Flip-chip bump-lead fabrication: A review
Russian Microelectronics（2011）
摘要
Methods and apparatuses for solder-ball fabrication and placement on die pads are reviewed. Techniques used to fabricate solder bump leads are examined. Information on methods and devices for forming ball leads on a die by wire reflow is provided. Processes and equipment for solder bonding of dies with bumps to package bodies or substrates are outlined.
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85.30.De
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