High-Density Pmut Array For 3-D Ultrasonic Imaging Based On Reverse-Bonding Structure

2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)(2011)

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摘要
High-density piezoelectric micromachined ultrasonic transducer (pMUT) arrays have been designed and fabricated using silicon based micromachined process. These devices are based on a novel structure called "reverse-bonding". Experimental results show that they have excellent performance, suitable resonance frequency and high reliability. The fabricated pMUT arrays are very promising for 3-D medical imaging.
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关键词
si,resonance frequency,micromachining,electrodes,silicon,transducers,capacitance,reliability,resonant frequency,impedance
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