Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Die shift problem that arises during the wafer molding process in embedded micro wafer level package fabrication was systematically analyzed and solution strategies were developed. A methodology to measure die shift was developed and applied to create maps of die shift on an 8 inch wafer. A total of 256 dies were embedded in an 8 inch mold compound wafer using compression molding. Thermal and cure...