Monolithic integration of InP-based waveguide photodiodes with MIM capacitors for compact coherent receiver

Indium Phosphide and Related Materials(2013)

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摘要
We have demonstrated monolithic integration of InP-based waveguide photodiodes (WGPDs) with metal-insulator-metal (MIM) capacitors using the 3-inch diameter wafer process. The uniformity of MIM capacitance and the dielectric breakdown voltage of the capacitor obtained within +/-2 % and over 100 V, respectively. The dark current of WGPDs was less than 3 nA at a reverse voltage of 1.6 V, owing to the InP passivation structure formed on WGPD surface. The fabricated integrated chip size was 2.0 mm × 5.1 mm. These results indicate that integrated WGPDs can provide both smaller and easier assembly for the compact coherent receiver.
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iii-v semiconductors,mim devices,capacitors,indium compounds,monolithic integrated circuits,optical receivers,photodiodes,wide band gap semiconductors,inp,mim capacitors,wgpd surface,dielectric breakdown voltage,metal-insulator-metal capacitors,monolithic integration,passivation structure,size 3 in,voltage 1.6 v,wafer process,waveguide photodiodes,capacitor,coherent receiver,waveguide photodiode,electrodes,optical waveguides
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