1 - 18 . (canceled)
19 . A method for manufacturing an optoelectronic semiconductor device, the method comprising: A) providing a semiconductor layer sequence, the semiconductor layer sequence having a radiation side with a plurality of illumination areas; B) applying a photostructurable first photo layer on the radiation side; C) photostructuring the first photo layer, wherein holes are formed in the first photo layer in regions of first illumination areas; D) applying a first converter material to the structured first photo layer, wherein the first converter material partially or completely fills the holes, thereby forming first converter elements in the holes, the first converter elements covering the associated first illumination areas; E) removing the first photo layer; and F) applying a second converter material to the radiation side at least in regions of second illumination areas, the second illumination areas being different from the first illumination areas.
20 . The method according to claim 19 , wherein the first converter elements are in direct contact with the second converter material after steps A) to F).
21 . The method according to claim 19 , wherein the first photo layer comprises a photostructurable silicone.
22 . The method according to claim 19 , further comprising removing the first converter material from regions laterally adjacent to the holes before or during step E).
23 . The method according to claim 19 , wherein step F) is carried out after steps A) to E).
24 . The method according to claim 23 , wherein the second converter material is applied to a plurality of illumination areas, thereby also covering the first illumination areas which are already covered with the first converter elements.
25 . The method according to claim 24 , wherein applying the second converter material comprises directly applying the second converter material to the first converter elements in the regions of the first illumination areas.
26 . The method according to claim 23 , wherein applying the second converter material comprises: applying a photostructurable second photo layer to the radiation side; photostructuring the second photo layer such that holes are created in the regions of the second illumination areas; and applying the second converter material to the structured second photo layer, wherein the second converter material partially or completely fills the holes, thereby forming second converter elements in the holes, the second converter elements covering the associated second illumination areas, and wherein the second converter elements directly adjoin the first converter elements.
27 . The method according to claim 19 , wherein step F) is carried out before steps B) to E).
28 . The method according to claim 27 , wherein applying the second converter material comprises applying the second converter material as a simply-connected layer covering the first illumination areas and the second illumination areas.
29 . The method according to claim 19 , wherein the radiation side comprises third illumination areas, and wherein the third illumination areas are kept free from the first converter material and the second converter material.
30 . An optoelectronic semiconductor device comprising: a pixelated semiconductor chip, wherein the semiconductor chip has a radiation side with a plurality of illumination areas; first converter elements, wherein first illumination areas are covered by the first converter elements made of a first converter material, wherein a first converter element is uniquely assigned to each of the first illumination areas; and a second converter material covering second illumination areas, wherein the second converter material is different from the first converter material, wherein the second illumination areas are different from the first illumination areas, wherein the second converter material is directly adjoining the first converter elements, and wherein each of the first converter material and the second converter material comprises a matrix material in which phosphor particles are distributed.
31 . The semiconductor device according to claim 30 , wherein the second converter material is a simple connect layer over a plurality of first illumination areas and second illumination areas, wherein, in regions of the first illumination areas, the layer of the second converter material is arranged between the semiconductor chip and the first converter elements.
32 . The semiconductor device according to claim 30 , wherein the second converter material also covers the first converter elements so that the first converter elements are arranged between the semiconductor chip and the second converter material.
33 . The semiconductor device according to claim 30 , wherein the second illumination areas are covered by second converter elements made of the second converter material, and wherein a second converter element is uniquely assigned to each of the second illumination areas.
34 . The semiconductor device according to claim 30 , wherein the semiconductor chip is configured to emit radiation of a first wavelength range, and wherein the first converter material and the second converter material are selected such that radiation emerging from the semiconductor device in regions of the first illumination areas is warm white light and radiation emerging from regions of the second illumination areas from the semiconductor device is cold white light.
35 . The semiconductor device according to claim 30 , wherein the semiconductor chip is configured to emit blue light, wherein the first converter material is configured to convert blue light into green light, wherein the second converter material is configured to convert blue light into red light.
36 . The semiconductor device according to claim 30 , wherein the semiconductor device has a radiation surface with a Bayer matrix.
37 . A method of manufacturing an optoelectronic semiconductor device, the method comprising: A) providing a semiconductor layer sequence, the semiconductor layer sequence having a radiation side with a plurality of illumination areas; B) applying a photostructurable first photo layer on the radiation side; C) photostructuring the first photo layer, wherein holes are formed in the first photo layer in regions of first illumination areas; D) applying a first converter material to the structured first photo layer, wherein the first converter material partially or completely fills the holes, thereby forming first converter elements in the holes, the first converter elements covering the associated first illumination areas; E) removing the first photo layer; F) applying a second converter material to the radiation side at least in regions of second illumination areas, the second illumination areas being different from the first illumination areas, wherein, after steps A) to F), the first converter elements are in direct contact with the second converter material, wherein, after steps E) and F), the semiconductor layer sequence is separated into a plurality of pixelated semiconductor chips, each semiconductor chip comprising a part of the semiconductor layer sequence, an active layer and a part of the radiation side including first and second illumination areas, and wherein the active layer of a semiconductor chip is formed contiguously.
