Flip-chip assembly design of an electro-absorption modulated laser based on EM-circuit comodeling

B. Ftaich-Frigui,D. Baillargeat,C. Kazmierski,F. Blache,A. Scavennec,C. Jany

International Journal of RF and Microwave Computer-Aided Engineering（2010）

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摘要

We designed two kinds of flip-chip bonded electro-absorption modulated laser on AlN or Si carrier, working at 100 Gb s-1. A theoretical comodeling approach based on 3D electromagnetic and circuit simulations has been applied and validated by measurements. As demonstrated, integration and behavior of future complex opto-electronic modules could be optimized applying such EM-based approach. © 2010 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2010.

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关键词

em-based approach,gb s-1,wiley periodicals,em-circuit comodeling,electro-absorption modulated laser,future complex opto-electronic module,si carrier,microwave cae,theoretical comodeling approach,flip-chip assembly design,inc. int j rf,circuit simulation,flip chip

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