Nano-thermal interface material with CNT nano-particles for heat dissipation application

Shanghai(2008)

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摘要
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The scanning electron microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
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关键词
carbon nanotube,nanothermal interface material,nanoparticles,electronic packaging,nanotechnology,cooling,nanofiber preparation,thermal management (packaging),electrospinning,polymer solutions,heat dissipation,carbon nanotubes,polymer solution,sem,c,cnt nanoparticles,scanning electron microscopy,thermal management,thermal conductivity,polyurethane,materials,thermal interface material,limiting factor,heat sinks,electronics packaging,polymers
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