Implementation of Short-Pulse Lasers for Wafer Scribing and Grooving Applications

This paper presents micro-machining results obtained by combining a short-pulse 10 ns green laser with the water jet-guided laser technology. The short pulse duration offers significant advantages for a wide range of applications. Experimental results of semiconductor grooving, edge isolation and P1 fabrication step of thin film solar cells, as well as silicon wafer dot marking, are presented. The study compares the results obtained with short and long pulse lasers.