Thermomechanical behaviour of adhesive jointed SMT components

M. G. Perichaud,Deletage, J.-Y.,Carboni, D.,Fremont, H.,Y. Danto,C. Faure

ADHES '98 Proceedings of the Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. on Proceedings of 3rd international Conference（1998）

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摘要

This paper compares the efficiency of two thermosetting and one thermoplastic conductive adhesives for SMT assemblies. Their reliability is evaluated during accelerated life tests through electrical and mechanical measurements. The contact metallizations are taken into account. Finite element simulations confirm the experimental results, and a parametric study allows us to define some choice criteria for the physical properties of the adhesives.

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关键词

contact metallizations,mechanical measurement,accelerated life test,thermomechanical behaviour,finite element simulation,choice criterion,smt assembly,physical property,thermoplastic conductive adhesive,parametric study,smt component,conducting polymers,adhesives,electrical measurements,electrical contacts,accelerated life testing,metallization,physical properties,assembly,finite element analysis,reliability

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