Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

Electron Device Letters, IEEE(2009)

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摘要
We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on ~ 130-??m-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured fT ??LG product of 12.5 GHz ????m is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties.
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关键词
aluminium compounds,chemical vapour deposition,diamond,gallium compounds,high electron mobility transistors,AlGaN-GaN,HEMT,chemical-vapor-deposition,contact lithography process techniques,efficiency 44.1 percent,free-standing CVD diamond substrates,full-wafer characterization,high electron mobility transistors,size 130 mum,size 30 mm,Chemical vapor deposited (CVD) diamond substrate,GaN-on-diamond,high electron mobility transistor (HEMT)
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