Development of Ultrahigh-Voltage SiC Devices

Electron Devices, IEEE Transactions  (2015)

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摘要
Ultrahigh-voltage silicon carbide (SiC) devices [p-i-n diodes and insulated-gate bipolar transistors (IGBTs)] and switching test have been investigated. As a result, we have succeeded in developing a 13-kV p-i-n diode, 15-kV p-channel IGBT, and 16-kV flip-type n-channel implantation and epitaxial IGBT with a low differential specific on-resistance (Rdiff,on). It was revealed that a power module fabricated using a nanotech resin, Si3N4 ceramic substrate, and W base plate was suitable for ultrahigh voltage and high temperature. A switching test was carried out using a clamped inductive load circuit, which indicated that the energy loss of a circuit with ultrahigh-voltage SiC devices is lower than that of Si devices.
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insulated gate bipolar transistors,p-i-n diodes,power semiconductor devices,silicon compounds,wide band gap semiconductors,clamped inductive load circuit,differential specific on-resistance,epitaxial igbt,flip-type n-channel implantation,insulated-gate bipolar transistors,nanotech resin,p-channel igbt,power module,switching test,ultrahigh-voltage devices,voltage 13 kv,voltage 15 kv,voltage 16 kv,n-type insulated-gate bipolar transistors (igbts),p-i-n,p-type igbts,package technology,silicon carbide (sic),ultrahigh voltage,annealing,logic gates
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