Direct Soldering of Electronic Components on Molded Devices

Using the great potential of the three–dimensional Molded Interconnect Devices (3–D MID) necessitates the adaption of the conventional soldering methods in electronic assembly. The different characteristics of the soldering technologies determine the suitability of various engineering thermoplastics as substrate material. So several investigations on application of different thermoplastic materials have been carried out. Furthermore the geometric design of the molded carriers and the impact on the temperature distribution on the board during the soldering process will be discussed and the possibilities and the limitations of conventional soldering equipment will be shown.