45-nm Planar bulk-CMOS 23-GHz LNAs with high-Q above-IC inductors

ISCAS(2010)

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摘要
Two 23 GHz low-noise amplifier (LNA) have been designed and implemented by 45 nm planar bulk-CMOS technology with high-Q above-IC inductors. In the designed LNAs, the structure of cascode amplifier with source inductive degeneration is used. All high-Q above-IC inductors have been implemented by thin-film wafer-level packaging (WLP) technology. The fabricated one-stage LNA has a good linearity where the input 1 dB compression point (IP-1dB) is -9.5 dBm and the input referred third-order intercept point (PIIP3) is +2.25 dBm. It is operated with a 1 V power supply drawing a current of only 3.6 mA. The fabricated one-stage LNA has demonstrated a 4 dB noise figure (NF) and a 7.1 dB gain at the peak gain frequency of 23 GHz. Moreover, the fabricated two-stage LNA has the IP-1dB of -16 dBm and the PIIP3 of -4.2 dBm. It drains 9.3 mA from 1-V power supply. This two-stage LNA has demonstrated a 4.4 dB NF and a 11.6 dB gain at the peak gain frequency of 23.4 GHz. The fabricated one-stage LNA has the highest figure-of-merit (FOM). The experimental results have proved the suitability of 45 nm gate length planar bulk-CMOS devices for RF ICs above 20 GHz.
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关键词
source inductive degeneration,thin-film wafer-level packaging,cmos analogue integrated circuits,wafer level packaging,current 3.6 ma,high-q above-ic inductor,size 45 nm,low noise amplifiers,rfic,figure-of-merit,radiofrequency integrated circuits,gain 11.6 db,low-noise amplifier,frequency 23 ghz,voltage 1 v,wlp technology,cascode amplifier,gain 7.1 db,noise figure 4 db,planar bulk-cmos lna,inductors,noise figure,gain,noise measurement,radio frequency,thin film,cmos integrated circuits,noise,electrostatic discharge,figure of merit,low noise amplifier
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