基本信息
浏览量:1096
职业迁徙
个人简介
汪正平(WONG, Ching Ping),1947年3月出生于广东省广州市,美国国家工程院院士、中国工程院外籍院士、香港科学院创院院士、中国台湾“中央研究院”院士。
汪正平创新地采用硅树脂对栅控二极管交换机(GDX)进行封装研究,实现利用聚合物材料对GDX结构的密封等效封装,显著提高封装可靠性,该塑封技术克服了传统陶瓷封装重量大、工艺复杂、成本高等问题,被Intel、IBM等全面推广,塑封技术占世界集成电路封装市场的95%以上。他还解决了长期困扰封装界的导电胶与器件界面接触电阻不稳定问题,该创新技术在Henkel(汉高)等公司的导电胶产品中长期使用。汪正平在业界首次研发了无溶剂、高Tg的非流动性底部填充胶,简化倒装芯片封装工艺,提高器件的优良率和可靠性,被Hitachi(日立)等公司长期使用。
Professor Wong has successfully motivated and nurtured numerous inquisitive young minds over the years. As a distinguished scholar, Professor Wong was awarded numerous international honours, such as the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009. He has recently received the The Pennsylvania State University Outstanding Science Alumni Award.
汪正平创新地采用硅树脂对栅控二极管交换机(GDX)进行封装研究,实现利用聚合物材料对GDX结构的密封等效封装,显著提高封装可靠性,该塑封技术克服了传统陶瓷封装重量大、工艺复杂、成本高等问题,被Intel、IBM等全面推广,塑封技术占世界集成电路封装市场的95%以上。他还解决了长期困扰封装界的导电胶与器件界面接触电阻不稳定问题,该创新技术在Henkel(汉高)等公司的导电胶产品中长期使用。汪正平在业界首次研发了无溶剂、高Tg的非流动性底部填充胶,简化倒装芯片封装工艺,提高器件的优良率和可靠性,被Hitachi(日立)等公司长期使用。
Professor Wong has successfully motivated and nurtured numerous inquisitive young minds over the years. As a distinguished scholar, Professor Wong was awarded numerous international honours, such as the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009. He has recently received the The Pennsylvania State University Outstanding Science Alumni Award.
研究兴趣
论文共 1406 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Rong Zhang,Xiang Fang, Baokuan Zhou, Chuzeyuan Xiao, Yutao Xie,Wuhou Fan,Qingting Liu,Xudong Fu,Shengfei Hu, Juan Wang,Ching Ping Wong
ACS applied materials & interfacesno. 12 (2024): 15251-15261
Zihao Lin,Jiaxiong Li,Zhijian Sun, Andrew D. Fang,Keyi Han, Shu Jia, Yao-Hao Liu,Michael J. Adams, Kyoung-sik Moon,Ching-Ping Wong
COMPOSITES SCIENCE AND TECHNOLOGY (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2003-2007, (2024)
Yun Chen, Shengbao Lai, Wenxuan Wu, Yiming Zhong,Yuanhui Guo, Pengfei Yu,Maoxiang Hou,Huilong Liu,Lelun Jiang,Xin Chen,Jian Gao,Ching-Ping Wong
ACS applied nano materialsno. 8 (2024): 8958-8968
Journal of Energy Storage (2024): 109561
NPG Asia materialsno. 1 (2024)
International Journal of Mechanical Sciencespp.109384, (2024)
Alexandra Marnot, Jami Milliken, Jaehyun Cho, Zihao Lin,Chingping Wong,Jennifer M Jones, Curtis Hill,Blair Brettmann
ACS applied engineering materialsno. 8 (2024): 2016-2026
JOURNAL OF ENERGY STORAGE (2024)
加载更多
作者统计
#Papers: 1409
#Citation: 65668
H-Index: 133
G-Index: 205
Sociability: 8
Diversity: 4
Activity: 1020
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn