3D Lithography of Organo-Soluble Mold Materials for Sol-Gel Nanocomposites

In Scheme 1 the direct light processing (DLP) based machine Perfactory® (Envisiontec) is shown. For fabrication of 3D parts the CAD model is sliced up and every slice is projected into the bottom layer of the resin tank by a micro-mirror array. The light sensitive resin is cured in a few seconds and peeled off afterwards. The polymer adheres on the z-stage which is moved up 30 to 50 2m in z-direction. Then the next layer is cured. By this technique 3 dimensional parts made out of polymers can be built. Commercial RP resins lead to highly cross-linked polymers. If other materials are desired the polymers have to be used as mold materials. Unfortunately they can only be removed at higher temperatures by burning, which limit the range of casting materials. Recently, water-soluble photopolymers were developed 2 but mold processing cannot occur in the presence of water such as for water based ceramic slurries or sol-gel materials. Scheme 1: RP-process In the present paper the development of a photopolymerizable formulation for organo-soluble polymers is described. As suitable photoreactive base components dialkylacrylamides were selected due to their high reactivity and liquid state. In Scheme 1 an organo-soluble part built by RP is shown. Selection and synthesis of monomers