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    专

    一种基于热扩散原理的注蒸汽井干度测井装置

    PL260279B1
    发明人
    WANG YANJUN, WANG ZENGLIN, LI RONGQIANG, ZHANG ZHIQIANG, PENG ZENGYI, XU WEI, XUE HUI, JI LONGSHENG, YUAN XUDONG, SONG TAO, NING XIAOXIAO, CHEN SHIJUN
    受让人
    CHINA PETROLEUM & CHEM CORP, CHINA PETROLEUM & CHEMICAL CORP SHENGLI OILFIELD BRANCH YOUZANG DYNAMIC MONITORING CENTER
    申请人
    中国科学院大▲連▼化学物理研究所
    申请号
    1020170102376
    申请日
    1970-01-05
    公开(公告)号
    PL260279B1
    公开(公告)日
    1991-10-23
    IPC分类号
    B60R016/04
    CPC分类号
    -
    优先权号
    070614
    优先权日
    2005-08-01
    摘要

    NOVELTY - The computer readable security profiles identifying security elements containing signature and encryption keys used for accessing a message, are provided. A particular set of the elements for the message which is acceptable to respective services, is selected for message communication between the respective services.

    USE - For determining security option between web service during on-line business of metals such gold and silver.

    ADVANTAGE - Determines security option used for trading partners.

    DESCRIPTION OF DRAWING(S) - The figure explains negotiation and implementation of security management.

    registry (201)

    ecurity management computing device (202)

    ecurity arrangements (203)

    document (204)

    ending service (205)

    权利要求
    1. An integrated circuit comprising: a first circuit module adapted to receive electrical power and perform a function; and a second circuit module comprising: a first sub-module adapted to monitor a performance characteristic of at least one of the first circuit module and the integrated circuit; a second sub-module, communicatively coupled to the first sub-module, adapted to communicate with a third circuit module regarding the performance characteristic monitored by the first sub-module; wherein: the second circuit module comprises a performance monitor module; and the third circuit module comprises a power controller module.
    2. The integrated circuit of claim 1 , wherein the third circuit module is external to the integrated circuit.
    3. The integrated circuit of claim 1 , wherein the third circuit module is a circuit module of a power supply circuit that is external to the integrated circuit.
    4. The integrated circuit of claim 1 , wherein the third circuit module is adapted to: receive information regarding performance characteristics of a plurality of modules, the plurality of modules comprising the first circuit module; analyze the received information regarding performance characteristics to determine power control information; and communicate the determined power control information to power supply circuitry that provides the electrical power.
    5. The integrated circuit of claim 4 , wherein the third circuit module is adapted to analyze the received information regarding performance characteristics to determine power control information by analyzing at least one of respective priorities of the plurality of modules and/or respective performance needs of the plurality of modules.
    6. The integrated circuit of claim 1 , wherein the performance characteristic comprises processing speed.
    7. The integrated circuit of claim 1 , wherein the performance characteristic comprises.
    8. The integrated circuit of claim 1 , wherein the second sub-module is adapted to communicate information with the third circuit module, the information comprising information of the monitored performance characteristic.
    9. The integrated circuit of claim 1 , wherein the second sub-module is adapted to communicate information with the third circuit module, the information comprising power adjustment information related to a change in the monitored performance characteristic.
    10. The integrated circuit of claim 1 , wherein the third circuit module is internal to the integrated circuit.
    11. The integrated circuit of claim 1 , wherein the performance characteristic comprises error rate.
    12. The integrated circuit of claim 1 , wherein the performance characteristic comprises data throughput rate.
    13. The integrated circuit of claim 1 , wherein the performance characteristic comprises response time.
    14. The integrated circuit of claim 1 , wherein the performance characteristic comprises energy consumption.
    15. The integrated circuit of claim 1 , wherein the performance characteristic comprises delay time.
    16. The integrated circuit of claim 1 , wherein the performance characteristic comprises communication rate.
    17. The integrated circuit of claim 1 , wherein the performance characteristic comprises energy efficiency.
    18. The integrated circuit of claim 1 , wherein the performance characteristic comprises noise level.
    19. In an integrated circuit, a method for controlling electrical power provided to the integrated circuit, the method comprising: receiving electrical power at a first circuit module and utilizing the electrical power to perform a function; monitoring a performance characteristic of at least one of the integrated circuit and the first circuit module; communicating information related to the monitored performance characteristic with a third circuit module; and wherein the third circuit module comprises a power controller module.
    20. The method of claim 19 , wherein the third circuit module comprises power supply circuitry that provides power to the integrated circuit.
    21. The method of claim 19 , wherein the performance characteristic comprises at least one of: processing speed, temperature, energy consumption, data throughput rate, response time, delay time, communication rate, energy efficiency, noise level and/or error rate.
    22. The method of claim 19 , wherein the information related to the monitored performance characteristic comprises information of the monitored performance characteristic.
    23. The method of claim 19 , wherein the information related to the monitored performance characteristic comprises power adjustment information related to a change in the monitored performance characteristic.
    24. The method of claim 19 , further comprising: monitoring performance characteristics of a plurality of circuit modules, the plurality of circuit modules comprising the first circuit module; analyzing information of the monitored performance characteristics to determine power control information; and communicating the determined power control information to power supply circuitry that provides electrical power to the plurality of circuit modules.
    25. The method of claim 24 , wherein analyzing information of the monitored performance characteristics comprises analyzing at least one of respective priorities of the plurality of circuit modules and respective performance needs of the plurality of circuit modules to determine the power control information.
    26. An integrated circuit comprising: a performance sensor; a first module adapted to utilize the performance sensor to monitor a performance characteristic of a first electrical device that is external to the integrated circuit; a second module adapted to determine power control information based, at least in part, on the monitored performance characteristic; a third module adapted to communicate at least a portion of the determined power control information with a second electrical device that is external to the integrated circuit; and wherein the second electrical device comprises a power supply circuit adapted to provide electrical power to the first electrical device.
    27. The integrated circuit of claim 26 , wherein the performance characteristic of the first electrical device comprises processing speed.
    28. The integrated circuit of claim 26 , wherein the communicated power control information comprises information of the monitored performance characteristic.
    29. The integrated circuit of claim 26 , wherein the communicated power control information comprises power adjustment information related to a change in the monitored performance characteristic.
    30. The integrated circuit of claim 26 , wherein the first module is adapted to monitor the performance characteristic of a third electrical device that is external to the integrated circuit; and the second module is adapted to process information of the monitored performance characteristic of the first and third electrical devices to determine the power control information.
    31. The integrated circuit of claim 30 , wherein the second circuit module is adapted to process information of the monitored performance characteristic of the first and third electrical devices to determine the power control information by analyzing at least one of respective priorities of the first and third electrical devices and/or respective performance needs of the first and third electrical devices.
    32. The integrated circuit of claim 26 , wherein the performance characteristic comprises error rate.
    33. The integrated circuit of claim 26 , wherein the performance characteristic comprises data throughput rate.
    34. The integrated circuit of claim 26 , wherein the performance characteristic comprises response time.
    35. The integrated circuit of claim 26 , wherein the performance characteristic comprises temperature.
    36. The integrated circuit of claim 26 , wherein the performance characteristic comprises energy consumption.
    37. The integrated circuit of claim 26 , wherein the performance characteristic comprises delay time.
    38. The integrated circuit of claim 26 , wherein the performance characteristic comprises communication rate.
    39. The integrated circuit of claim 26 , wherein the performance characteristic comprises energy efficiency.
    40. The integrated circuit of claim 26 , wherein the performance characteristic comprises noise level.
    41. In a first integrated circuit, a method for controlling electrical power provided to a first electrical device external to the integrated circuit, the method comprising: utilizing a performance sensor on-board the first integrated circuit to monitor a performance characteristic of the first electrical device; determining power control information based, at least in part, on the monitored performance characteristic; and communicating at least a portion of the determined power control information with a second electrical device that is external to the first integrated circuit.
    42. The method of claim 41 , wherein the second electrical device comprises a power supply circuit that provides electrical power to the first electrical device.
    43. The method of claim 41 , wherein the performance characteristic comprises at least one of: processing speed, temperature, energy consumption, data throughput rate, response time, delay time, communication rate, energy efficiency, noise level and/or error rate.
    44. The method of claim 41 , wherein the communicated power control information comprises information of the monitored performance characteristic.
    45. The method of claim 41 , wherein the communicated power control information comprises power adjustment information related to a change in the monitored performance characteristic.
    46. The method of claim 41 , further comprising: monitoring the performance characteristic of a third electrical device; and processing information of the monitored performance characteristic of the first and third electrical devices to determine the power control information.
    47. The method of claim 46 , wherein processing information of the monitored performance characteristic comprises analyzing at least one of respective priorities and respective performance needs of the first and third electrical devices.
    说明书
    [0001]技术领域
    [0002]本发明属于电工钢制备技术领域，涉及一种超低铁损高强度无取向电工钢薄带的制备方法。
    [0003]背景技术
    [0004]随着新能源汽车产销量的快速增长，新能源汽车驱动电机用无取向硅钢有着巨大的需求空间。由于新能源汽车驱动电机转速越来越高，对无取向电工钢的性能提出了更高的要求。一方面要求更高转速、更高频率(400～800Hz)条件下电工钢具有较低的铁损，另一方面转速增加导致铁芯承受的应力增加，要求电工钢具有更高的屈服强度。因此，相较于传统高牌号无取向电工钢，新能源汽车驱动电机用电工钢需要具有磁感应强度高、铁损低、厚度薄及屈服强度高的特点。
    [0005]低牌号无取向电工钢由于硅含量较低，厚度减薄后铁损仍然较高，不适合用于新能源汽车驱动电机的定转子铁芯，因此新能源汽车驱动电机均采用高牌号无取向电工钢。对于高牌号无取向电工钢，通过添加Cr、Ni、Nb、Ti等一系列元素来提高无取向电工钢的强度，但是这些合金元素的添加会显著降低其磁性能。因此，在成分和厚度确定的情况下，通过全流程调控轧制以及退火工艺制备性能优异的无取向电工钢薄带是一种非常有潜力的方法。
    [0006]东北大学公开了一种低铁损高磁感无取向硅钢极薄带的制备方法(CN108330397B)，该制备方法采用双辊薄带连铸和三次冷轧工艺，得到了0.05-0.2mm的无取向硅钢极薄带。该生产工艺制备的无取向电工钢极薄其带具有良好的磁性能，但生产过程较复杂，且屈服强度并未得到提高。
    [0007]马钢申请了一种超薄带无取向电工钢制造方法(CN115522127A)，该制备方法采用常规冶炼浇注工艺生产铸坯，经过热轧、常化酸洗、一次冷轧、中间退火、最终退火的后处理工艺后，得到了0.12-0.14mm的无取向硅钢薄带。该生产方式制备的无取向硅钢薄带具有优异的磁性能。但是热轧板的厚度需要精轧至1.0-1.3mm，这对热轧的设备要求较高，同时冷轧前要求常化，增加了工艺的复杂性以及工艺控制的难度。从目前新能源汽车驱动电机转速的要求来看，该方法制备的极薄带无取向硅钢的强度也有待提高。
    [0008]发明内容
    [0009]为解决现有新能源汽车驱动电机用无取向电工钢磁性能和力学性能难以兼容的技术问题，本发明开发出了一种超低铁损高强度无取向电工钢薄带的制备方法，通过控制轧制获得了具有良好微观组织及织构的热轧板，在冷轧过程中省略了常化工艺从而降低了电工钢的生产成本，最终退火得到的超低铁损无取向电工钢薄带具有强η织构(<001>//轧向)，具有优异的磁性能和较高的强度，在新能源驱动电机等领域具有广阔的应用前景。
    [0010]一方面本发明提供一种超低铁损高强度无取向电工钢薄带的制备方法，所述方法包括：
    [0011]S1：熔炼：将纯硅和工业纯铁按照一定比例配料，利用真空感应炉熔融后在1450-1550℃精炼，浇铸成铸锭，所述铸锭中各组分的质量百分比为：Si＝3.5％-5.0％，C≤0.01％，S≤0.01％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0012]S2：开坯：采用机械自由锻造方式，利用空气锤在800-1100℃范围内锻造，经过多次反复镦粗拔长，得到方坯；
    [0013]S3：热轧：将所述方坯室温装炉，加热、保温后进行热轧，经多道次轧制后回炉，保温后进行2-3道次热轧，最后一道次热轧以较小的压下率轧制，得到1.5-2.3mm厚的热轧板；
    [0014]S4：一次冷轧：将所述热轧板酸洗后，在10-550℃之间保温3-30min后进行轧制，每道次轧制完成后回炉保温3-20min，经多道次轧制至0.4-0.7mm，得到冷轧板；
    [0015]S5：中间退火：对所述冷轧板进行中间退火，得到中间退火后的冷轧板；
    [0016]S6：二次冷轧：将所述中间退火后的冷轧板经多道次冷轧至0.1-0.3mm，得到二次冷轧后的冷轧板；
    [0017]S7：再结晶退火：将所述二次冷轧后的冷轧板涂覆绝缘层后在保护气氛条件下退火，得到所述电工钢薄带。
    [0018]作为本发明的一个实施例，所述纯硅质量纯度为99-99.5％；所述工业纯铁质量纯度为99.5-99.9％；所述纯硅和工业纯铁的质量比例为(3.6-5.2)：(96.4-94.8)。
    [0019]作为本发明的一个实施例，所述步骤S3中，所述加热的温度为850-1050℃，所述保温的时间为5-30min，所述最后一道次热轧的压下率不超过20％；
    [0020]所述热轧板的晶粒大小为200-800μm，所述晶粒为等轴晶。
    [0021]作为本发明的一个实施例，所述10-500℃之间保温的温度与所述热轧板中的硅含量相对应，优选地，所述硅含量为3.5％Si时所述保温的温度为10-40℃，所述硅含量为4.5％Si时所述保温的温度为280-330℃，所述硅含量为5％时所述保温的温度为470-500℃；
    [0022]所述一次冷轧的压下率为50-75％，所述道次压下率为10％-30％。
    [0023]作为本发明的一个实施例，所述步骤S5中，所述中间退火的温度为850-1100℃，时间30s-20min。
    [0024]作为本发明的一个实施例，所述步骤S6中，所述二次冷轧的压下率为55-78％，所述二次冷轧的最后一道次压下率不大于15％。
    [0025]作为本发明的一个实施例，所述步骤S7中，所述再结晶退火时间遵循退火温度越高退火时间越短的原则，所述再结晶退火的温度为850-1100℃，时间为30s-20min，优选地，所述再结晶退火的温度为950-1000℃，时间为2-8min。
    [0026]作为本发明的一个实施例，所述电工钢薄带中硅的质量含量为3.5％时，屈服强度σ s ≥420MPa；硅的质量含量为4％时，屈服强度σ s ≥440MPa；硅的质量含量为4.5％时，屈服强度σ s ≥465MPa。
    [0027]作为本发明的一个实施例，所述电工钢薄带的磁感应强度B 50 ＝1.64-1.76T；所述电工钢薄带的厚度为0.3mm时，铁损P 15/50 ≤2W/kg，P 10/400 ≤14W/kg；所述电工钢薄带的厚度为0.2mm时，铁损P 15/50 ≤1.9W/kg，P 10/400 ≤11W/kg；所述电工钢薄带的厚度为0.15mm时，铁损P 15/50 ≤1.8W/kg，P 10/400 ≤10W/kg。
    [0028]本发明通过热轧控轧，得到粗大的强Goss织构({110}<001>)热轧板，控制一次冷轧压下率，得到的变形组织中存在大量的剪切带；一次冷轧压下率过小或过大，无法得到含有大量剪切带的变形组织；在随后的中间退火过程中，通过组织继承，又形成粗大的强Goss织构再结晶晶粒；在合理的二次冷轧压下率下，再次得到含大量剪切带的变形组织，最终退火过程中得到晶粒大小合适的强η织构(<001>//轧向)无取向硅钢薄带。因此，热轧和冷轧的控制轧制，以及合理的退火工艺是获得优异磁性能的重要条件。
    [0029]本发明提供的上述技术方案至少带来的有益效果：
    [0030](1)热轧采用控制轧制，得到了良好的热轧板微观组织及织构；
    [0031](2)省略了常用的常化工艺，能有限降低电工钢的生产成本；
    [0032](3)通过采用二次冷轧以及控制冷轧压下率，得到较理想的冷轧组织及织构；
    [0033](4)生产的超低铁损无取向电工钢薄带具有强的η织构，最终具有优异的磁性能和较高的强度。
    [0034]附图说明
    [0035]为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
    [0036]图1为本申请的一种实施方式中超低铁损高强度无取向电工钢薄带的工艺路线图；
    [0037]图2为本申请实施例3得到的超低铁损高强度无取向电工钢的热轧板金相图；
    [0038]图3为本申请实施例2得到的超低铁损高强度无取向电工钢的二次冷轧后的冷轧板织构图；
    [0039]图4为本申请实施例3得到的超低铁损高强度无取向电工钢的再结晶退火板表层织构图。
    [0040]具体实施方式
    [0041]为使本发明要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
    [0042]实施例1
    [0043]采用以下方法制备本申请的超低铁损高强度无取向电工钢薄带，具体步骤如下：
    [0044]S1：熔炼：将纯硅和工业纯铁按照一定成分比例配制，利用真空感应熔炼炉熔融后在1450-1550℃精炼，浇铸成铸锭。铸锭化学成分(质量百分比)为：Si：3.60％，C≤0.01％，S≤0.008％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0045]S2：开坯：采用机械自由锻造方式，利用空气锤在800-1050℃范围内锻造，经过多次反复镦粗拔长，将铸锭锻成方坯；
    [0046]S3：热轧：锻造方坯室温装炉，加热温度为1050℃，保温30min，利用二辊热轧机进行热轧，轧制多道后回炉保温5min，再热轧2道次，最后一道次压下率不大于15％，得到2.0mm厚的热轧板；
    [0047]S4：一次冷轧：热轧板在酸洗后，道次压下率10-30％，经5道次轧至0.7mm，轧制压下率为65％；
    [0048]S5：中间退火：一次冷轧板在Ar 2 气氛条件下进行中间退火，在950℃保温5min。
    [0049]S6：二次冷轧：对中间退火板进行二次冷轧，道次压下率10-30％，经5道次轧制至0.3mm，轧制压下率为57％，最后一道次压下率15％；
    [0050]S7：再结晶退火：将冷轧薄板在Ar 2 气氛条件下进行退火处理。1000℃3min退火后，得到电工钢薄带的B 50 ＝1.74T，P 15/50 ＝1.92W/kg，P 10/400 ＝12.6W/kg，屈服强度σ s ＝426MPa。
    [0051]实施例2
    [0052]采用以下方法制备本申请的超低铁损高强度无取向电工钢薄带，具体步骤如下：
    [0053]S1：熔炼：将纯硅和工业纯铁按照一定成分比例进行配制，利用真空感应熔炼炉熔融后在1450-1550℃精炼，浇铸成铸锭。铸锭化学成分(质量百分比)为：Si：4.12％，C≤0.01％，S≤0.008％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0054]S2：开坯：采用机械自由锻造方式，利用空气锤在850-1100℃范围内锻造，经过多次反复镦粗拔长，将铸锭锻成方坯；
    [0055]S3：热轧：锻造方坯室温装炉，加热温度为1050℃，保温30min，利用二辊热轧机进行热轧，多道次轧制后回炉保温5min，再热轧3道次，最后一道次压下率不大于15％，得到1.8mm厚的热轧薄板；
    [0056]S4：一次冷轧：热轧板在酸洗后，在200℃保温10min后进行轧制，道次压下率10-30％，每道次进行回炉保温5min，经5道次轧至0.6mm，轧制压下率为67％；
    [0057]S5：中间退火：一次冷轧板Ar 2 气氛条件下进行退火处理，在1100℃保温3min。
    [0058]S6：二次轧制：对中间退火板进行二次冷轧，道次压下率10-30％，经5道次轧制至0.2mm，轧制压下率为67％，最后一道次压下率12％。
    [0059]S7：再结晶退火：将冷轧薄板在Ar 2 气氛条件下进行退火处理。1000℃5min退火后，得到电工钢薄带的B 50 ＝1.69T，P 15/50 ＝1.82W/kg，P 10/400 ＝9.7W/kg，屈服强度σ s ＝452MPa。
    [0060]实施例3
    [0061]采用以下方法制备本申请的超低铁损高强度无取向电工钢薄带，具体步骤如下：
    [0062]S1：熔炼：将纯硅和工业纯铁按照成分比例进行配制，利用真空感应熔炼炉熔融后在1450-1550℃精炼，浇铸成铸锭。铸锭化学成分(质量百分比)为：Si：4.64％，C≤0.01％，S≤0.008％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0063]S2：开坯：采用机械自由锻造方式，利用空气锤在850-1100℃范围内锻造，经过多次反复镦粗拔长，将铸锭锻成方坯；
    [0064]S3：热轧：锻造方坯室温装炉，加热温度为1050℃，保温30min，利用二辊热轧机进行热轧，多道次轧制后回炉保温5min后，再热轧3道次，得到1.6mm厚的热轧薄板；
    [0065]S4：一次冷轧：热轧板在酸洗后，在300℃保温10min后进行轧制，道次压下率10-30％，每道次进行回炉保温5min，经5道次轧至0.5mm，轧制压下率为68％；
    [0066]S5：中间退火：一次冷轧板Ar 2 气氛条件下进行退火处理，在1000℃保温5min。
    [0067]S6：二次轧制：对中间退火板进行二次冷轧，道次压下率10-30％，经5道次冷轧轧至0.15mm，轧制压下率为70％，最后一道次压下率10％。
    [0068]S7：再结晶退火将冷轧薄板在Ar 2 气氛条件下进行退火处理。1000℃5min退火后，得到电工钢薄带的B 50 ＝1.66T，P 15/50 ＝1.64W/kg，P 10/400 ＝8.2W/kg，屈服强度σ s ＝470MPa。
    [0069]对比例1
    [0070]采用以下方法制备电工钢薄带，具体步骤如下：
    [0071]S1：熔炼：将纯硅和工业纯铁按照成分比例配制，利用真空感应熔炼炉熔融后在1450-1550℃精炼，浇铸成铸锭。铸锭化学成分(质量百分比)为：Si：3.52％，C≤0.01％，S≤0.008％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0072]S2：开坯：采用机械自由锻造方式，利用空气锤在800-1050℃范围内锻造，经过多次反复镦粗拔长，将铸锭锻成方坯；
    [0073]S3：热轧：锻造方坯室温装炉，加热温度为1050℃，保温30min，利用二辊热轧机进行热轧，轧制多道次后回炉保温，再热轧2道次，得到1.6mm厚的热轧薄板；
    [0074]S4：一次冷轧：热轧板在酸洗后，道次压下率10-30％，经5道次轧至0.5mm，轧制压下率为69％；
    [0075]S5：中间退火：一次冷轧板在Ar 2 气氛条件下进行中间退火，在700℃保温10min。
    [0076]S6：二次冷轧：对中间退火板进行二次冷轧，经5道次轧制至0.3mm，轧制压下率为40％。
    [0077]S7：再结晶退火：将冷轧薄板在Ar 2 气氛条件下进行退火处理。900℃10min退火后，B 50 ＝1.66T，P 15/50 ＝3.05W/kg，P 10/400 ＝19.22W/kg，屈服强度σ s ＝433MPa。
    [0078]对比例2
    [0079]采用以下方法制备电工钢薄带，具体步骤如下：
    [0080]S1：熔炼：将纯硅和工业纯铁按照成分比例进行配制，利用真空感应熔炼炉熔融后在1450-1550℃精炼，浇铸成铸锭。铸锭化学成分(质量百分比)为：Si：4.64％，C≤0.01％，S≤0.008％，Mn≤0.10％，Ti≤0.005％，酸溶铝Als≤0.01％，P≤0.008％，N≤0.008％，余量为铁和不可避免的夹杂；
    [0081]S2：开坯：采用机械自由锻造方式，利用空气锤在850-1100℃范围内锻造，经过多次反复镦粗拔长，将铸锭锻成方坯；
    [0082]S3：热轧：锻造方坯室温装炉，加热温度为1050℃，保温30min，利用二辊热轧机进行热轧，轧制多道次后回炉保温5min，再热轧3道次，得到1.6mm厚的热轧薄板；
    [0083]S4：中温轧制：热轧板在酸洗后，在300℃保温10min后进行轧制，道次压下率10-30％，每道次进行回炉保温5min，经5道次温轧轧至0.5mm后，再经5道次冷轧轧制至0.15mm。
    [0084]S5：将冷轧薄板在Ar 2 气氛条件下进行退火处理。1000℃5min退火后，B 50 ＝1.59T，P 15/50 ＝2.45W/kg，P 10/400 ＝10.6W/kg，屈服强度σ s ＝473MPa。
    [0085]从实施例1-3和对比例1-2来看，通过对热轧工艺进行调控，以及采用二次冷轧工艺调控冷轧板微观组织织构，并采用合适的热处理工艺，最终提高了材料在同一强度水平下的磁性能，磁感应强度得到了提升，并极大的降低了最终退火薄板的铁损。
    [0086]以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明所述原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
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