Transaction-Level Prototyping of a UMTS Outer-Modem for System-on-Chip Validation and Architecture Exploration

RSP '04 Proceedings of the 15th IEEE International Workshop on Rapid System Prototyping(2004)

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摘要
Growing demand for mobility and multimedia capacity inhandheld devices translates into very complex systemswhere time-to-market development is critical. High datarates and improved system capacity for IP-based servicesincrease controlling and dynamic scheduling of alreadycomplex modem technologies. This paper describes theprototyping of a UMTS terminal subsystem, which dealswith several physical layer tasks such as channel multiplexingor interleaving. Our modeling strategy relies on atransaction-level platform methodology built on top of theSystemC language. The system-on-chip dynamics is modeledwith behavioral modules, generic bus transactions andmemory accesses. Several examples demonstrate that sucha prototyping makes it possible to validate highly dynamicsystems; this reduces system-on-chip development costs asit is recognized that about 70% of it lies today into verification.This prototyping also offers a large potential for fastarchitecture exploration with the capacity to dimension thememory components or evaluate the bus contention.
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关键词
3G mobile communication,IP networks,cellular radio,computer architecture,digital signal processing chips,dynamic scheduling,integrated circuit design,integrated circuit manufacture,integrated circuit modelling,mobile handsets,modems,multimedia communication,multiplexing,rapid prototyping (industrial),system-on-chip,time to market,IP-based services,SystemC language,UMTS outer-modem,UMTS terminal subsystem prototyping,behavioral modules,channel interleaving,channel multiplexing,dynamic scheduling,generic bus transactions,handheld devices,memory access,memory components,mobility,modem technologies,multimedia capacity,physical layer tasks,system capacity,system-on-chip architecture exploration,system-on-chip development,system-on-chip dynamics modeling,system-on-chip validation,time-to-market development,transaction-level platform methodology,transaction-level prototyping
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