38 GHz driver and power amplifier MMICs in surface mount packages
Microwave Integrated Circuits Conference(2012)
摘要
The first pass design and performance of two driver and power amplifiers in SMD packages for 37-40 GHz radios is presented. Both circuits were designed and fabricated using 6-inch 0.15-μm GaAs PHEMT technology. While occupying a chip area of only 1.6 mm2, the QFN 3×3 mm driver amplifier achieves a small signal gain of more than 21 dB over the 35- to 40 GHz frequency band. At 4 V and 250 mA bias, this packaged driver also has a P1dB of +18.5 dBm, +21-dBm saturated output power, and +32 dBm OIP3. To maximize the overall efficiency, the companion power amplifier has been co-designed with a custom air cavity 7×7 mm laminate package. At a bias point of 4 V and 1 A, this 4-stage packaged MMIC exhibits a small signal gain over 25 dB in the 37-40 GHz band, with a P1dB > +28-dBm and +30-dBm saturated output power. Its linearity performance is also excellent with +38-dBm OIP3. The PA also integrates an on-chip temperature compensated power detector, with a record dynamic range of more than 30 dB. For rugged and reliable operation, on-chip EOS and ESD protection is also discussed and implemented on these MMICs.
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关键词
mmic amplifiers,driver circuits,electrostatic discharge,high electron mobility transistors,millimetre wave power amplifiers,surface mount technology,4-stage packaged mmic,esd protection,gaas,phemt technology,qfn driver amplifier,smd packages,current 1 a,current 250 ma,frequency 37 ghz to 40 ghz,on-chip eos,on-chip temperature compensated power detector,power amplifier mmic,size 0.15 mum,size 6 inch,surface mount packages,voltage 4 v,amplifiers,mmics,packaging
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