Chip ultra-thinning and embedding technology for autonomous sensors array applications

P R Muller,Francois Iker,Philippe Soussan,Eric Beyne,G Carchon,Walter De Raedt

San Diego, CA（2009）

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摘要

The purpose of the article is to present the integration of embedded dies and passives components both being integrated on a high resistivity silicon (HRSi) substrate. Integrated dies are thinned down to a 17 mum thickness and embedded with their associated passives.

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chip scale packaging,radiofrequency identification,radiofrequency integrated circuits,si,autonomous sensors array,embedding,high resistivity silicon substrate,size 17 mum,ultrathinning,probability density function,sensor array,assembly,metals,etching,electrodes,copper,electronic components,chip,glass,lithography,resistors,data mining,conductivity,silicon

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