Towards alternative technologies for fine pitch interconnects

J P Colonna,R Segaud,Francois Marion,M Volpert,A Garnier,L Di Cioccio, Y Beillard,S Mermoz,F De Crecy,C Laviron,S Cheramy

Electronic Components and Technology Conference（2013）

引用 5|浏览79

暂无评分

摘要

This study focuses on alternative technologies for fine pitch 3D interconnect. These technologies are: μ-inserts (insertion of a nickel cylinder in Aluminium pad), μ-tubes (insertion of a hard tube in Aluminium pad), Transient Liquid Phase (TLP) bonding (whole solder reacts to form intermetallic compound) and copper direct bonding. In the first part the process flow is described. Then electrical performances are presented, including a comparison of the Kelvin resistance for each technology. The next part presents reliability considerations, where the failure modes and the weaknesses of each interconnect technologies are described. The mechanical impact of insertion technologies is also studied.

查看译文

关键词

aluminium,bonding processes,integrated circuit interconnections,integrated circuit reliability,solders,μ-tubes,al,kelvin resistance,tlp bonding,aluminium pad,fine pitch 3d interconnect,interconnect technology,intermetallic compound,nickel cylinder,reliability,solder,transient liquid phase,aluminum,copper,resistance,assembly,kelvin

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要