A Low-Cost, Forming-Free Wox Reram Using Novel Self-Aligned Photo-Induced Oxidation

A novel CMOS compatible photo oxidation (PO) technology is proposed in this paper which, by only using standard DUV photo lithography process, demonstrates a strong oxidation capability to form CMOS compatible WOx. The oxidation occurs through catalytic chemical reaction during the post exposure baking (PEB) process. Based on this unique PO process, a high performance forming free 1T-1R WOx ReRAM is demonstrated. Furthermore, this PO WOx ReRAM can withstand high temperature baking (@ 250 degrees C) for 30min thus is suitable for embedded systems that require pre-coding, and automotive and other industrial applications.