Aluminium sputter deposition onto polyimide-coated substrates

Shigeru Kobayashi,Akira Okamoto,Yasunori Narizuka,Toshiyuki Arai, Akihiro Kenmotsu,Minoru Tanaka, Yoshinao Kawasaki

Las Vegas, NV（1990）

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摘要

An aluminium deposition process onto PIQ (polyimide isoindroqui hazoline-dione: Hitachi Chemical)-coated substrates was developed for a continuous cassette-to-cassette sputtering machine. The baking process of the substrates in vacuum was studied for various film thicknesses and heating rates. PIQ releases water vapor upon heating in a vacuum and gives a maximum release rate at around 120°C with a heating rate of 56°C/min. PIQ was found to contain 0.5 wt% water vapor in a clean-room environment. PIQ-coated substrates were found to have a sufficiently stable and high emissivity, and the infrared thermometer was successfully applied. The double electromagnet sputtering cathode has been employed to ensure uniformity and long target life. Aluminium film characterization was done for the specularity, microstructure, and thermal stress

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关键词

vlsi,aluminium,dielectric thin films,integrated circuit technology,metallisation,organic insulating materials,polymer films,sputter deposition,al sputter deposition,hitachi chemical,piq-coated substrates,baking process,clean-room environment,continuous cassette-to-cassette sputtering machine,double electromagnet sputtering cathode,film thicknesses,heating rates,long target life,microstructure,multilevel metallisation dielectrics,polyimide interlayer dielectric,polyimide isoindroqui hazoline-dione,polyimide-coated substrates,releases water vapor upon heating,specularity,thermal stress,aluminum,microstructures,electromagnets,water vapor,chemical processes,cathodes,infrared,sputtering

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