A Thermal Compact Modeling Method Using Response Surface Methodology With Genetic Algorithm.

In this paper, a compact model calculation method for thermal modeling using response surface methodology is described. The compact model is recognized as a model useful for improving the calculation accuracy of thermal analysis at small calculation cost. In order to design a compact model of heat flow in electronic components, we carried out heat measurements in various environments to identify suitable model parameters. Actual measurements were compared to the results of the original genetic algorithm and the improved version, and the usefulness of this new approach was confirmed.