Device Simulation For Advanced Si-1-Xgexhbts

Minneapolis, MN(2001)

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摘要
Accurate simulations of advanced Si1-x Ge-x heterojunction bipolar transistors involve a range of different problems, whose solution demands different numerical approaches. In our simulation methodology, the complexity of each numerical method matches that of the problem at hand. We employ a 2D drift-diffusion solver for dc and ac characteristics, ID full-band Monte Carlo for transport in the base-collector high electric field region, and a 3D heat-transport solver for device selfheating. Extrinsic parasitics are introduced as lumped circuit elements whose values are obtained from measurements. This approach not only reduces the computational cost of the simulation, but it also helps to differentiate the relevance of the intrinsic and extrinsic device parameters. Such information can then be used for device optimization and for guidance in generating compact models.
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关键词
ge-si alloys,monte carlo methods,carrier mobility,heterojunction bipolar transistors,semiconductor device models,semiconductor materials,thermal resistance,1d full-band monte carlo,2d drift-diffusion solver,3d heat-transport solver,si1-xgex,si1-xgex hbts,ac characteristics,base-collector high electric field region,compact models,computational cost,cut-off frequency,dc characteristics,device optimization,device self-heating,device simulation,electron velocity profile,extrinsic parasitics,lumped circuit elements,maximum oscillation frequency,numerical method complexity,simulation methodology,monte carlo,heterojunction bipolar transistor,numerical method,electric field
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