Głębokie centra defektowe w krzemie o bardzo wysokiej rezystywności

Materiały Elektroniczne(2014)

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摘要
The paper presents the unique results of the resistivity distribution and the distribution of the properties and concentrations of defect centers on a silicon wafer with a radius of R = 75 mm originating from a high-purity FZ single crystal. The electronic properties and concentrations of the defect centers have been studied by high resolution photoindu- ced transient spectroscopy (HRPITS). To determine the time constants of the exponential components in the photocurrent relaxation waveforms measured in the temperature range of 250 - 320 K we have used an advanced numerical procedure based on the inverse Laplace transformation. In the wafer central region, with the resistivity of ~ 6.0 × 10 4 Ωcm, three traps with the activation energies of 420 meV, 460 meV and 480 meV have been found. In the near edge-region of the wafer, with the resistivity of ~ 3.0 × 10 4 Ωcm, apart from the traps present in the central region, a trap with the activation energy of
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