NOVELTY - The substrate connection pad (24) of one PCB (21) is arranged opposing through-hole (26) of another PCB (22) and the PCBs is aligned opposingly. The pad and through-hole is electrically connected via solder balls (27). DETAILED DESCRIPTION - A substrate connection pad is provided in the peripheral electronic component (23) arranged on a PCB (21). A substrate connection through-hole (26) is formed on the surface of another PCB (22), corresponding to the position of connection pad.
USE -For electronic equipment such as PC.
ADVANTAGE -The mounting operation of electronic component is made simple. The reinforcement of high density mounting in circuit module is obtained in reduced size. DESCRIPTION OF DRAWING(S) - The figure shows principal diagram of circuit module. (21,22) PCBs; (23) Electronic component; (24) Substrate connection pad; (26) Through-hole; (27) Solder ball.