Environment dependence of analog matching and design-process optimization on a 28LP SoC technology for smart mobile devices

Advanced Semiconductor Manufacturing Conference(2014)

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摘要
Mismatch of analog circuits designed for mobile devices are studied with nanoprobing, pattern density, and inline monitoring using a 28LP SoC technology. Active layer density was found to be the root cause of high mismatch variation. Design guidelines, along with an interleaved design, are shown to improve mismatch for a given process flow.
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关键词
analogue circuits,circuit optimisation,integrated circuit design,low-power electronics,smart phones,system-on-chip,28lp soc technology,active layer density,analog circuits,analog matching,design guidelines,design-process optimization,environment dependence,inline monitoring,interleaved design,mismatch variation,nanoprobing,pattern density,process flow,smart mobile devices,dfm,system on chip,design optimization,manufacturing process,temperature measurement,low power electronics,annealing,layout,resistors
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