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个人简介
Gongyue Tang received the B.E. degree in mechanical engineering from the Beijing University of Aeronautics and Astronautics, Beijing, China, in 1993, the M.E. degree in spacecraft design from the Chinese Academy of Space Technology, Beijing, in 1996, and the Ph.D. degree in mechanical engineering from Nanyang Technological University (NTU), Singapore, in 2005.
He was the Mechanical Analyst Team Leader with Dyson Operations Pte Ltd., Singapore, and a Principal Engineer with United Test and Assembly Center, Ltd., Singapore. He is currently working as a Research Scientist with the Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council, Agency for Science, Technology and Research (A*STAR), Singapore. His research interests include heat transfer, microfluidics, thermal management, and advanced cooling technologies for integrated circuit packages and microelectronics systems.
研究兴趣
论文共 79 篇作者统计合作学者相似作者
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IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Societypp.01-06, (2023)
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Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin,Jong Ming Chinq,JiaQi Wu,Tang Gongyue,Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1838-1843, (2023)
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Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, Keng Yuen Jason Au,King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1964-1968, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1989-1993, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1553-1558, (2023)
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.554-560, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1030-1035, (2022)
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.880-884, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2211-2216, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1624-1628, (2022)
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