here, the elastic portions 52 C are disposed on both sides of the mirror portion 51 C such that the mirror portion 51 C is sandwiched therebetween in the ZC-axis direction. Each of the elastic portions 52 C is formed to have a waved plate shape. That is, when viewed in the XC-axis direction, the elastic portions 52 C have a waved shape (here, a waved rectangular shape). The elastic portions 52 C are respectively connected to the support portions 56 C at both end portions thereof. Accordingly, here, the annular region CAC having a substantially rectangular shape is formed by the elastic portions 52 C and the support portions 56 C. In addition, here, the connecting portion 53 C connects the support portions 56 C and the mirror portion 51 C to each other. In this manner, the mirror portion 51 C may be connected to the support portions 56 C.

[0356]In addition, in the example illustrated in FIG. 47( c ) as well, the movable mirror SC has a pair of elastic portions 52 C. In this case as well, the elastic portions 52 C are disposed on both sides of the mirror portion 51 C such that the mirror portion 51 C is sandwiched therebetween in the ZC-axis direction. Each of the elastic portions 52 C is formed to have a V-plate shape. That is, when viewed in the XC-axis direction, the elastic portions 52 C have a V-shape. The elastic portions 52 C are respectively connected to the support portions 56 C at both end portions thereof. Accordingly, here, the annular region CAC having a substantially rectangular shape is formed by the elastic portions 52 C and the support portions 56 C. In this case as well, the connecting portion 53 C connects the support portions 56 C and the mirror portion 51 C to each other.

[0357]In addition, in the example illustrated in FIG. 48( a ) , when viewed in the XC-axis direction, the elastic portions 52 C may be formed to have an annular shape by semicircular portions of a pair which are disposed in directions opposite to each other, and a pair of linear portions which connects the semicircular portions to each other. Alternatively, as illustrated in FIG. 48( b ) , when viewed in the XC-axis direction, the elastic portions 52 C may be formed to have an annular shape by semicircular portions of a pair which are disposed in the same direction as each other, and a pair of linear portions which connects the semicircular portions to each other.

[0358]In addition, as illustrated in FIG. 49 , when viewed in the XC-axis direction, the elastic portions 52 C may be formed to have a shape in which a portion of the circle is cut out. In the example illustrated in FIG. 49( a ) , the elastic portions 52 C have a shape in which a pair of cut-out portions 52 c C is provided on both sides of the center line CLC with respect to the circle. That is, here, the elastic portions 52 C are constituted of circular arc parts 52 d C of a pair which are separated from each other across the cut-out portions 52 c C. The connecting portions 53 C connect the elastic portions 52 C and the mirror portion 51 C to each other at end portions of each of the circular arc parts 52 d C. Accordingly, here, one annular region CAC is formed by one circular arc part 52 d C, the pair of connecting portions 53 C which is connected to the one circular arc part 52 d C, and the mirror portion 51 C.

[0359]In the example illustrated in FIGS. 49( b ) and 49( c ) , the elastic portion 52 C is constituted as a single circular arc part 52 d C by a single cut-out portion 52 c C. The connecting portions 53 C connect the elastic portion 52 C and the mirror portion 51 C to each other at end portions of the elastic portion 52 C. Accordingly, here, the annular region CAC is formed by the elastic portion 52 C, the pair of connecting portions 53 C, and the mirror portion 51 C. Here, the connecting portions 53 C connect the support portions 56 C and the mirror portion 51 C to each other via the cut-out portion 52 c C. That is, the mirror portion 51 C may be directly connected to the support portions 56 C.

[0360]Subsequently, modification examples of the opening 31 b C illustrated in FIG. 30 will be described. As illustrated in FIG. 50( a ) , the shape of the opening 31 b C when viewed in the ZC-axis direction may be a triangular shape. In this case, the inner surface of the opening 31 b C is constituted of the pair of inclined surfaces SLC and the reference surface SRC. Here, one ends SLaC of the inclined surfaces SLC are connected to each other. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the reference surface SRC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0361]In the example illustrated in FIG. 50( b ) , the shape of the opening 31 b C when viewed in the ZC-axis direction is a hexagonal shape. In this case, the inner surface of the opening 31 b C includes a pair of inclined surfaces SLC and a pair of inclined surfaces SKC which is inclined to sides opposite to the inclined surfaces SLC. The inclined surfaces SKC of the pair are inclined such that the distance therebetween increases from one end SkaC toward the other end SKbC. Here, the other end SLbC of the inclined surface SLC and the other end SKbC of the inclined surface SKC are connected to each other and form one corner portion. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction. Here, when viewed in the ZC-axis direction, one interlock portion 55 C comes into contact with the inner surface of the opening 31 b C at two points.

[0362]As illustrated in FIG. 50( c ) , the inclined surfaces SLC may be curved surfaces. In this case, inclined surfaces SLC of a pair are inclined and curved such that the distance therebetween increases from one end SLaC toward the other end SLbC. Here, when viewed in the ZC-axis direction, the inclined surface SLC is curved such that the inclination of a tangential line of the inclined surface SLC with respect to the XC-axis gradually increases from the one end SLaC toward the other end SLbC. The inclined surface SLC is curved to be projected inward toward the opening 31 b C. Even in this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the reference surface SRC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0363]In the example illustrated in FIG. 51( a ) , both the inclined surface SLC and the inclined surface SKC have a curved surface to be projected inward to the opening 31 b C. In addition, the other end SLbC of the inclined surface SLC and the other end SKbC of the inclined surface SKC are connected to each other via a connection surface which extends in the XC-axis direction. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0364]In the example illustrated in FIG. 51( b ) , the opening 31 b C is divided into two parts 31 p C when viewed in the ZC-axis direction. Each of the two parts 31 p C has the inclined surface SLC and the reference surface SRC. That is, here, the reference surface SRC is also divided into two parts. However, when viewed in the ZC-axis direction, the reference surface SRC in its entirety extends along the reference line BLC connecting the other end SLbC of the inclined surface SLC of one part 31 p C and the other end SLbC of the inclined surface SLC of the other part 31 p C to each other. In this case, one interlock portion 55 C is inserted into the one part 31 p C of the opening 31 b C. Then, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the reference surface SRC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0365]In the example illustrated in FIG. 51( c ) as well, the opening 31 b C is divided into two parts 31 p C when viewed in the ZC-axis direction. Each of the two parts 31 p C has the inclined surface SLC and the inclined surface SKC. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0366]In the example illustrated in FIG. 52( a ) , the shape of the opening 31 b C when viewed in the ZC-axis direction is a rhombic shape. Here, the inner surface of the opening 31 b C is constituted of the inclined surfaces SLC and the inclined surfaces SKC. That is, here, in addition to that the inclined surfaces SLC and the inclined surfaces SKC are connected to each other, one ends SLaC of the inclined surfaces SLC are connected to each other, and one ends SkaC of the inclined surfaces SKC are connected to each other. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0367]Moreover, in the example illustrated in FIG. 52( b ) , the other end SLbC of the inclined surface SLC and the other end SKbC of the inclined surface SKC are connected to each other via a connection surface which extends in the XC-axis direction. In addition, one ends SLaC of the inclined surfaces SLC are connected to each other, and one ends SkaC of the inclined surfaces SKC are connected to each other. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, the movable mirror 5 C can be positionally aligned in both the XC-axis direction and the YC-axis direction.

[0368]As above, when the side surface of the interlock portion 55 C comes into contact with the inner surface of the opening 31 b C such as a case where the side surface of the interlock portion 55 C and the reference surface SRC of the opening 31 b C come into contact with each other, the side surface of the interlock portion 55 C can be used as the contact portion 58 C in bonding.

[0369]Here, in the foregoing description, a case where the interlock portion 55 C is inserted into the opening 31 b C after the gap between the support portions 56 C is decreased in accordance with the elastic portions 52 C which are elastically deformed to be compressed in the facing direction of the support portions 56 C has been described as an example. However, it is also possible to employ a modification example in which the interlock portion 55 C is inserted into the opening 31 b C after the gap between the support portions 56 C is increased.

[0370]That is, the movable mirror 5 C and the opening 31 b C can be deformed as illustrated in FIGS. 53 and 54 . In the example of FIG. 53 , the support portion 56 C includes the leg portion 54 C, the interlock portion 55 C, and the contact portion 58 C. However, the bending direction of the interlock portion 55 C differs from that of the example in FIG. 28 . The interlock portions 55 C are bent to be projected to opposite sides in the facing direction between the support portions 56 C of the pair. Then, the interlock portions 55 C include the inclined surfaces 55 a C and the inclined surfaces 55 b C as surfaces (inner surfaces) facing each other between the support portions 56 C of the pair.

[0371]The inclined surfaces 55 a C are inclined away from each other in a direction (negative ZC-axis direction) away from the connecting portions 57 C. In addition, the inclined surfaces 55 b C are inclined toward each other in the negative ZC-axis direction. The absolute value for the inclination angle thereof with respect to the ZC-axis is similar to that of the foregoing example. Here, a handle portion 56 h C is provided for each of the support portions 56 C. The handle portions 56 h C are disposed such that the mirror portion 51 C and the elastic portion 52 C are sandwiched therebetween in the YC-axis direction. The handle portions 56 h C and the connecting portions 57 C are arranged in a row along the center line CLC.

[0372]In the example of FIG. 53( a ) , the handle portion 56 h C is formed to have a U-shape, and a hole portion 56 s C is formed between the handle portion 56 h C and the support portion 56 C. Therefore, for example, when arms are inserted into the hole portions 56 s C, a force can be applied to the handle portions 56 h C such that the gap between the support portions 56 C is increased. In addition, in the example of FIG. 53( b ) , the handle portions 56 h C are linearly faulted. Therefore, when the handle portions 56 h C are grabbed, a force can be applied to the handle portions 56 h C such that the gap between the support portions 56 C is increased. In these cases, the elastic portion 52 C is elastically deformed to be stretched in the YC-axis direction.

[0373]Correspondingly, the opening 31 b C can be deformed as illustrated in FIG. 54 . In the example of FIG. 54( a ) , the opening 31 b C is divided into two triangular parts 31 p C. In the movable mirror 5 C illustrated in FIG. 53 , when an elastic deformation of the elastic portion 52 C is partially released in a state where the interlock portions 55 C are inserted into the opening 31 b C, the interlock portions 55 C are displaced toward each other. In order to perform self-alignment utilizing this displacement, the inclined surface SLC is formed in each of the parts 31 p C of the opening 31 b C as a surface of the mounting region 31 C on the center side in the YC-axis direction.

[0374]The inclined surface SLC includes one end SLaC and the other end SLbC. The one end SLaC and the other end SLbC are both end portions of the inclined surface SLC when viewed in the ZC-axis direction. The inclined surfaces SLC of the pair are inclined such that the distance therebetween is decreased from the one ends SLaC toward the other ends SLbC (for example, with respect to the XC-axis). When viewed in the ZC-axis direction, the reference surface SRC of each of the parts 31 p C extends along the reference line BLC connecting the other end SLbC of one inclined surface SLC and the other end SLbC of the other inclined surface SLC to each other.

[0375]Therefore, when the pair of interlock portions 55 C is disposed inside the opening 31 b C, the interlock portions 55 C slide on the inclined surfaces SLC toward the reference surface SRC due to a component of a reaction force from the inclined surfaces SLC in the XC-axis direction and abut the reference surface SRC while being in contact with the inclined surfaces SLC. Accordingly, the interlock portions 55 C come into internal contact with the corner portions defined by the inclined surfaces SLC and the reference surfaces SRC and are positionally aligned (self-aligned due to an elastic force) in both the XC-axis direction and the YC-axis direction.

[0376]In the example of FIG. 54( b ) , the opening 31 b C is divided into two rhombic parts 31 p C. The inclined surface SLC and the inclined surface SKC are formed in each of the parts 31 p C of the opening 31 b C as a pair of surfaces of the mounting region 31 C on the center side in the YC-axis direction. When focusing on one part 31 p C, the inclined surface SLC and the inclined surface SKC are inclined to sides opposite to each other. The inclined surfaces SKC are inclined such that the distance therebetween is decreased from one ends SkaC toward the other ends SKbC. Here, the other end SLbC of the inclined surface SLC and the other end SKbC of the inclined surface SKC are connected to each other and form one corner portion. In this case as well, when the interlock portion 55 C comes into internal contact with a corner portion defined by the inclined surface SLC and the inclined surface SKC, it is positionally aligned (self-aligned due to an elastic force) in both the XC-axis direction and the YC-axis direction.

[0377]Hereinabove, various modification examples of the movable mirror 5 C and the opening 31 b C have been described. However, the modification examples of the movable mirrors 5 C and 5 AC and the opening 31 b C are not limited to those described above. For example, the contact portion 58 C may include both the protrusion portion which is bifurcated from the interlock portion 55 C and the side surface of the interlock portion 55 C which faces the inner surface of the opening 31 b C. In this case, the movable mirror 5 C can be bonded to the mounting region 31 C in both the protrusion portions and the side surfaces of the interlock portions 55 C. In addition, the movable mirrors 5 C and 5 AC and the opening 31 b C can be constituted as another modification example by replacing arbitrary parts in the foregoing modification examples with each other. The same applies to the fixed mirror 6 C and the opening 37 a C.

[0378]Moreover, in the foregoing embodiment, a movable mirror and a fixed mirror have been described as examples of optical elements to be mounted on the base BC. In this example, the optical surface is a mirror surface. However, the optical element which becomes a mounting target is not limited to a mirror. For example, an arbitrary element such as a grating, an optical filter, or the like can be adopted.

[0379]In addition, the shapes of the mirror portions 51 C and 61 C and the mirror surfaces 51 a C and 61 a C are not limited to a circular shape and may be a rectangular shape or other shapes. In addition, the annular region CAC does not have to be formed in the elastic portion 52 C. The following are appendixes of the foregoing third embodiment.

[0380][Appendix 14]

[0381]An optical module including:

[0382]an optical element; and

[0383]a base on which the optical element is mounted, in which

[0384]the optical element has

[0385]an optical portion which has an optical surface, an elastic portion which is provided around the optical portion, and a pair of support portions to which an elastic force is applied and in which a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion,

[0386]the base has

[0387]a main surface, and a mounting region in which an opening communicating with the main surface is provided,

[0388]the support portion includes

[0389]an interlock portion which is inserted into the opening in a state where an elastic force of the elastic portion is applied, and a contact portion which comes into contact with the mounting region in a state where the interlock portion is inserted into the opening, and

[0390]the optical element is supported in the mounting region by a reaction force of the elastic force applied from an inner surface of the opening to the interlock portion in a state where the optical surface intersects the main surface and is bonded to the mounting region in the contact portion.

[0391][Appendix 15]

[0392]The optical module according to appendix 14, in which

[0393]the support portion includes a protrusion portion which is bifurcated from the interlock portion and protrudes to the base side, and

[0394]the contact portion includes a distal end portion of the protrusion portion,

[0395][Appendix 16]

[0396]The optical module according to appendix 14 or 15, in which

[0397]the contact portion includes a side surface of the interlock portion facing the inner surface of the opening,

[0398][Appendix 17]

[0399]The optical module according to any one of appendixes 14 to 16, in which

[0400]the base has a support layer and a device layer which is provided on the support layer and includes the main surface and the mounting region,

[0401]the opening penetrates the device layer in a direction intersecting the main surface, and

[0402]the interlock portion is bent to come into contact with a pair of edge portions of the opening in a direction intersecting the main surface.

[0403][Appendix 18]

[0404]The optical module according to any one of appendixes 14 to 17, in which

[0405]the inner surface of the opening includes

[0406]a pair of inclined surfaces which is inclined such that a distance therebetween increases from one end toward the other end when viewed in a direction intersecting the main surface, and a reference surface which extends along a reference line connecting the other end of one inclined surface and the other end of the other inclined surface to each other, and

[0407]the contact portion includes a side surface of the interlock portion facing the reference surface.

[0408][Appendix 19]

[0409]The optical module according to appendix 17, further including:

[0410]a fixed mirror which is mounted in at least one of the support layer, the device layer, and an intermediate layer which is provided between the support layer and the device layer; and

[0411]a beam splitter which is mounted in at least one of the support layer, the device layer, and the intermediate layer, in which

[0412]the optical element is a movable mirror which includes the optical surface serving as a mirror surface,

[0413]the device layer has a driving region which is connected to the mounting region, and

[0414]the movable minor, the fixed minor, and the beam splitter are disposed such that an interference optical system is constituted.

[0415][Appendix 20]

[0416]The optical module according to appendix 19, in which

[0417]the base has the intermediate layer which is provided between the support layer and the device layer,

[0418]the support layer is a first silicon layer of an SOI substrate,

[0419]the device layer is a second silicon layer of the SOI substrate, and

[0420]the intermediate layer is an insulating layer of the SOI substrate.

[0421][Appendix 21]

[0422]The optical module according to appendix 19 or 20, further including:

[0423]a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside; and

[0424]a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside.

[0425]The optical module according to the first embodiment, the optical module according to the second embodiment, and the optical module according to the third embodiment described above can be subjected to modification in which an arbitrary element thereof is added to and/or replaced with each other.

[0426]INDUSTRIAL APPLICABILITY

[0427]It is possible to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0428]REFERENCE SIGNS LIST

[0429]1 A Optical module

[0430]2 A Support layer

[0431]3 A Device layer

[0432]4 A Intermediate layer

[0433]5 A Movable mirror

[0434]6 A Fixed mirror

[0435]7 A Beam splitter

[0436]8 A Light incident unit

[0437]9 A Light emission unit

[0438]10 A Interference optical system

[0439]21 A Opening (second opening)

[0440]23 A Recess portion (second recess portion)

[0441]31 A Mounting region

[0442]32 A Driving region

[0443]38 A Recess portion (first recess portion)

[0444]41 A Opening (first opening)

[0445]51 a A Mirror surface

[0446]S 1 A Space

[0447]1 B Optical module

[0448]2 B Support layer

[0449]3 B Device layer

[0450]4 B Intermediate layer

[0451]5 B Movable minor

[0452]6 B Fixed mirror

[0453]7 B Beam splitter

[0454]8 B Light incident unit

[0455]9 B Light emission unit

[0456]10 B Interference optical system

[0457]31 B Mounting region

[0458]31 b B First opening

[0459]31 c B Second opening

[0460]32 B Driving region

[0461]51 B Mirror portion

[0462]51 a B Mirror surface

[0463]52 B Elastic portion

[0464]53 B Support portion

[0465]56 B Interlock portion (protrusion portion)

[0466]57 B Folded portion

[0467]BB Base

[0468]BaB First surface

[0469]BbB Second surface

[0470]SAB Inclined surface

[0471]SAaB One end

[0472]SAbB The other end

[0473]1 C Optical module

[0474]2 C Support layer

[0475]3 C Device layer

[0476]4 C Intermediate layer

[0477]5 C, 5 AC Movable mirror (optical element)

[0478]6 C Fixed mirror (optical element)

[0479]7 C Beam splitter

[0480]8 C Light incident unit

[0481]9 C Light emission unit

[0482]10 C Interference optical system

[0483]31 C, 37 C Mounting region

[0484]31 b C, 37 a C Opening

[0485]32 C Driving region

[0486]51 C, 61 C Mirror portion (optical portion)

[0487]51 a C, 61 a C Mirror surface (optical surface)

[0488]52 C, 62 C Elastic portion

[0489]53 C, 63 C Connecting portion

[0490]54 C, 64 C Leg portion

[0491]55 C, 65 C Interlock portion

[0492]55 a C, 55 b C, 65 a C, 65 b C Inclined surface

[0493]56 C, 66 C Support portion

[0494]57 C, 67 C Connecting portion

[0495]58 C, 68 C Contact portion

[0496]SLC Inclined surface

[0497]SLaC One end

[0498]SLbC The other end

[0499]SRC Reference surface

[0500]BLC Reference line

同族专利

暂无同族专利

专

一种高温氯化物熔盐腐蚀环境下金属材料的保护方法

110200117682W

发明人

朱明, 易兴月, 黄鹏飞, 来兴平, 张慧慧, 严海通, 冉梦园

受让人

UNIV XIAN SCI & TECHNOLOGY (UYXS-C)

申请人

KNU-INDUSTRY COOPERATION FOUNDATION

申请号

173924

申请日

2007-12-13

公开(公告)号

110200117682W

公开(公告)日

2021-06-24

IPC分类号

B32B027/12B32B027/14B32B027/32

CPC分类号

优先权号

1020190025606

优先权日

2019-03-05

摘要

DETAILED DESCRIPTION - The composition comprises:

(ii) 1-20 wt% of photopolymerizable acrylated monomer treated with the acid anhydride of formula 4;

(iii) 0.1-10 wt% of photopolymerization initiator;

(iv) 0.1-20 wt% of epoxide of formula 5 treated with the acid anhydride of formula 4;

(v) 0.1-40 wt% of pigment;

(vi) 20-90 wt% of solvent; and

(vii) 0.005-5 wt% of surfactant.

权利要求

6. The clock network of claim 5 , wherein the third set of lines is connected to a sneak path from the at least one logic resource.

7. The clock network of claim 5 , wherein the third set of lines is configured to receive an input-clock signal from a dedicated input-clock pin.

10. The clock network of claim 9 , wherein the third set of clock lines receives an input-clock signal from a sneak path of at least one logic resource.

11. The clock network of claim 10 , wherein the third set of clock lines receives an input-clock signal from a dedicated input-clock pin.

14. The clock network of claim 13 , where the first and second central lines receive input-clock signals from input pins of the PLD that are not dedicated as input-clock pins.

16. The method of claim 15 further comprising: receiving input-clock signals from a logic resource on the integrated circuit.

17. The method of claim 15 further comprising: receiving input-clock signals from input pins on the integrated circuit that are not dedicated as input-clock pins.

说明书

[0001]TECHNICAL FIELD

[0002]An aspect of the present disclosure relates to an optical module.

[0003]BACKGROUND ART

[0005]CITATION LIST

[0006]Patent Literature

[0007]Patent Literature 1: Japanese Unexamined Patent Publication No. 2012-524295

[0008]SUMMARY OF INVENTION

[0009]Technical Problem

[0011]An object of an aspect of the present disclosure is to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0012]Solution to Problem

[0023]Advantageous Effects of Invention

[0024]According to the aspect of the present disclosure, it is possible to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0026]DESCRIPTION OF EMBODIMENTS

[0027]First Embodiment

[0029][Configuration of Optical Module]

[0043][Movable Mirror and Surrounding Structure Thereof]

[0053][Fixed Mirror and Surrounding Structure Thereof]

[0062][Operations and Effects]

[0069][Modification Examples]

[0088]Second Embodiment

[0091]An object of another aspect of the present disclosure is to provide an optical module in which reliable mounting of an optical element can be realized.

[0106]According to another aspect of the present disclosure, it is possible to provide an optical module in which reliable mounting of an optical element can be realized.

[0108][Configuration of Optical Module]

[0122][Movable Mirror and Surrounding Structure Thereof]

[0145][Fixed Mirror and Surrounding Structure Thereof]

[0160][Operations and Effects]

[0174][Modification Examples]

[0187][Appendix 1]

[0188]An optical module including:

[0189]a base; and

[0190]an optical element which is mounted on the base, in which

[0192]the optical element has an optical portion which has an optical surface and a support portion which supports the optical portion on the base, and

[0194][Appendix 2]

[0195]The optical module according to appendix 1, in which

[0196]a pair of second openings is provided such that the first opening is sandwiched therebetween,

[0197]a pair of protrusion portions is provided, and

[0198]the folded portion is provided in each of the pair of protrusion portions and enters each of the pair of second openings.

[0199][Appendix 3]

[0200]The optical module according to appendix 1 or 2, in which

[0201]the protrusion portion comes into contact with at least an edge portion of the first opening on the first surface side.

[0202][Appendix 4]

[0203]The optical module according to any one of appendixes 1 to 3, in which

[0204]the folded portion comes into contact with an edge portion of the second opening on the second surface side.

[0205][Appendix 5]

[0206]The optical module according to any one of appendixes 1 to 4, in which

[0207]the optical element further has an elastic portion,

[0208]a pair of protrusion portions is provided,

[0210]the optical element is supported in the base by a reaction force of the elastic force applied from an inner surface of the first opening to the pair of protrusion portions.

[0211][Appendix 6]

[0212]The optical module according to appendix 5, in which

[0213]the pair of protrusion portions is inserted into the first opening in a state where an elastic force of the elastic portion is applied in a direction away from each other.

[0214][Appendix 7]

[0215]The optical module according to appendix 5 or 6, in which

[0217][Appendix 8]

[0218]The optical module according to appendix 7, in which

[0220][Appendix 9]

[0221]The optical module according to any one of appendixes 1 to 8, in which

[0222]the base has a support layer, and a device layer which is provided on the support layer and includes the first surface and the second surface.

[0223][Appendix 10]

[0224]The optical module according to appendix 9, in which

[0225]the base has an intermediate layer which is provided between the support layer and the device layer.

[0226][Appendix 11]

[0227]The optical module according to appendix 10, further including:

[0228]a fixed mirror which is mounted in the support layer, the device layer, or the intermediate layer; and

[0229]a beam splitter which is mounted in the support layer, the device layer, or the intermediate layer, in which

[0230]the optical element is a movable mirror which includes the optical surface serving as a mirror surface,

[0231]the device layer has a mounting region in which the optical element is mounted and a driving region which is connected to the mounting region, and

[0232]the movable mirror, the fixed mirror, and the beam splitter are disposed such that an interference optical system is constituted.

[0233][Appendix 12]

[0234]The optical module according to appendix 11, in which

[0235]the support layer is a first silicon layer of an SOI substrate,

[0236]the device layer is a second silicon layer of the SOI substrate, and

[0237]the intermediate layer is an insulating layer of the SOI substrate.

[0238][Appendix 13]

[0239]The optical module according to appendix 11 or 12, further including:

[0240]a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside; and

[0241]a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside.

[0242]Third Embodiment

[0259][Configuration of Optical Module]

[0273][Movable Mirror and Surrounding Structure Thereof]

[0294][Fixed Mirror and Surrounding Structure Thereof]

[0309][Operations and Effects]

[0324][Modification Examples]

[0380][Appendix 14]

[0381]An optical module including:

[0382]an optical element; and

[0383]a base on which the optical element is mounted, in which

[0384]the optical element has

[0386]the base has

[0387]a main surface, and a mounting region in which an opening communicating with the main surface is provided,

[0388]the support portion includes

[0391][Appendix 15]

[0392]The optical module according to appendix 14, in which

[0393]the support portion includes a protrusion portion which is bifurcated from the interlock portion and protrudes to the base side, and

[0394]the contact portion includes a distal end portion of the protrusion portion,

[0395][Appendix 16]

[0396]The optical module according to appendix 14 or 15, in which

[0397]the contact portion includes a side surface of the interlock portion facing the inner surface of the opening,

[0398][Appendix 17]

[0399]The optical module according to any one of appendixes 14 to 16, in which

[0400]the base has a support layer and a device layer which is provided on the support layer and includes the main surface and the mounting region,

[0401]the opening penetrates the device layer in a direction intersecting the main surface, and

[0402]the interlock portion is bent to come into contact with a pair of edge portions of the opening in a direction intersecting the main surface.

[0403][Appendix 18]

[0404]The optical module according to any one of appendixes 14 to 17, in which

[0405]the inner surface of the opening includes

[0407]the contact portion includes a side surface of the interlock portion facing the reference surface.

[0408][Appendix 19]

[0409]The optical module according to appendix 17, further including:

[0410]a fixed mirror which is mounted in at least one of the support layer, the device layer, and an intermediate layer which is provided between the support layer and the device layer; and

[0411]a beam splitter which is mounted in at least one of the support layer, the device layer, and the intermediate layer, in which

[0412]the optical element is a movable mirror which includes the optical surface serving as a mirror surface,

[0413]the device layer has a driving region which is connected to the mounting region, and

[0414]the movable minor, the fixed minor, and the beam splitter are disposed such that an interference optical system is constituted.

[0415][Appendix 20]

[0416]The optical module according to appendix 19, in which

[0417]the base has the intermediate layer which is provided between the support layer and the device layer,

[0418]the support layer is a first silicon layer of an SOI substrate,

[0419]the device layer is a second silicon layer of the SOI substrate, and

[0420]the intermediate layer is an insulating layer of the SOI substrate.

[0421][Appendix 21]

[0422]The optical module according to appendix 19 or 20, further including:

[0423]a light incident unit which is disposed such that measurement light is incident on the interference optical system from outside; and

[0424]a light emission unit which is disposed such that the measurement light is emitted from the interference optical system to the outside.

[0426]INDUSTRIAL APPLICABILITY

[0427]It is possible to provide an optical module in which reliable mounting of a movable mirror with respect to a device layer is realized.

[0428]REFERENCE SIGNS LIST

[0429]1 A Optical module

[0430]2 A Support layer

[0431]3 A Device layer

[0432]4 A Intermediate layer

[0433]5 A Movable mirror

[0434]6 A Fixed mirror

[0435]7 A Beam splitter

[0436]8 A Light incident unit

[0437]9 A Light emission unit

[0438]10 A Interference optical system

[0439]21 A Opening (second opening)

[0440]23 A Recess portion (second recess portion)

[0441]31 A Mounting region

[0442]32 A Driving region

[0443]38 A Recess portion (first recess portion)

[0444]41 A Opening (first opening)

[0445]51 a A Mirror surface

[0446]S 1 A Space

[0447]1 B Optical module

[0448]2 B Support layer

[0449]3 B Device layer

[0450]4 B Intermediate layer

[0451]5 B Movable minor

[0452]6 B Fixed mirror

[0453]7 B Beam splitter

[0454]8 B Light incident unit

[0455]9 B Light emission unit

[0456]10 B Interference optical system

[0457]31 B Mounting region

[0458]31 b B First opening

[0459]31 c B Second opening

[0460]32 B Driving region

[0461]51 B Mirror portion

[0462]51 a B Mirror surface

[0463]52 B Elastic portion

[0464]53 B Support portion

[0465]56 B Interlock portion (protrusion portion)

[0466]57 B Folded portion

[0467]BB Base

[0468]BaB First surface

[0469]BbB Second surface

[0470]SAB Inclined surface

[0471]SAaB One end

[0472]SAbB The other end

[0473]1 C Optical module

[0474]2 C Support layer

[0475]3 C Device layer

[0476]4 C Intermediate layer

[0477]5 C, 5 AC Movable mirror (optical element)

[0478]6 C Fixed mirror (optical element)

[0479]7 C Beam splitter

[0480]8 C Light incident unit

[0481]9 C Light emission unit

[0482]10 C Interference optical system

[0483]31 C, 37 C Mounting region

[0484]31 b C, 37 a C Opening

[0485]32 C Driving region

[0486]51 C, 61 C Mirror portion (optical portion)

[0487]51 a C, 61 a C Mirror surface (optical surface)

[0488]52 C, 62 C Elastic portion

[0489]53 C, 63 C Connecting portion

[0490]54 C, 64 C Leg portion

[0491]55 C, 65 C Interlock portion

[0492]55 a C, 55 b C, 65 a C, 65 b C Inclined surface

[0493]56 C, 66 C Support portion

[0494]57 C, 67 C Connecting portion

[0495]58 C, 68 C Contact portion

[0496]SLC Inclined surface

[0497]SLaC One end

[0498]SLbC The other end

[0499]SRC Reference surface

[0500]BLC Reference line

同族专利

暂无同族专利