TSV multi-signal connection compact modeling

Essam Mina,Shlomo Shlafman,Rachel Gordin,Benny Sheinman,Danny Elad

Microwaves, Communications, Antennas and Electronics Systems（2013）

引用 0|浏览4

暂无评分

摘要

This paper presents wideband circuit level compact models of through-silicon via (TSV) multi-signal connections within an array. The models were developed for time and frequency domain characterization of periodic TSV array patterns, including crosstalk evaluation. A frequency dependent silicon substrate induced dispersion and loss effects are considered, as well as the skin and proximity effects. The models were verified by EM simulations up to 30 GHz.

查看译文

关键词

crosstalk,frequency-domain analysis,three-dimensional integrated circuits,time-domain analysis,em simulations,si,tsv multisignal connection,compact modeling,crosstalk evaluation,dispersion effect,frequency domain characterization,loss effect,periodic tsv array patterns,proximity effect,silicon substrate,skin effect,through-silicon via,time domain characterization,wideband circuit level compact models,compact models,multi-signal connection,three-dimensional integration (3di),through-silicon via (tsv),frequency domain analysis

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要