Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

Sanming Hu,Cheng Jin,Hongyu Li,Rui Li,Ser Choong Chong,Ming Chinq Jong,Eva Leong Ching Wai,Keng Hwa Teo,Minkyu Je, Patrick G Q Lo

Electron Devices, IEEE Transactions （2014）

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摘要

This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only.

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关键词

cmos integrated circuits,equivalent circuits,integrated circuit design,three-dimensional integrated circuits,3d ic,3d chip,3d integrated circuit,cmos dies,electrical method,equivalent circuit,microbumps,open circuits,organic substrate,parallel resistor chain,printed circuit board,simple resistor chain,size 65 nm,through-silicon vias,3-d integrated circuit (3-d ic),location,open,through silicon via (tsv),through silicon via (tsv).,resistors,resistance

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