Optimal placement of electronic devices in forced convective cooling conditions

An implementation of a genetic algorithm for electronic devices placement optimisation has been done. The study includes a few cases. In the first application electronic devices are placed along a bottom surface of a duct and cooled with forced convection by air stream with velocity U0. The thermal model is two-dimensional (2D). The algorithm optimizes the order in the view of four thermal criteria. In the second application a genetic algorithm is used to optimize the position of electronic devices on the surface of a Printed Circuit Board (PCB). The thermal model is three-dimensional (3D). Devices have some specified positions on the PCB and permutations are only performed.