3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

N Khan,L H Yu,Tan Siow Pin,Soon Wee Ho,V Kripesh,D Pinjala,John H Lau,Toh Kok Chuan

msra（2013）

引用 41|浏览6

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摘要

In this paper, a liquid cooling solution has been reported for 3-D package in package-on-package format. A high heat dissipating chip is mounted on a silicon carrier, which has copper through-silicon via (TSV) for electrical interconnection and hollow TSV for fluidic circulation. Heat transfer enhancement structures have been embedded in the chip carrier. Cooling liquid, de-ionized water is circul...

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关键词

Through-silicon vias,Thermal resistance,Heating,Liquid cooling,Heat transfer

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