BEOL Scaling Limits and Next Generation Technology Prospects

DAC, pp. 1-6, 2014.

Cited by: 10|Bibtex|Views5|DOI:https://doi.org/10.1145/2593069.2596672
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Other Links: dl.acm.org|dblp.uni-trier.de|academic.microsoft.com

Abstract:

This paper presents the major limitations to the interconnect technology scaling at future technology generations and demonstrates both evolutionary and radical potential solutions to the BEOL scaling problem. To address the local interconnect challenges, a novel hybrid Al-Cu interconnect technology is introduced. Performances of carbon-b...More

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