A Fully Modular 1-Mu-M Cmos Technology Incorporating Eeprom, Eprom And Interpoly Capacitors

This paper will describe a modular technology which uses a novel integration scheme to include double poly EEPROM, single poly EPROM and an interpoly capacitor. The single poly EPROM [1] has been adopted to simplify the integration issues; the three modules (EEPROM, EPROM and A/D) can be combined in any combination without affecting their electrical performance.