Electronic Interconnect Reliability Modelling *
Soldering & Surface Mount Technology(2013)
关键词
computer simulation,microstructures,thermal stress,operant conditioning,thermal cycling
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要
Soldering & Surface Mount Technology(2013)