Fabrication of hemispherical structures using semiconductor technology for use in thermonuclear fusion research

Initial investigations and laboratory experiments in the area of target fabrication using solid state circuit processing techniques to create special target components have indicated the feasibility of a unique advanced manufacturing concept. A question of the applicability of silicon integrated circuit technology and how it might be applied to the fabrication of inertial confinement fusion targets was posed. The combined efforts of the University of Michigan Electron Physics Laboratory, and the Division of Material Sciences of KMS Fusion, Inc. have provided some relatively quick and very encouraging answers and results. The initial efforts to demonstrate electron beam patterning and etching of micron‐high letters through the walls of glass microballoons, the fabrication of free‐standing thin‐walled flanged hemispheres joined to form spherical structures, and a pellet support membrane have been the proof‐of‐principle milestones and goals.