Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds

M Mccracken,Yusuke Koda,H J Kim,Michael Mayer,John Persic,J S Hwang,Jeongtak Moon

IEEE Transactions on Components, Packaging and Manufacturing Technology（2013）

引用 13|浏览5

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摘要

The application of an alternative method of bond monitoring during high-temperature aging is reported using a custom made test chip with piezoresistive integrated CMOS microsensors located around test bond pads. The sensor detects radial stresses originating from the bond pad and can resolve changes because of intermetallic compound (IMC) formation, voiding, or crack formation at the bond interfac...

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关键词

Aging,Stress,Nondestructive testing,Intermetallic,Integrated circuits,Microsensors,Reliability

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