Unipolar resistive switching behaviors and mechanisms in an annealed Ni/ZrO2/TaN memory device

The effects of Ni/ZrO2/TaN resistive switching memory devices without and with a 400 degrees C annealing process on switching properties are investigated. The devices exhibit unipolar resistive switching behaviors with low set and reset voltages because of a large amount of Ni diffusion with no reaction with ZrO2 after the annealing process, which is confirmed by ToF-SIMS and XPS analyses. A physical model based on a Ni filament is constructed to explain such phenomena. The device that undergoes the 400 degrees C annealing process exhibits an excellent endurance of more than 1.5 x 10(4) cycles. The improvement can be attributed to the enhancement of oxygen ion migration along grain boundaries, which result in less oxygen ion consumption during the reset process. The device also performs good retention up to 10(5) s at 150 degrees C. Therefore, it has great potential for high-density nonvolatile memory applications.