Research On Thermal Characteristics Of Electronic Devices Using Thermal Microscopes

Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic devices design and reliability testing.