Ultra-thin atomic layer deposition films for corrosion resistance

A J Haemmerli,Joseph C Doll,J Provine,Roger T Howe,David Goldhabergordon,Beth L Pruitt

Solid-State Sensors, Actuators and Microsystems（2013）

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摘要

We evaluated the chemical and electrochemical corrosion resistance of ultra-thin films deposited via atomic layer deposition (ALD) for potential wafer-scale passivation of biomedical microdevices. A variety of ALD coatings can be deposited conformally on metal or silicon surfaces at low temperature. We were able to protect aluminum electrodes against corrosion in ionic media with a voltage stress of 1V for 200 hours using a double ALD film stack of 5nm Al2O3 and 5nm HfO2.

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关键词

alumina,atomic layer deposition,biomems,corrosion resistance,dielectric thin films,hafnium compounds,passivation,wafer level packaging,zirconium compounds,ald coatings,al2o3,hfo2,si,zro2,aluminum electrodes,biomedical microdevices,electrochemical corrosion resistance,metal surfaces,silicon surfaces,size 5 nm,time 200 hour,ultrathin atomic layer deposition films,voltage 1 v,wafer-scale passivation,ald,mems,biocompatible,corrosion,packaging,thin film,films,electrodes

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