Investigation of through micropatterns fabrication on C194 copper foil by ultraviolet nanosecond pulsed laser microdrilling

•The absorption coefficient of C194 copper foil for 355 nm wavelength and the sublimation enthalpy of the material are derived.•Multi-pulse laser ablation mechanisms of C194 copper foil are revealed by finite element modeling and simulations and experiments.•High density arrays of through micropatterns with high dimensional accuracy and high uniformity are fabricated on C194 copper foil.