Formation of the microstructure in Cu-Nb alloys

Journal of Materials Science(2004)

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摘要
In order to increase the mechanical strength of copper while retaining its high electrical conductivity the copper matrix is strengthened by Nb particles. For thermodynamical reasons the mutual solubility of Nb in copper is negligible. Therefore, a Cu-Nb alloy is prepared by mechanically alloying and subsequent hot pressing. The formation of a solid solution in a first step and of precipitates in a Cu-10 at.%Nb alloy in the second one as well as the effect of these precipitates on the mentioned properties is discussed. The influence of different temperatures during hot pressing on density, mechanical and electrical properties, etc. is investigated.
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关键词
Polymer,Copper,Microstructure,Electrical Conductivity,Solid Solution
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