Signal Integrity Flow for System-in-Package and Package-on-Package Devices

Paolo Pulici,Gian Pietro Vanalli,Michele A. Dellutri,Domenico Guarnaccia,Filippo Lo Iacono,Giovanni Campardo,Giancarlo Ripamonti

Proceedings of the IEEE（2009）

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摘要

As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address. The design flow of the SiP should therefore take into account these issues from the beginning. A design flow aimed at designing the SiP tracks is presented; its suitability for the design of packages comprising multiple stacked memories is ...

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关键词

Signal design,Signal generators,Integrated circuit packaging,Integrated circuit modeling,Signal processing,Costs,Degradation,Process design,Analytical models,Signal analysis

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