Hybrid integration of advanced CMOS electronics and a high-performing silicon photonics platform, combined with wafer-scale testing and assembly processes have enabled delivery of low-cost, low-power, high-performance, high-volume optical transceivers. In this paper, we will discuss the aspects of each of these factors that have been critical in achieving this success. In particular, we will focus on the silicon photonics process, device library and design kit, the innovative solutions for wafer-level testing and assembly of the optical transceivers, and discuss the benefits and drawbacks of monolithic and hybrid electronics-photonics integration and the impact on the roadmap of future optical transceivers.

Luxtera and TSMC have jointly developed a new generation 100Gbps/λ-capable silicon photonics platform in a commercial 300 mm CMOS line. We present process details and the performance of the photonic device library.

We present an end-to-end multi-core fibre transmission link where the 8-core fibre and the corresponding 200 Gb/s silicon photonics transceiver chip were co-designed. We demonstrate equivalent performance between the MCF and a parallel SMF transmission links.

Large progress has been made in the field of silicon photonics since its inception in the late eighties of last century. An intriguing and challenging field of research has evolved with time into a flourishing industry supporting and propelling the growth of data centers and distribute computing known as "the Cloud."

This paper covers a silicon photonics technology platform that leverages a commercial semiconductor supply chain for the manufacturing of high performance optical transceivers for high performance computing and hyper-scale data-center applications.

We assess the reliability of a complete silicon integrated photonics platform through a suite of reliability assurance and qualification tests. We demonstrate high reliability of each component of the silicon photonics optical transceiver.

We report on the development of Luxtera's silicon photonics platform for the production of high-speed optical transceivers using a hybrid-integrated approach.

In this paper we discuss design and characterization of silicon-photonics-based 100 Gbps (4x26 Gbps) transceivers for parallel single mode fiber communication. We also address some key underlying technologies including silicon photonics wafer processing, photonic device libraries, light source integration and packaging technologies.

In this paper we address silicon photonics based optical transceiver technology for applications in advanced data communications such as high performance computing and hyperscale datacenters.

In this paper we address key design and performance aspects of high-speed optical transceivers based on silicon photonics technology.

We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.