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Short-Flow Test Chip Utilizing Fast Testing For Defect Density Monitoring In 45nm

2008 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, CONFERENCE PROCEEDINGS(2008)

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摘要
A comprehensive 45nm short-flow test chip was designed and is currently used to improve defect-limited yield. In a novel development to reduce test time, the DC test structures are tested in parallel mode on a functional test platform, resulting in a 5x reduction in test time over conventional parametric testing. The large critical area enables accurate measurement of defect densities down to the ppb-level, while the reduced cycle time of this short-flow test chip makes it an excellent routine defect monitor as well as a test vehicle for evaluating process changes.
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关键词
yield enhancement,defect-limited yield,process characterization,parallel-test
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