基本信息
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Career Trajectory
Bio
Yongping Fan (Senior Member, IEEE) received the B.E. degree in physics from Northwest University, Xi’an, China, and the M.S. degree in electrical engineering from Xian Jiaotong University, Xi’an, and the Ph.D. degree in electrical engineering from Purdue University, West Lafayette, IN, USA, in 1994.
During his graduate study at Purdue University, his research was focused on the design and fabrication of the first room-temperature continuous-wave blue/green heterojunction quantum well laser diode using wide bandgap II–VI semiconductor materials. In 1997, he joined Intel Corporation, Hillsboro, OR, USA. His focus has been on developing CMOS low-power and high-performance analog and mixed-signal circuits, including LC-PLL, ring-oscillator PLL, DLL, phase interpolator, voltage regulator, bandgap reference, digital thermal sensors, and IO circuits for microprocessors, SoC, and the IoT products on Intel’s advanced CMOS process technology. He is currently a Senior Principal Engineer and the Manager of analog circuit technology at Technology Development Center, Intel Corporation. He has authored or coauthored 42 published papers in conferences and journals, and holds 21 issued U.S. patents.
Dr. Fan served as a technical program committee member and a mentorship committee member of the 2021 IEEE Custom Integrated Circuits Conference (CICC) and co-chaired the reference circuits session of 2021 CICC.
Research Interests
Papers共 37 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE open journal of the Solid-State Circuits Society (2021): 162-170
Dmitri E. Nikonov, Peter Kurahashi,James S. Ayers,Hai Li,Telesphor Kamgaing, Georgios C. Dogiamis, Hyung-Jin Lee,Yongping Fan, I. A. Young
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Author Statistics
#Papers: 39
#Citation: 944
H-Index: 19
G-Index: 30
Sociability: 5
Diversity: 2
Activity: 20
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