Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform

F Boeuf,S Cremer,Enrico Temporiti,M Fere,M Shaw,N Vulliet,B Orlando,D Ristoiu,A Farcy,Thierry Pinguet,Attila Mekis,Gianlorenzo Masini,Peng Sun,Yun Chi, H Petiton,S Jan, J R Manouvrier,C Baudot,P Le Maitre,Jf Carpentier, L Salager, M Traldi,L Maggi, D Rigamonti, C Zaccherini, C Elemi, B Sautreuil, L Verga

Optical Fiber Communications Conference and Exhibition（2015）

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摘要

A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.

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关键词

semiconductors,decision support systems,microelectronics,copper,internet of things

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