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Dr. Lu is a pineer in 3D integration and packaging for smart systems. He authored and co-authored >300 technical publications in journals, conferences or books. He served as General Chair, Technical Chair, and Session Chair and committee members for many international conferences or workshops (such as General Chair of IMAPS International Conference on Device Packaging). He has been a panelist, panel moderator, keynote or invited speaker for many conferences, and given many seminars at government labs, universities and industrial organizations. He has served as a reviewer for a number of journals, such as the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Electron Devices; IEEE Electron Device Letters; Applied Physics Letters; Electronics Letters; IEEE Transactions on Semiconductor Manufacturing; IEEE Journal of Solid-State Circuits; Journal of Applied Physics; Solid-State Electronics, J. of Vacuum Science & Technology, etc. He is listed in the special Millennium Edition of Marquis Who's Who in Science and Engineering, received many honorable awards, including the “School of Engineering Research Excellence Award”, Rensselaer, Troy, NY, 2005, the 2008 IEEE CPMT Exceptional Technical Achievement Award "for his pioneering contributions to and leadership in 3D integration/packaging”, the IMAPS 2010 William D. Ashman Achievement Award "for contributions and research in 3D integration and packaging; for leadership contributions at international symposiums and device packaging conferences, and 3-D packaging workshops," and “ School of Engineering Faculty Award: Outstanding Research Team”, Rensselaer, Troy, NY, 2011.
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论文共 101 篇作者统计合作学者相似作者
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CHEMICAL, BIOLOGICAL, RADIOLOGICAL, NUCLEAR, AND EXPLOSIVES (CBRNE) SENSING XVII (2016): 982414
Materials for Advanced Packagingpp.1-26, (2016)
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